pine alpha cleaning
Abstract: Pine Alpha AK225AES AK-225AES ST-100S
Text: HANDLING PRECAUTIONS • Soldering Conditions Please refer to each product to see if it’s compatible with lead-free soldering. Conventional Soldering Conditions SOLDERING IRON DIP SOLDERING REFLOW SOLDERING Iron Tip Temperature: 300°C Max. 30W Max. Soldering Time: 3 Seconds Max.
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AK-225AES
ST-100S
AK225AES
AAR121and
AAA121)
pine alpha cleaning
Pine Alpha
AK-225AES
ST-100S
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T200
Abstract: T230 dip electrolytic capacitor
Text: SOLDERING CONDITIONS ALUMINUM ELECTROLYTIC CAPACITORS • Recommended soldering conditions ● Chip type aluminum electrolytic capacitors Lead free (1) Methods See the following Methods Advisability Reflow soldering Soldering iron ○ Flow soldering
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2006/2007E
2010/2011E
T200
T230
dip electrolytic capacitor
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washing machine circuit diagram
Abstract: washing machine circuit circuit diagram of toshiba washing machine washing machine washing machine electric circuit WASHING machine controller rohm mcr mvr21 Ultrasonic washing washing machine control
Text: Soldering conditions Resistors Soldering conditions for Resistors Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended conditions for reflow soldering 2/5 Recommended conditions for flow soldering 2/5 Recommended conditions for manual soldering 2/5
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"Solid State Relay"
Abstract: No abstract text available
Text: • Solid State Relay : Lead-free part soldering conditions DIP6pin SMD / DIP8pin(SMD) ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time.
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phototriac
Abstract: No abstract text available
Text: • Phototriaccoupler : Lead-free part soldering conditions SOP4pin ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice.
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TSOP8
Abstract: liquid (WATER) Level Controller TOSHIBA GLASS MOLD water level control circuit diagram water level controller circuit diagram 750H ST-100S ROHM USD alpha 400 circuit diagrams pine alpha st-100s arakawa chemical
Text: Soldering conditions Leaded type Diodes Condition of soldering for Leaded type Diodes Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of soldering dip 2/4 Condition of hand soldering 2/4 Tolerance range for heatproof of soldering 2/4
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SOP4
Abstract: No abstract text available
Text: • Photocoupler : Lead-free part soldering conditions DIP4pin SMD / DIP6pin(SMD) / DIP8pin(SMD) / DIP16pin(SMD) ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time.
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DIP16pin
SOP4
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M705-GRN360-K2V
Abstract: M705-GRN360-K2-V solder paste M705-GRN360-K2-V M705-GRN-360-K2-V M705-GRN360 1SS376 1SS355 1SS380 750H ST-100S
Text: Soldering conditions Surface mounted glass Diodes Condition of soldering for Surface mounted glass Diodes Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/5 Recommended condition of flow soldering 2/5 Condition of hand soldering
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washing machine circuit diagram
Abstract: circuit diagram of toshiba washing machine washing machine electric circuit washing machine circuit washing machine toshiba 750H ESR10 MCR006 MCR01 MCR03
Text: Soldering conditions Resistors Soldering condition for Resistors Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/4 Recommended condition of flow soldering 2/4 Recommended condition of hand soldering 2/4 Recommended condition of washing
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M705-GRN360-K2-V
Abstract: M705-GRN360-K2V M705-GRN360 TOSHIBA GLASS MOLD M705-GRN-360-K2-V solder paste M705-GRN360-K2-V 1SS376 M705-GRN360-K2 1SS355 1SS380
Text: Soldering conditions Surface mounted mold Diodes Condition of soldering for Surface mounted mold Diodes Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/5 Recommended condition of flow soldering 2/5 Condition of hand soldering
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M705-GRN360-K2V
Abstract: M705-GRN360-K2-V solder paste M705-GRN360-K2-V M705-GRN-360-K2-V 1SS376 1SS355 UMD2 ROHM rohm surface mounted transistor series VMD2 M705 water level controller circuit diagram
Text: Soldering conditions Surface mounted glass Diodes Condition of soldering for Surface mounted glass Diodes Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/5 Recommended condition of flow soldering 2/5 Condition of hand soldering
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Untitled
Abstract: No abstract text available
Text: 22355 Abracon CORX 2-29.qxd 3/6/00 6:56 AM Page 69 CRYSTALS AND OSCILLATORS RECOMMENDED SOLDER REFLOW TYPICAL SOLDERING CONDITIONS FOR CRYSTALS AND OSCILLATORS SOLDERING METHOD SOLDERING IRON SOLDERING DIP Pre-heat REFLOW Reflow SOLDERING CONDITIONS TEMPERATURE
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pine alpha st-100s arakawa chemical
Abstract: 2SB1051K tssop8 package 750H ST-100S
Text: Soldering conditions Surface mount type Transistors Condition of soldering for Surface mount type Transistors Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/4 Recommended condition of flow soldering 2/4 Condition of hand soldering
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2sc5083
Abstract: TO220FN water level control circuit diagram to126 to126 case TO220SD water level controller circuit diagram liquid (WATER) Level Controller TO126 package TO126 transistor
Text: Soldering conditions Leaded type Transistors Condition of soldering for Leaded type Transistors Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of flow soldering 2/3 Condition of hand soldering 2/3 Tolerance range for heatproof of soldering
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M705-GRN360-K2V
Abstract: M705-GRN360 solder paste M705-GRN360-K2-V TOSHIBA GLASS MOLD 1SS376 3pin surface mount transistor M705 water level control circuit diagram M705-GRN360-K2-V C 245 B
Text: Soldering conditions Surface mounted mold Diodes Condition of soldering for Surface mounted mold Diodes Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/5 Recommended condition of flow soldering 2/5 Condition of hand soldering
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M705-GRN360-K2V
Abstract: M705-GRN360-K2-V M705-GRN-360-K2-V 1SS376 M705-GRN360 1SS355 UMD2 ROHM 1SS355 1SS380 750H ST-100S
Text: Soldering conditions Surface mounted mold Diodes Condition of soldering for Surface mounted mold Diodes Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/5 Recommended condition of flow soldering 2/5 Condition of hand soldering
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WS60-00-1
Abstract: Chlorine
Text: RECOMMENDED SOLDERING CONDITIONS OF WAVE SOLDERING WS60-00-1 The following is recommended soldering conditions of wave soldering Maximum temperature (Solder temperature) Time at maximum temperature Preheating temperature (Package’s surface temperature)
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WS60-00-1)
WS60-00-1SSD-A-M0034-4
WS60-00-1
Chlorine
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Untitled
Abstract: No abstract text available
Text: Surface Mount Resistors Recommended Soldering Conditions • Recommended Soldering Conditions Recommendations and precautions are described below. ● Rectagular Type ● Recommended soldering conditions for reflow • Reflow soldering shall be performed a maximum of
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Untitled
Abstract: No abstract text available
Text: SURFACE MOUNT INDUCTORS SOLDERING SOLDERING METHOD 2. Soldering Conditions Chip coils can be flow or reflow soldered. LQS33N and LQP21A/31A should be reflow soldered only. Please contact Murata Electronics regarding other soldering methods. RECOMMENDED SOLDERING CONDITIONS
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LQS33N
LQP21A/31A
LQS33
LQP11A
LQP21A
LQP31A
LQN21A
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Untitled
Abstract: No abstract text available
Text: CERAMIC MICROWAVE FILTERS SOLDERING & PACKAGING REFLOW SOLDERING CONDITIONS Note: The maximum tem perature and time of soldering is shown in Figure 1. The soldering condition should be within the indicated line area. In case the soldering is repeated, the
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57P002BLLA
178mm
330mm
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Untitled
Abstract: No abstract text available
Text: Soldering Conditions Recommended Pattern Pattern Dimensions Unit: mm LL2012-F Series a b c Flow Soldering 1.0-1.4 0.8 - 1.2 0.8 ~ 1.0 Reflow Soldering 1.0- 1.2 0 .6 - 1.0 0.8 - 1.2 LL1608-F/FH Series Flow Soldering 0.8 - 1.0 0.8 - 1.0 0.6 - 0.8 Reflow Soldering
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LL2012-F
LL1608-F/FH
LL1005-FH
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JIS C7021
Abstract: JIS-C-7021 JIS C7021 B-10 JIS C 7021B-10 C7021A
Text: • Soldering Instructions Iron soldering with 1.5mm iron tip Dip and flow soldering Types Temperature of the soldering bath Maximum soldering time Distance from solder joint to case Temperature of soldering iron Maximum soldering time Distance from solder joint
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10OOhrs
1000hrs
p7021
C7021
C--25
30min-
30min
C7021
JIS C7021
JIS-C-7021
JIS C7021 B-10
JIS C 7021B-10
C7021A
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DFC21R57P002HHA
Abstract: No abstract text available
Text: CERAMIC MICROWAVE FILTERS SOLDERING & PACKAGING tn u ffn tn /kA cm tcr in Gec&m/& REFLOW SOLDERING CONDITIONS The maximum temperature and time of soldering is shown in Figure 1. The soldering condition should be within the indicated line area. In case the soldering is repeated, the
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DFC21R57P002HHA
TA2210
TypeTA2110
178mm
TA2210:
330mm
CG01-H
DFC21R57P002HHA
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DFC21R57P002HHA
Abstract: DFc21r57
Text: CERAMIC MICROWAVE FILTERS SOLDERING & PACKAGING REFLOW SOLDERING CONDITIONS The maximum temperature and time of soldering is shown in Figure 1. The soldering condition should be within the indicated line area. In case the soldering is repeated, the maximum time in Figure 1 should be accumulated time.
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DFC21R57P002HHA
TA2210
TypeTA2110:
178mm
TA2210:
330mm
CG01-J
DFC21R57P002HHA
DFc21r57
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