Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SOL 20 PACKAGE Search Results

    SOL 20 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    SOL 20 PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    231-75PAB-14V

    Abstract: 251-62AB 216-40CTT wakefield engineering 67 c 945 p 239 c MO-184 REF-10 Wakefield Engineering EIA-481-3 MS-013
    Text: BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS D 2PAK, TO-220, SOL-20 Surface Mount Heat Sinks 216 SERIES Standard P/N 216-40CT 216-40CTT 216-40CTR Height Above PC Board .390 in. 9.9 .390 in. (9.9) .390 in. (9.9) Package Format Bulk Tube


    Original     		PDF O-220, SOL-20 216-40CT 216-40CTT 216-40CTR LP-225 231-75PAB-14V 251-62AB 216-40CTT wakefield engineering 67 c 945 p 239 c MO-184 REF-10 Wakefield Engineering EIA-481-3 MS-013

    Untitled

    Abstract: No abstract text available
    Text: CCD board level camera OEutM ion Sol C10990 series SPECTRAL RESPONSE * This is typical, not guaranteed. 60 C10990-904 C10990-942 Quantum efficiency % C10990-901, -942 50 C10990-904 40 30 20 10 200 300 400 500 600 700 800 900 1000 1100 1200 Wavelength (nm)


    Original     		PDF C10990 C10990-904 C10990-942 C10990-901, C10990-901 C10990-942) B1201 SCAS0035E06

    ebonol

    Abstract: 215CB 647-25ABP 217-36CT6 230-75AB-10 MO-169 205-CB 281-2AB 204CB 1134 sot dm
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,


    Original     		PDF O-220, OT-223, SOL-20 ebonol 215CB 647-25ABP 217-36CT6 230-75AB-10 MO-169 205-CB 281-2AB 204CB 1134 sot dm

    217-36CTT6

    Abstract: ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,


    Original     		PDF O-220, OT-223, SOL-20 217-36CTT6 ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5

    ebonol

    Abstract: 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,


    Original     		PDF O-220, OT-223, SOL-20 ebonol 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB

    ebonol

    Abstract: 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,


    Original     		PDF O-220, OT-223, SOL-20 ebonol 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb

    Untitled

    Abstract: No abstract text available
    Text: BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'


    Original     		PDF O-220, OT-223, SOL-20 217-36CTR6 1-866-9-OHMITE 217-36CTT6 O-263 MO-169

    N10015

    Abstract: 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'


    Original     		PDF O-220, OT-223, SOL-20 292-AB 292-AB N10015 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01

    ebonol

    Abstract: abe sot-223 217-36CTRE6 217-36CT6 MO-169
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'


    Original     		PDF O-220, OT-223, SOL-20 ebonol abe sot-223 217-36CTRE6 217-36CT6 MO-169

    ebonol

    Abstract: 637-10ABEP WTS001 MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions
    Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'


    Original     		PDF WTS001 p1-25 O-220, OT-223, SOL-20 ebonol 637-10ABEP MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions

    Untitled

    Abstract: No abstract text available
    Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'


    Original     		PDF WTS001 p1-25 O-220, OT-223, SOL-20

    SOL package

    Abstract: array, sol 20 Package 28719
    Text: ASRA Vishay Beyschlag Application Specific Resistor Array FEATURES ASRA stands for Application Specific Resistor Array and is supplied in a SO-L package “Small Outline” . Gull wing shaped leads and the dimensions of the package are well known from standard integrated circuits.


    Original     		PDF 08-Apr-05 SOL package array, sol 20 Package 28719

    Untitled

    Abstract: No abstract text available
    Text: ftm D U IT Grounding Connectors Typesspfi andspf2 Bronze Service Post Connectors Type SPF1 _ Dimensions-lnches V Conductor Size Range Wire Diameter Range (In.) Stud Size SPF1-8-C #12 Sol.-#8 Str. .08 1-1 46 1/4-20 .50 Female-One Cable SPF1-7-C #10 Sol.—#7 Str.


    OCR Scan     		PDF SPF2-350-12 -350MCM SPF2-500-12 -500MCM

    Untitled

    Abstract: No abstract text available
    Text: Signetics FAST74F381 Arithmetic Logic Unit FAST Products Product Specification TYPE TYPICAL PROPAGATION DELAY 74F381 TYPICAL SUPPLY CURRENT TOTAL 6.5 ns 59mA ORDERING INFORMATION 20-Pin Plastic DIP N74F381N 20-Pin Plastic SOL N74F381D INPUT AND OUTPUT LOADING AND FAN-OUT TABLE


    OCR Scan     		PDF FAST74F381 74F381 20-Pin N74F381N N74F381D 500ns

    Xr 1075

    Abstract: SFNF123 BD 266 S
    Text: / 836860 2 SOL ITRON D E VI CE S TOC 02014 INC SFNF123 ' " \ T-39-09 SWITCH MOS 70 tEl S3tatDa 0002014 1 • PACKAGE TO-39 POWER MOS MAXIMUM RATINGS VDS S tg V Power Dissipation 0 Tc«25°C 20 W Drain Current, Clamped Inductive 20 A Voltage, Gate-to-Source


    OCR Scan     		PDF T-39-09 SFNF123 5M6-24UNF-2A P06fTKMOF eA03AT Xr 1075 SFNF123 BD 266 S

    Untitled

    Abstract: No abstract text available
    Text: THICK FILM SURFACE MOUNTED WIDE BODY 7.49MM MOLDED SOL STYLE / 16 AND 20 PINS • Standard E.I.A. package compatible with automatic placement equipment ■ Compliant leads to reduce solder joint fatiguing ■ Tape and reel packaging standard (see page 114 for dimensions)


    OCR Scan     		PDF 4400P 100ppm/Â 250ppm/Â 50ppm/Â

    Untitled

    Abstract: No abstract text available
    Text: SURFACE MOUNTED RESISTOR NETWORK WIDE BODY .300 INCH WIDE MOLDED SOL STYLE / 16 AND 20 PINS • JEDEC package compatible with automatic placement equipment ■ Compliant leads to reduce solder joint fatiguing ■ High temperature design suitable for all popular soldering techniques


    OCR Scan     		PDF 4400P 50ohms 100ppm/Â 250ppm/Â

    Untitled

    Abstract: No abstract text available
    Text: THIN FILM RESISTOR NETWORK SOL WIDE BODY GULL WING/ 16 AND 20 PIN • Increased lead density ■ Custom circuits available per factory Model 4400T Resistor Networks Electrical Characteristics Resistance Range. 10 to 150K ohms Resistance Tolerance . ±0.1 %, ±0.5%, ±1 %


    OCR Scan     		PDF 4400T 100ppm/Â 50ppm/Â 25ppm/Â

    Untitled

    Abstract: No abstract text available
    Text: SURFACE MOUNTED RESISTOR NETWORK WIDE BODY .300 INCH WIDE MOLDED SOL-J STYLE / 16 AND 20 PINS • Board footprint identical to medium body (.220 wide) SOM gull wing ■ Compliant leads to reduce solder joint fatiguing ■ High temperature design suitable for all popular soldering techniques


    OCR Scan     		PDF 4400J 100ppm/Â 250ppm/Â

    sfnf423

    Abstract: No abstract text available
    Text: 8368602 SOL ITRON DEVICES SFNF423 70C 0 20 7 8 INC _ SWITCH MOS PACKAGE TO-39 ?o 0 r T-39-09 tE.|a3tat,Gg odosotis s F POWER MOS MAXIMUM RATINGS SYMBOL VDS XD XDM VGS PD XL TJ oper T stg UNITS PARAMETER Voltage, Drain to Source A Drain Current, Continuous @ Tc«25°C


    OCR Scan     		PDF T-39-09 SFNF423 5M6-24UNF-2A P06fTKM eA03AT sfnf423

    ipc sm 782

    Abstract: 4420p-002
    Text: THICK FILM SURFACE MOUNTED WIDE BODY 7.49MM MOLDED SOL STYLE / 16 AND 20 PINS • P ackage com patible with autom atic placem ent equipm ent ■ C om pliant leads to reduce solder joint fatiguing W ß P O U H N S ■ High tem perature lead attachm ent designed to withstand reflow


    OCR Scan     		PDF 4400P 50ohms 100ppm/ 250ppm/ 100ppm/V 50ppm/ ipc sm 782 4420p-002

    sfn065d

    Abstract: itron 406
    Text: 8368602 SOL ITRON DEVICES SFN065D INC 01990 SWITCH MOS PA CKA G E TO-3 IDM VGS PD XL T J oper T . stg UNITS Voltage, Drain to Source Drain Current, Clamped Inductive XDSS V 010 G fs VGS(th). IGSS C ISS CRSS coss ^d(on) t r td ( o f f ) Cf 16 W 20 A -55 to +150


    OCR Scan     		PDF T-39-11 SFN065D 5M6-24UNF-2A P06fTKM eA03AT sfn065d itron 406

    05683

    Abstract: 587H
    Text: T H IS COPY IS PROVIDED ON A RES TR IC TED B A S IS AND IS NOT TO BE USED IN ANY WAY DETRIM ENTAL TO THE Listed os o PRESSURE -TYPE wire connector on the Pol lowing sol id and/or stranded wire comb ¡notions Cu-Cu . 2 #14 w/1 or 2 #16 4 to 6 #22 5 # 18 w/ #20


    OCR Scan     		PDF CI221* A41636 05683 587H

    Untitled

    Abstract: No abstract text available
    Text: ANALOG DEVICES Programmable, Isolated Voltage-to-Current Converter 1B22 FEATURES FUNCTIONAL BLOCK DIAGRAM I n t er n al I sol a t e d Lo op S u p p l y Dr i v e s 1000 SI Load Pin P r o g r a m m a b l e I n p u t s: 0 V t o +5 V or 0 V t o +10 V Pin Program m able O u t p u t s : 4 to 20 m A or 0 to 20 m A


    OCR Scan     		PDF 12-bit AD7245