SOCKET S1 REFLOW PROFILE Search Results

"socket s1"

Abstract: socket s1 amd 638 pin AMD socket s1 638 pin micro PGA socket s1 REFLOW 638-Pin Cu-194 socket s1 Advanced Micro Devices amd socket s1 mechanical
Contextual Info: Low-Profile Socket S1 Design Specification Publication # 31839 Revision: 3.01 Issue Date: April 2007 Advanced Micro Devices 2007 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. “AMD” products. AMD makes no representations or

IR 30 S1

Abstract: plcc thru hole socket 32 PLCC plcc socket 84 PLCC 3m PLCCE-068-S1-TT plcc thru hole socket 20 socket s1 diode s1 77 PLCCE-044-S1-TT PLCCE044S1TT PLCCE-052-S1-TT
Contextual Info: 3M Chip Carrier Socket PLCCE Series 4-Row, Thru-hole S Low profile .200″ maximum height S Designed for automatic assembly S High temperature insulator compatible with IR reflow and wave soldering S Open frame allows visual inspection of solder joints

A7647

Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
Contextual Info: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package

socket s1 REFLOW PROFILE

Abstract: "0.35 mm pitch" socket s1 REFLOW AXT740124 AXT750124 AXT760124 AXT770124 AXT780124 AXT840124 F4S3
Contextual Info: AXT7, 8 NARROW PITCH 0.35 mm CONNECTORS F35S SERIES NARROW-PITCH FOR BOARD-TO-FPC CONNECTION FEATURES 1. Space-saving design (0.35 mm pitch) The footprint when mated is down approx. 15% from our existing F4S model (40 contacts), contributing to the functionality enhancement and size

Contextual Info: My Account C hange Tyco Electronics Se arch by Ke yword or Part # Products Documentation Resources My Account Customer Support Home > Products > By Type > Socket/C ard Products > Product Feature Selector > Product Details 1-1903401-2 Product Details Live Product Chat

Contextual Info: My Account C hange Tyco Electronics Se arch by Ke yword or Part # Products Documentation Resources My Account Customer Support Home > Products > By Type > Socket/C ard Products > Product Feature Selector > Product Details 1-1903401-5 Product Details Live Product Chat

Contextual Info: My Account C hange Tyco Electronics Se arch by Ke yword or Part # Products Documentation Resources My Account Customer Support Home > Products > By Type > Socket/C ard Products > Product Feature Selector > Product Details 4-1903401-2 Product Details Live Product Chat

Contextual Info: My Account C hange Tyco Electronics Se arch by Ke yword or Part # Products Documentation Resources My Account Customer Support Home > Products > By Type > Socket/C ard Products > Product Feature Selector > Product Details 4-1903401-5 Product Details Live Product Chat

Contextual Info: AXT7, 8 For board-to-FPC F35S Series Narrow pitch connectors 0.35mm pitch FEATURES 1. Space-saving (0.35 mm pitch) When mated, the footprint is reduced by approx. 12% from F4S series (40 pin contacts). Suction face 0.8mm m 6m 2. m 4m 3. Socket Header 3.4

40 pin zif socket

Abstract: socket s1 SOLDER PROFILE amp micro pga socket amp pga socket socket S1 SH S1 94V-0 socket 615-PIN socket s1 REFLOW PROFILE socket zif M100
Contextual Info: 495-PIN AND 615-PIN MICRO-PGA ZIF SOCKET DESIGN SPECIFICATION Application Note October 5, 1999 Order Number: 245284-001 THIS DOCUMENT IS PROVIDED "AS IS" WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE

socket s1 REFLOW PROFILE

Contextual Info: 5.0V HCMOS/TTL COMPATIBLE SMD CRYSTAL CLOCK OSCILLATOR ASL Series Pb RoHS Compliant FEATURES: APPLICATIONS: • HCMOS and TTL compatible. • Available optional -40°C to 85°C extended temperature. • Tri-state Enable/Disable function. • IR reflow capable

Contextual Info: 5.0V HCMOS/TTL COMPATIBLE SMD CRYSTAL CLOCK OSCILLATOR ASL Series Pb RoHS Compliant FEATURES: APPLICATIONS: • HCMOS and TTL compatible. • Available optional -40°C to 85°C extended temperature. • Tri-state Enable/Disable function. • IR reflow capable

ic 6116 datasheet from texas instruments

Abstract: intel date code marking 28f160 SMT pitch roadmap intel 6116 uBGA device MARKing intel intel 04195 intel 28f160 SMT roadmap 28f800 56 pin csp process flow diagram
Contextual Info: D Comprehensive User’s Guide for µBGA* Packages 1998 NOTE: For the most current µBGA* package related information, please refer to Intel's Website at http://www.intel.com/design/flcomp/packdata Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any

schematic circuit adsl router part list

Abstract: networking SOCKET CONNECTION DIAGRAM socket s1 wiznet W3150A 0x052B CP QUICK CONNECT socket s1 REFLOW PROFILE 10BASET W3150A 0x0720
Contextual Info: TOP TCP/IP Offload Platform W3150A Datasheet (Ver. 1.0.2) W3150A Datasheet (Ver. 1.0.2) 2005 WIZnet Co., Inc. All Rights Reserved. For more information, visit our website at http://www.wiznet.co.kr HTU UTH 0/65 © Copyright 2005 WIZnet Co., Inc. All rights reserved.

W3100A

Abstract: W3150 10BASET socket s1 REFLOW PROFILE
Contextual Info: Ver. 1.0 W3150 Datasheet (Ver. 1.0) W3150 Datasheet 2005 WIZnet Co., Inc. All Rights Reserved. For more information, visit our website at http://www.wiznet.co.kr 0/59 © Copyright 2005 WIZnet Co., Inc. All rights reserved. Document History Information

networking SOCKET CONNECTION DIAGRAM

Abstract: W3100 W3150 W3100A 10BASET
Contextual Info: Ver. 1.0 Éíïëð Ü¿¬¿-¸»»¬ øÊ» ò ïòð÷ W3150 Datasheet 2005 WIZnet Co., Inc. All Rights Reserved. For more information, visit our website at http://www.wiznet.co.kr ðñëç © Copyright 2005 WIZnet Co., Inc. All rights reserved. Document History Information

W5100

Abstract: 0x04040
Contextual Info: W5100 Datasheet W5100 Datasheet Version 1.1.6 2008 WIZnet Co., Inc. All Rights Reserved. For more information, visit our website at http://www.wiznet.co.kr © Copyright 2008 WIZnet Co., Inc. All rights reserved. 1 W5100 Datasheet Document History Information

wiznet W5100

Abstract: W5100 LED IR for Tx, RX pair
Contextual Info: W5100 Datasheet W5100 Datasheet Version 1.1.5 2006 WIZnet Co., Inc. All Rights Reserved. For more information, visit our website at http://www.wiznet.co.kr © Copyright 2007 WIZnet Co., Inc. All rights reserved. 1 W5100 Datasheet Document History Information

schematic circuit adsl router part list

Abstract: W5100 two sockets wiznet W5100 reset socket S1 W5100 w5100 0.3 WIZNet udp w5100 0x052B MSS package socket s1 REFLOW PROFILE
Contextual Info: W5100 Datasheet W5100 Datasheet Version 1.0.1 2006 WIZnet Co., Inc. All Rights Reserved. For more information, visit our website at http://www.wiznet.co.kr © Copyright 2006 WIZnet Co., Inc. All rights reserved. 1 W5100 Datasheet Document History Information

W5100

Abstract: w5100 service manuAL wiznet W5100 socket s1 w5100 0.3 0x0428 WIZNet udp w5100 wiznet W5100 reset 0x052B socket s1 REFLOW PROFILE
Contextual Info: W5100 Datasheet W5100 Datasheet Version 1.2 2008 WIZnet Co., Inc. All Rights Reserved. For more information, visit our website at http://www.wiznet.co.kr © Copyright 2008-2009 WIZnet Co., Inc. All rights reserved. 1 W5100 Datasheet Document History Information

ppga package

Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
Contextual Info: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and

outline of the heat slug for JEDEC

Abstract: outline of the heat sink for JEDEC power led heat sink diode databook diode databook package outline heat slug for JEDEC intel pin grid array package ppga package datasheet CPGA large cavity Intel CPGA with 68 pins
Contextual Info: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and

Contextual Info: InvenSense Inc. 1197 Borregas Ave, Sunnyvale, CA 94089 U.S.A. Tel: +1 408 988-7339 Fax: +1 (408) 988-8104 Website: www.invensense.com Document Number: PS-ITG-3200A-00 Revision: 1.7 Release Date: 08/02/2011 ITG-3200 Product Specification Revision 1.7 ITG-3200 Product Specification

Contextual Info: InvenSense Inc. 1197 Borregas Ave, Sunnyvale, CA 94089 U.S.A. Tel: +1 408 988-7339 Fax: +1 (408) 988-8104 Website: www.invensense.com Document Number: PS-ITG-3200A-00 Revision: 1.6 Release Date: 06/06/2011 ITG-3200 Product Specification Revision 1.6 ITG-3200 Product Specification