SOCKET PROBES Search Results
SOCKET PROBES Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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CN-DSUB50SKT0-000 |
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Amphenol CN-DSUB50SKT0-000 D-Subminiature (DB50 Female D-Sub) Connector, 50-Position Socket Contacts, Solder-Cup Terminals | Datasheet | ||
CN-DSUBHD62SK-000 |
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Amphenol CN-DSUBHD62SK-000 High-Density D-Subminiature (HD62 Female D-Sub) Connector, 62-Position Socket Contacts, Solder-Cup Terminals | Datasheet | ||
CN-DSUB37SKT0-000 |
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Amphenol CN-DSUB37SKT0-000 D-Subminiature (DB37 Female D-Sub) Connector, 37-Position Socket Contacts, Solder-Cup Terminals | Datasheet | ||
CN-DSUBHD44SK-000 |
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Amphenol CN-DSUBHD44SK-000 High-Density D-Subminiature (HD44 Female D-Sub) Connector, 44-Position Socket Contacts, Solder-Cup Terminals | Datasheet | ||
CN-DSUB25SKT0-000 |
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Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals | Datasheet |
SOCKET PROBES Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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sn63pb37 solder wire
Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
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Intel Desktop Board lga775 circuit diagram
Abstract: intel Socket 775 VID VTT low voltage regulator am11 302356 lga775 power resistor H24 R8 ohm pentium4 socket AM2 INTEL lga775 power circuit AF27
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LGA775 Intel Desktop Board lga775 circuit diagram intel Socket 775 VID VTT low voltage regulator am11 302356 power resistor H24 R8 ohm pentium4 socket AM2 INTEL lga775 power circuit AF27 | |
40KHZ ULTRASONIC CLEANER CIRCUIT
Abstract: BGA reflow guide 1mm pitch zif BGA socket pogo pin cleaning "ultrasonic cleaner" 1mm pitch BGA socket 40KHz ultrasonic interface maintenance program ULTRASONIC bath CLEANER CIRCUIT ultrasonic probe
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lga775
Abstract: Intel Desktop Board lga775 circuit diagram low voltage regulator am11 intel Socket 775 VID VTT LGA775YP socket AM2 intel 945 desktop block diagram socket am2 am3 Socket AM3 AF27
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LGA775 RELGA775YP) LGA775YP Intel Desktop Board lga775 circuit diagram low voltage regulator am11 intel Socket 775 VID VTT LGA775YP socket AM2 intel 945 desktop block diagram socket am2 am3 Socket AM3 AF27 | |
size 0204
Abstract: QFN PCB Layout guide TL-TORQUEDRIVER-05 TL-TORQUEDRIVER-06
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1720GContextual Info: CSP/Ballnest Hybrid Socket FEATURES: • Any grid size available on 0.50mm pitch or larger. • Socket lid nests device into socket for a reliable connection. • Suitable for prototyping, test or burn-in of CSP, BGA, BGA and LGA devices. • ZIF style socket using Aries solderless, gold plated pressure mount Spring Probe. |
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075mm 1720G | |
Spring Pin Sockets
Abstract: p112a p115a p114a P-P139A P-P134A P-P115A P-P112A
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amp 827 578 3 pin
Abstract: tyco 827 578 Minifit Jr 1-row 179464-1 AMP 172233-1 794017-1 TOOLING 316769-1 MICRO MATE-N-LOK 794590-1 917782-1
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2002/95/EC, amp 827 578 3 pin tyco 827 578 Minifit Jr 1-row 179464-1 AMP 172233-1 794017-1 TOOLING 316769-1 MICRO MATE-N-LOK 794590-1 917782-1 | |
ul 94v-0 lcd display
Abstract: 94v-0 lcd Split System Air Conditioner washing machine motor 567067-1 connector cross reference 478 SOCKET PIN LAYOUT torque settings for metric cap head screws AMP 140 pin connector crimping positioners cross reference
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2002/95/EC, rest0-212-281-8181/2/3 ul 94v-0 lcd display 94v-0 lcd Split System Air Conditioner washing machine motor 567067-1 connector cross reference 478 SOCKET PIN LAYOUT torque settings for metric cap head screws AMP 140 pin connector crimping positioners cross reference | |
94v0 circuit board
Abstract: 755331-1
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config172167-1 94v0 circuit board 755331-1 | |
Tyco crimp tool 91510-1
Abstract: 466320-2 mate-n-lok 82181 raychem termination kit and splicing kit 172165-1 478 SOCKET PIN LAYOUT raychem catalog termination kit and splicing kit 350417 AMP mate-n-lok terminal crimp height 794612-3
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BGA reflow guide
Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile
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ADHESIVE GAP PAD
Abstract: TL-TORQUEDRIVER-05 TL-TORQUEDRIVER-06
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Contextual Info: YAMAICHI Socket Test Probes DESCRIPTION SPECIFICATIONS • Socket test probes are used in conj unction with your board tester to ensure the reliability of your burn-in or test board prior to test or burn-in process. • Probe head material is natural Ultem, unless |
OCR Scan |
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Contextual Info: Test Probes 2 mm System Type Tip diameter MPS 1 PRUEF 1610 FT Au PRUEF 1600 Au Miniature test probe for sampling very small measuring points. The stainless steel tip easily penetrates insulation and oxide layers. Socket connection through a 2 mm diameter gold-plated socket with contact |
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a96 laser diode
Abstract: MOTHERBOARD CIRCUIT diagram explained ZIF socket design guidelines 20 pin zif socket S8-95 surface mount transistor A48 surface mount transistor A103 surface mount transistor A61 surface mount transistor A55 A85A
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thomas shearContextual Info: . I c c SEPTEMBER 29,1993 TEST REPORT #93387 QUALIFICATION TESTING 2.0 mm SOCKET MMS SERIES SAMTEC CORPORATION APPROVED BY: THOMAS PEEL TEST PROGRAM MANAGER CONTECH RESEARCH, INC. E SEPTEMBER 29,1993 TEST REPORT #93387 QUALIFICATION TESTING 2.0 mm SOCKET MMS SERIES |
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NIS23 05-Ott-93 thomas shear | |
Contextual Info: High-Frequency Center Probe Test Socket for Devices up to 13mm Square FEATURES • For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices • Any pitch device on 0.30mm pitch or higher • Socket is easily mounted and removed to & from the PCB due to solderless pressure mount compression spring probes which are accurately located by two molded |
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p24011 | |
Contextual Info: CSP/MicroBGA Test & Burn-In Socket for Devices Up to 13mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. • Any pitch device on 0.40mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately |
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AMP 1-480702-0Contextual Info: Soft Shell Pin and Socket Connectors AMP Universal MATE-N-LOK Connectors Continued PC Board Right-Angle Pin and Socket Headers 2, 3, 4, 5, 6 and 8 Circuit, In-line .505 [12.83] .250 [6.35] Centerline spacing .060 Dia. Typ. [1.52] .150 Dia. [3.81] 2 Places |
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BGA Package 0.35mm pitch
Abstract: E-tec Interconnect .65mm bga land pattern 1072 Diode, SMD 3M Touch Systems bpw 50 TEC Driver 8 pin ic base socket round pin type lead qualitek BGA reflow guide
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CH-1072 BGA Package 0.35mm pitch E-tec Interconnect .65mm bga land pattern 1072 Diode, SMD 3M Touch Systems bpw 50 TEC Driver 8 pin ic base socket round pin type lead qualitek BGA reflow guide | |
mpga479
Abstract: intel 94v-0 MOTHERBOARD MANUAL M25N-2 MPGA479M M26N A139 E1 P22-R22 AB22-AB23 AB24-AB25 AF17-AF18
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mPGA479M) mPGA479 mPGA479M intel 94v-0 MOTHERBOARD MANUAL M25N-2 M26N A139 E1 P22-R22 AB22-AB23 AB24-AB25 AF17-AF18 | |
1720GContextual Info: CSP/MicroBGA Test & Burn-In Socket for Devices Up to 13mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to |
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device17 1720G | |
Contextual Info: CSP/MicroBGA Test & Burn-In Socket for Devices Up to 13mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to |
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device17 |