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    SO-14 PADS LAYOUT Search Results

    SO-14 PADS LAYOUT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    PADS5263IRGCT Texas Instruments Quad Channel 16-Bit, 100-MSPS 84.6dB SNR ADC Visit Texas Instruments
    PADS127L18IRSHR Texas Instruments Eight-channel, simultaneous-sampling, 512-kSPS, wideband 24-bit delta-sigma ADC 56-VQFN -40 to 125 Visit Texas Instruments
    PADS1298IPAG Texas Instruments 8-Channel, 24-Bit Analog-To-Digital Converter With Integrated ECG Front End 64-TQFP -40 to 85 Visit Texas Instruments
    PADS9227RHAT Texas Instruments Two-channel, simultaneous-sampling, 16-bit 5-MSPS SAR ADC with fully-differential ADC input driver 40-VQFN -40 to 125 Visit Texas Instruments
    PADS1198CPAG Texas Instruments Low-Noise, 8 Channel, 16 Bit Analog Front End for ECG/EEG Measurements 64-TQFP 0 to 70 Visit Texas Instruments

    SO-14 PADS LAYOUT Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    schematics for a PA amplifier

    Abstract: TQM613025 design of multi section directional coupler TQM613026 qualcomm rft
    Text: TQM613026 Application Note Application Note for TQM613026 Power Amplifier-Duplexer Product TQM613026 TABLE OF CONTENTS • 1.0 Description • 2.0 Product Block Diagram and Operation • 3.0 Recommended Handset Schematic and Layout Considerations • 3.1 DC Block Recommendations


    Original     		PDF TQM613026 TQM613026 schematics for a PA amplifier TQM613025 design of multi section directional coupler qualcomm rft

    jedec package MO-247

    Abstract: qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline
    Text: Application Note AC322 Assembly and PCB Layout Guidelines for QFN Packages Introduction The dual-row or multi-row QFN package is a near Chip Scale, plastic-encapsulated package with a copper leadframe substrate. The exposed die attach paddle on the bottom efficiently conducts heat to the PCB


    Original     		PDF AC322 jedec package MO-247 qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Application Note AN3964 Rev. 2.0, 4/2013 MC13892 Layout Guidelines 1 Purpose This document is intended to show good practices on how to layout the MC13892 PCB for a correct functionality of the whole system. 2 Scope This document contains the packaging and recommended


    Original     		PDF AN3964 MC13892

    AN3964

    Abstract: battery drill charger MC13892JVK 500E9 MC13892 MC13892VK MC13892VL CLK32KM
    Text: Freescale Semiconductor Application Note AN3964 Rev. 1.0, 3/2010 MC13892 Layout Guidelines By: Jorge Ramirez 1 Purpose This document is intended to show good practices on how to layout the MC13892 PCB for a correct functionality of the whole system. 2 Scope


    Original     		PDF AN3964 MC13892 AN3964 battery drill charger MC13892JVK 500E9 MC13892VK MC13892VL CLK32KM

    IBM 750L

    Abstract: 750FX PowerPC 750FX IBM750FX Signal Path designer
    Text:  Application Note PowerPC 750FX Power Supply Layout and Bypassing Abstract This Note describes power and ground connectivity, and bypass capacitor selection and placement, for the IBM 750FX microprocessor. Proper selection and placement of the power supply bypass caps is critical for the correct operation of


    Original     		PDF 750FX 750FX IBM 750L PowerPC 750FX IBM750FX Signal Path designer

    fbga Substrate design guidelines

    Abstract: CS281 ACTEL FBGA PACKAGE DRAWING AC243 CS81 fine BGA thermal profile pcb thermal Design guide pcb trace fbga PCB footprint thermal pcb guidelines MO-195
    Text: Application Note AC243 Assembly and PCB Layout Guidelines for Chip-Scale Packages Introduction The Chip-Scale Package CSP is a dual- or multi-layer plastic encapsulated BT-Epoxy type substrate with copper signal and plain layers. The small form factor allows for enhanced conduction of heat to the PCB


    Original     		PDF AC243 fbga Substrate design guidelines CS281 ACTEL FBGA PACKAGE DRAWING AC243 CS81 fine BGA thermal profile pcb thermal Design guide pcb trace fbga PCB footprint thermal pcb guidelines MO-195

    capacitive level sensor

    Abstract: capacitive touch sensor pcb guideline finger print using labview capacitive touch slider Capacitive PCB capacitive touch sensor labview 3M Touch Systems Capacitive Guidelines touch switch with pcb layout finger print sensor pcb with circuit
    Text: AN 19.16 Physical Design and Layout Guidelines for Capacitive Sensor Systems 1 Overview SMSC’s capacitive sensor family provides systems with a wide variety of slider, button, and LED driver functionality. This application note describes design and printed circuit board PCB layout techniques


    Original     		PDF

    84-1LMI

    Abstract: XP1018 XU1004
    Text: 35.0-45.0 GHz GaAs MMIC Power Amplifier P1018 October 2005 - Rev 21-Oct-05 Features Chip Device Layout Excellent Transmit Output Stage Output Power Adjust 23.0 dB Small Signal Gain +25.0 dBm P1dB Compression Point 100% On-Wafer RF, DC and Output Power Testing


    Original     		PDF P1018 21-Oct-05 MIL-STD-883 84-1LMI XP1018 XU1004

    s2083

    Abstract: qfn 32 5x5 STENCIL rf 4 mm PQFN s2083 application PQFN jedec package MO-220 32 5x5 qfn 3X3 land pattern PDFN STQFN-14 MO-220
    Text: Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Rev. V9 Introduction Via Design The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder


    Original     		PDF S2083 s2083 qfn 32 5x5 STENCIL rf 4 mm PQFN s2083 application PQFN jedec package MO-220 32 5x5 qfn 3X3 land pattern PDFN STQFN-14 MO-220

    p950003

    Abstract: aasupreme ESMIT 4180 aasupreme P950003 73M1906 73M1966B tg-utb01543s 4181 sumida 73M1916-20 UTB01543S
    Text: A Maxim Integrated Products Brand 73M1866B/73M1966B MicroDAA with PCM Highway APPLICATION NOTE AN_1x66B_003 October 2009 73M1866B/73M1966B Schematic and Layout Guidelines Introduction This application note provides layout recommendations that must be followed when integrating the 73M1866B


    Original     		PDF 73M1866B/73M1966B 73M1866B/73M1966B 73M1866B 73M1966B 73M1x66B 73M1866B 73M1966B. p950003 aasupreme ESMIT 4180 aasupreme P950003 73M1906 tg-utb01543s 4181 sumida 73M1916-20 UTB01543S

    84-1LMI

    Abstract: P1017
    Text: 30.0-36.0 GHz GaAs MMIC Power Amplifier P1017 September 2005 - Rev 01-Sep-05 Features Chip Device Layout Balanced Design Provides Good Input/Output Match On-Chip Temperature Compensated Output Power Detector 16.0 dB Small Signal Gain +33.0 dBm Third Order Intercept OIP3


    Original     		PDF P1017 01-Sep-05 MIL-STD-883 84-1LMI P1017

    P1017

    Abstract: P1017-BD DM6030HK TS3332LD XP1017 XP1017-BD XP1017-BD-000V XP1017-BD-EV1 32H2BA0070
    Text: 30.0-36.0 GHz GaAs MMIC Power Amplifier P1017-BD August 2007 - Rev 09-Aug-07 Features Chip Device Layout Balanced Design Provides Good Input/Output Match On-Chip Temperature Compensated Output Power Detector 16.0 dB Small Signal Gain +33.0 dBm Third Order Intercept OIP3


    Original     		PDF P1017-BD 09-Aug-07 MIL-STD-883 XP1017-BD XP1017-BD-000V XP1017-BD-EV1 XP1017 P1017 P1017-BD DM6030HK TS3332LD XP1017-BD XP1017-BD-000V XP1017-BD-EV1 32H2BA0070

    p1017

    Abstract: No abstract text available
    Text: 30.0-36.0 GHz GaAs MMIC Power Amplifier P1017 September 2005 - Rev 01-Sep-05 Features Chip Device Layout Balanced Design Provides Good Input/Output Match On-Chip Temperature Compensated Output Power Detector 16.0 dB Small Signal Gain +33.0 dBm Third Order Intercept OIP3


    Original     		PDF 01-Sep-05 P1017 MIL-STD-883

    s2083

    Abstract: s2083 application jedec package MO-220 68 PQFN IPC-SM-782 M570 MO-220 S2082
    Text: Surface Mount Instructions for PQFN Packages S2083 V5 Introduction The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder stencil


    Original     		PDF S2083 s2083 s2083 application jedec package MO-220 68 PQFN IPC-SM-782 M570 MO-220 S2082

    PCB layout guidelines for NXP MCUs in BGA packages

    Abstract: LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern
    Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 2 — 15 April 2011 Application note Document information Info Content Keywords LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220, LPC2292,


    Original     		PDF AN10778 LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, PCB layout guidelines for NXP MCUs in BGA packages LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern

    LPC2468 reflow solder profile

    Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
    Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,


    Original     		PDF AN10778 LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2468 reflow solder profile 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross

    0.65mm pitch BGA

    Abstract: OMAP35x
    Text: Application Report SPRAAV6B – June 2008 OMAP35x 0.65mm Pitch Layout Methods Keven Coates . ABSTRACT It is easy to see from the unique look that the OMAP35x parts have a very unusual


    Original     		PDF OMAP35x 0.65mm pitch BGA

    AN10373

    Abstract: pci pcb layout
    Text: AN10373 PCI Express PHY PCB Layout Guideline Rev. 01 — 30 April 2005 Application note Document information Info Content Keywords pcb, layout, symmetry, loss, jitter Abstract This document provides a practical guideline for incorporating the PCI Express PHY IC layout into the PCB design.


    Original     		PDF AN10373 AN10373 pci pcb layout

    AN111

    Abstract: scotchbrite eraser APP1110 dremel
    Text: Maxim > App Notes > GENERAL ENGINEERING TOPICS PROTOTYPING AND PC BOARD LAYOUT Keywords: PCB, circuit board, prototype Jun 14, 2002 APPLICATION NOTE 1110 Prototyping with Surface Mount Devices Abstract: Surface mount devices can often be prototyped without etched PCBs by using plain copperclad and


    Original     		PDF com/an1110 AN1110, APP1110, Appnote1110, AN111 scotchbrite eraser APP1110 dremel

    M1000

    Abstract: 40BRFM0058 mmic MIXER 210 84-1LMI XM1000
    Text: 32.0-46.0 GHz GaAs MMIC Balanced Mixer November 2005 - Rev 21-Nov-05 M1000 Features Chip Device Layout Fundamental Balanced Mixer 7.0 dB Conversion Loss +24 dBm Input Third Order Intercept 100% On-Wafer RF Testing 100% Visual Inspection to MIL-STD-883 Method 2010


    Original     		PDF 21-Nov-05 M1000 MIL-STD-883 M1000 40BRFM0058 mmic MIXER 210 84-1LMI XM1000

    Untitled

    Abstract: No abstract text available
    Text: MASW-011021 HMICTM Silicon PIN Diode SPDT Switch 6 - 14 GHz Features •          Rev. V1 Die Bond Pad Layout Specified from 8 GHz to 12 GHz Low Insertion Loss High Isolation Low Parasitic Capacitance and Inductance


    Original     		PDF MASW-011021

    M1000

    Abstract: No abstract text available
    Text: 32.0-46.0 GHz GaAs MMIC Balanced Mixer November 2005 - Rev 21-Nov-05 M1000 Features Chip Device Layout Fundamental Balanced Mixer 7.0 dB Conversion Loss +24 dBm Input Third Order Intercept 100% On-Wafer RF Testing 100% Visual Inspection to MIL-STD-883 Method 2010


    Original     		PDF 21-Nov-05 M1000 MIL-STD-883

    M1000

    Abstract: No abstract text available
    Text: 32.0-46.0 GHz GaAs MMIC Balanced Mixer August 2005 - Rev 04-Aug-05 M1000 Features Chip Device Layout Fundamental Balanced Mixer 7.0 dB Conversion Loss +24 dBm Input Third Order Intercept 100% On-Wafer RF Testing 100% Visual Inspection to MIL-STD-883 Method 2010


    Original     		PDF 04-Aug-05 M1000 MIL-STD-883

    M1000

    Abstract: M1000/SUPER5-KIT/SCC
    Text: 32.0-46.0 GHz GaAs MMIC Balanced Mixer April 2005 - Rev 30-Apr-05 M1000 Features Chip Device Layout Fundamental Balanced Mixer 7.0 dB Conversion Loss +24 dBm Input Third Order Intercept 100% On-Wafer RF Testing 100% Visual Inspection to MIL-STD-883 Method 2010


    Original     		PDF 30-Apr-05 M1000 MIL-STD-883 M1000 M1000/SUPER5-KIT/SCC