SMT PCB IPC STANDARD Search Results

V23026-C1051-B201

Abstract: G0008 V23026-A1001-B201 1393776-3 5vdc relay 12VDC TTL V23026 relay 1393776 V23026-A1002-B201 V23026-B1101-B201 latching relays pcb set coil reset coil
Contextual Info: Signal Relays Axicom P1 Relay V23026 n Directly triggerable with TTL standard modules as ALS, HCT & ACT line 13.5x7.85mm 0.531x0.309” n Switching current 1 A n Bifurcated 1 form C (CO) contact n Immersion cleanable AXICOM n High sensitivity results in low nominal

13001 H

Abstract: 5VDC Telecom relay AXICOM V23026 AXICOM V23026-D1021-B201 AXICOM Relay V23026-C1052
Contextual Info: Signal Relays Axicom P1 Relay V23026 n Directly triggerable with TTL standard modules as ALS, HCT & ACT line 13.5x7.85mm 0.531x0.309” n Switching current 1 A n Bifurcated 1 form C (CO) contact n Immersion cleanable AXICOM n High sensitivity results in low nominal

AXICOM Relay v23026

Abstract: AXICOM V23026 12v AXICOM V23026 AXICOM Relay axicom 12v relay JEDEC SMT reflow profile 5vdc relay 12VDC TTL V23026-A1001-B201 AXICOM GR-1089 V23026
Contextual Info: Signal Relays Axicom P1 Relay V23026 n Directly triggerable with TTL standard modules as ALS, HCT & ACT line 13.5x7.85mm 0.531x0.309” n Switching current 1 A n Bifurcated 1 form C (CO) contact n Immersion cleanable AXICOM n High sensitivity results in low nominal

Contextual Info: Signal Relays AXICOM P1 Relay V23026 n Directly triggerable with TTL standard modules as ALS, HCT & ACT line 13.5x7.85mm 0.531x0.309” n Switching current 1 A n Bifurcated 1 form C (CO) contact n Immersion cleanable AXICOM n High sensitivity results in low nominal

V23026C1057B201 2-1393774-7

Abstract: V23026-B1101-B201 latching relays pcb set coil reset coil V23026A1002B201 1393774-8 V23026-D1025-B20 13001 switching V23026A1001B201 1393774-1 13001 data V23026D1021B201 V23026F1051B201
Contextual Info: Signal Relays AXICOM P1 Relay V23026 n Directly triggerable with TTL standard modules as ALS, HCT & ACT line 13.5x7.85mm 0.531x0.309” n Switching current 1 A n Bifurcated 1 form C (CO) contact n Immersion cleanable AXICOM n High sensitivity results in low nominal

2-1462039-6

Abstract: AXICOM Relay im06dgr IM06D IM03P 2-1462039-9 IM43C IM03D IM43P IM07DTS IM21TS
Contextual Info: Signal Relays AXICOM IM Relay line 10x6mm, low profile 5.65mm and min. board-space 60mm2 n Switching current 2/5A, switching power 60W/62.5VA and switching voltage 220VDC/250VAC n Low coil power consumption, 140mW standard, 100mW for high sensitive version, 50mW for ultra

IM06CTS

Abstract: IM03DJR IM06D IM03P IM07DGR IM23G IM17TS axicom IM IM43PGR AXICOM Relay im06dgr
Contextual Info: Signal Relays Axicom IM Relay line 10x6mm, low profile 5.65mm and min. board-space 60mm2 n Switching current 2/5A, switching power 60W/62.5VA and switching voltage 220VDC/250VAC n Low coil power consumption, 140mW standard, 100mW for high sensitive version, 50mW for ultra

IM08GR

Abstract: IM23G IM41DGR 0224e IM07DTS IM42GR IM25GR IM22DTS IM03DJR IM06CTS
Contextual Info: Signal Relays Axicom IM Relay line 10x6mm, low profile 5.65mm and min. board-space 60mm2 n Switching current 2/5A, switching power 60W/62.5VA and switching voltage 220VDC/250VAC n Low coil power consumption, 140mW standard, 100mW for high sensitive version, 50mW for ultra

Contextual Info: Signal Relays AXICOM IM Relay line 10x6mm, low profile 5.65mm and min. board-space 60mm2 n Switching current 2/5A, switching power 60W/62.5VA and switching voltage 220VDC/250VAC n Low coil power consumption, 140mW standard, 100mW for high sensitive version, 50mW for ultra

component data

Abstract: avago shipping label Moisture Sensitivity JEDEC SMT reflow profile avago Moisture Sensitivity avago, SMT LED
Contextual Info: ASMT-Bx20 PCB Based Subminiature Lamps PCB PolyLED Application Note 5333 Introduction The main benefits of these PCB PolyLEDs are: This series of top mount PCB PolyLED is designed with smaller footprint to achieve high density of components on board. They have the industry standard footprint of

G004

Abstract: ipc-sm-786A MIL-STD-81075 MIL-D-3464 IPC-4202 JESD22-A113 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE IPC-SM-786 research and development procedure in electronics industry P-21373
Contextual Info: MOISTURE CONTROL MEASURES for Epoxy Encapsulated Surface Mount Magnetic Components Extending Pulse’s Commitment to a Quality Partnership 1996, Pulse Engineering, Inc. G004 EXECUTIVE SUMMARY The Situation Over the past decade, the transition from through-hole to SMT production techniques has revealed quality

IME06

Abstract: IME06GR IME03 IME03GR IMD06 IME03TS 60w 250 IMD03 IME02
Contextual Info: Signal Relays Axicom IM - D/E Relay board-space 60mm2 n Slim line 10x6mm 0.39x0.24” and n Low profile 5.65mm (0.222”) n Switching power 60W/62.5VA n Switching voltage 220VDC/250VAC n Switching current 2A n Bifurcated contacts n High mechanical shock resistance

smt pcb ipc standard

Abstract: 600E 610B AMS-QQ-N-290 SAE AMS-QQ-N-290 Class 1
Contextual Info: P/N XX-666000-00 SOIC-to-SOWIC Adapter FEATURES • Allows the use of a narrow package IC in place of a wide one. GENERAL SPECIFICATIONS • LEADS: mechanically fastened and soldered to adapter’s PCB subtrate • PCB: FR-4, 0.062 [1.56] or 0.094 [2.39] thick manufactured to IPC 600E Class

18044

Abstract: SOIC-to-SOWIC Adapter
Contextual Info: P/N XX-666000-00 SOIC-to-SOWIC Adapter FEATURES • Allows the use of a narrow package IC in place of a wide one. GENERAL SPECIFICATIONS • LEADS: mechanically fastened and soldered to adapter’s PCB subtrate • PCB: FR-4, 0.062 [1.56] or 0.094 [2.39] thick manufactured to IPC 600E Class

TO-263 footprint

Abstract: TS5B JESD51-5 JESD51-7 LM2596 xray tube LM2596 PCB
Contextual Info: TO-263 THIN Package TO-263 THIN Package National Semiconductor Application Note 1797 March 10, 2008 Introduction Package Key Attributes The TO–263 THIN Package is a family of surface mount power packages designed with the following features: 1. Footprint/drop-in compatible with the standard TO-263

IMB03C

Abstract: IMB06CGR IMB02C IMB Electronics 1462041-1 IMB06C IMB03CGR IMB06CTS imb06cg 1462041
Contextual Info: Signal Relays Axicom IM - A/B Relay board-space 60mm2 n Slim line 10x6mm 0.39x0.24” and low profile 5.65mm (0.222”) n Switching power 60W/62.5VA n Switching voltage 220VDC/250VAC n Switching current 2A n Bifurcated contacts n High mechanical shock resistance up to 300g functional and 500g

V23026-A1002-B201

Abstract: AXICOM Relay v23026 V23026 V23026 AXICOM
Contextual Info: TE Connectivity My Cart | My Part Lists | Sign In/Register What can we help you find? Products Industries Resources About TE My Account V23026A1002B201 Product Details Share Communications/Signal PC Board Relays Converted to EU RoHS/ELV Compliant Statement of Compliance

Contextual Info: DATA SHEET INCREMENTAL ENCODER TYPE E33 MAIN FEATURES HIGH PERFORMANCE ›› ›› ›› ›› ›› ›› ›› ›› ›› ›› Standard resolution 16 or 32 detent With or without integrated push button Rotational life: Up to 1,000,000 revolutions

Contextual Info: DATA SHEET INCREMENTAL ENCODER TYPE E33 MAIN FEATURES HIGH PERFORMANCE Standard resolution 16 or 32 detent With or without integrated push button Rotational life: Up to 1,000,000 revolutions Excellent indexing feel with 0.5, 1.5, 2.0, 2.5, 3.0, 3.5 or 4.5 Ncm switching torque

Contextual Info: PowerPlus SMD SMD Technology Original POWER ELEMENT Intelligent Systems 300A Inline Processing reliable established low weight SMD Technology PowerPlus SMD high current terminals are the direct consequence of advancing our products in the customer’s interest. The Power Elements are processable in the common SMT

rotary encoder 500 pulses 0.5" shaft diameter quadrature

Abstract: 0.5" shaft diameter encoder 500 ppr rotary encoder 500 pulses 0.5" shaft diameter quadrature output Mechanical Incremental Encoder Type E33
Contextual Info: Incremental Encoder Type E33 16 or 32 detents standard resolution With or without integrated push button Rotational life: Up to 1,000,000 revolutions Excellent indexing feel with 0.5, 1.5, 2.0 or 2.5 Ncm switching torque remains consistent over life Gold plated contacts

RF119

Abstract: JESD625-A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
Contextual Info: Manufacturing Notes for RF1195 The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. "RFMD" for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is

sn63pb37 solder SPHERES

Abstract: J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D
Contextual Info: SMT Board Assembly Process Recommendations AN-353-4.0 Application Note This application note describes the board assembly process used in surface-mount technology SMT and focuses on the SMT component-to-board reflow soldering process and rework soldering if you are removing or replacing individual

Contextual Info: Incremental Encoder Type E33 16 or 32 detents standard resolution With or without integrated push button Rotational life: Up to 1,000,000 revolutions Excellent indexing feel with 0.5, 1.0, 1.5, 2.0 or 2.5 Ncm switching torque remains consistent over life