Untitled
Abstract: No abstract text available
Text: SMM5138XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier • Conversion Gain : -13dB • Input Third Order Intercept IIP3 : +22dBm • LO-RF Isolation : 30dBc
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SMM5138XZ
-13dB
22dBm
30dBc
SMM5138XZ
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Untitled
Abstract: No abstract text available
Text: Preliminary ES/SMM5141XZ 17.7 – 23.6GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +22dBm
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ES/SMM5141XZ
-12dB
22dBm
30dBc
ES/SMM5141XZ
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Untitled
Abstract: No abstract text available
Text: ES/SMM5141XZ Preliminary 17.7 – 23.6GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +22dBm
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ES/SMM5141XZ
-12dB
22dBm
30dBc
ES/SMM5141XZ
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SMM5845V1
Abstract: MMIC marking code U
Text: SMM5845V1B K-Band Power Amplifier MMIC FEATURES High Output Power: Pout=33.0dBm typ. High Linear Gain: GL=22.0dB (typ.) Broad Band:21.2 to 23.6GHz Impedance Matched Zin/Zout=50ohm Small Hermetic Metal-Ceramic SMT Package(V1B) DESCRIPTION The SMM5845V1B is a MMIC amplifier that contains a four-stage
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SMM5845V1B
50ohm
SMM5845V1B
SMM5845V1
MMIC marking code U
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Untitled
Abstract: No abstract text available
Text: ES/SMM5143XZ Preliminary 24 – 30GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +24dBm
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ES/SMM5143XZ
30GHz
-12dB
24dBm
ES/SMM5143XZ
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Power Amplifier MMIC
Abstract: SMM5845V1B SMM5845V1 330-DB
Text: SMM5845V1B K-Band Power Amplifier MMIC FEATURES ・High Output Power: Pout=33.0dBm typ. ・High Linear Gain: GL=22.0dB (typ.) ・Broad Band:21.2 to 23.6GHz ・Impedance Matched Zin/Zout=50W ・Small Hermetic Metal-Ceramic SMT Package(V1B) DESCRIPTION The SMM5845V1B is a MMIC amplifier that contains a four-stage
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SMM5845V1B
SMM5845V1B
Power Amplifier MMIC
SMM5845V1
330-DB
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Untitled
Abstract: No abstract text available
Text: SMM5085V1B Ku-Band Power Amplifier MMIC FEATURES ・High Output Power: Pout=33.0dBm typ. ・Linear Gain: GL=25.0dB (typ.) ・Frequency Band: 12.7 to 15.4GHz ・Impedance Matched Zin/Zout=50ohm ・Integrated Power Detector ・Small Hermetic Metal-Ceramic SMT Package(V1B)
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SMM5085V1B
50ohm
SMM5085V1B
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JEP95 MS-028
Abstract: No abstract text available
Text: SMM5146XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier and x2 multiplier • 10dB Conversion Gain :10dB • Input Third Order Intercept Point IIP3 : +2dBm
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SMM5146XZ
10dBm
SMM5146XZ
JEP95 MS-028
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Untitled
Abstract: No abstract text available
Text: SMM5722XZ 12 – 16GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.3dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +5dBm • Low Current Consumption : IDD_LNA=30mA
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SMM5722XZ
16GHz
50ohm
SMM5722XZ
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Untitled
Abstract: No abstract text available
Text: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm
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SMM5139XZ
SMM5139XZ
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Untitled
Abstract: No abstract text available
Text: SMM5142XZ 17.7 – 23.6GHz Down converter MMIC FEATURES • Wafer Level Chip Size Package with Solder Ball • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • 10dB Conversion Gain • 2.6dB Noise Figure • +2dBm Input Third Order Intercept Point IIP3
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SMM5142XZ
SMM5142XZ
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Untitled
Abstract: No abstract text available
Text: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Size Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • 10dB Conversion Gain • 2.5dB Noise Figure • +2dBm Input Third Order Intercept Point IIP3
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SMM5139XZ
SMM5139XZ
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Untitled
Abstract: No abstract text available
Text: Preliminary ES/SMM5143XZ 24 – 30GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +24dBm
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ES/SMM5143XZ
30GHz
-12dB
24dBm
ES/SMM5143XZ
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Untitled
Abstract: No abstract text available
Text: SMM5085V1B Ku-Band Power Amplifier MMIC FEATURES High Output Power: Pout=33.0dBm typ. Linear Gain: GL=25.0dB (typ.) Frequency Band: 12.7 to 15.4GHz Impedance Matched Zin/Zout=50ohm Integrated Power Detector Small Hermetic Metal-Ceramic SMT Package(V1B) DESCRIPTION
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SMM5085V1B
50ohm
SMM5085V1B
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Untitled
Abstract: No abstract text available
Text: ES/SMM5144XZ Preliminary 24– 30GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • Conversion Gain : 12dB • Input Third Order Intercept Point IIP3 :+2dBm
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ES/SMM5144XZ
30GHz
ES/SMM5144XZ
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Untitled
Abstract: No abstract text available
Text: SMM5722XZ 12 – 16GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.3dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +5dBm • Low Current Consumption : IDD_LNA=30mA
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SMM5722XZ
16GHz
50ohm
SMM5722XZ
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Untitled
Abstract: No abstract text available
Text: Preliminary ES/SMM5724XZ 24 – 30GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=3.2dB typ. • High Associated Gain : Gas=22dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm
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ES/SMM5724XZ
30GHz
50ohm
ES/SMM5724XZ
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Untitled
Abstract: No abstract text available
Text: SMM5846X Ka-Band Power Amplifier MMIC FEATURES ・High Output Power: Pout=31.5dBm typ. ・Linear Gain: GL=20.0dB (typ.) ・Frequency Band: 27.5 to 29.5GHz ・Impedance Matched Zin/Zout=50ohm DESCRIPTION The SMM5846X is a MMIC amplifier that contains a four-stages
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SMM5846X
50ohm
SMM5846X
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Untitled
Abstract: No abstract text available
Text: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm
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SMM5139XZ
SMM5139XZ
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Untitled
Abstract: No abstract text available
Text: SMM5145XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept IIP3 : +22dBm • 2LO-RF Isolation : 45dB
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SMM5145XZ
-12dB
22dBm
10dBm
SMM5145XZ
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Untitled
Abstract: No abstract text available
Text: SMM5142XZ 17.7 – 23.6GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Bal • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm
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SMM5142XZ
SMM5142XZ
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Untitled
Abstract: No abstract text available
Text: Preliminary ES/SMM5723XZ 17 – 24GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Size Package with Solder Ball • Low Noise Figure : NF=2.7dB typ. • High Associated Gain : Gas=20dB (typ.) • +4dBm Input Third Order Intercept Point (IIP3)
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ES/SMM5723XZ
24GHz
50ohm
ES/SMM5723XZ
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Untitled
Abstract: No abstract text available
Text: Preliminary ES/SMM5724XZ 24 – 30GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Size Package with Solder Ball • Low Noise Figure : NF=3.2dB typ. • High Associated Gain : Gas=22dB (typ.) • +4dBm Input Third Order Intercept Point (IIP3)
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ES/SMM5724XZ
30GHz
50ohm
ES/SMM5724XZ
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Untitled
Abstract: No abstract text available
Text: Preliminary ES/SMM5723XZ 17 – 24GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.7dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm
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ES/SMM5723XZ
24GHz
50ohm
ES/SMM5723XZ
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