SMD CODE FUSE TYPE N Search Results

smd fuse marking 20

Abstract: fuse smd code N smd fuse marking code K fuse smd code k k smd fuse marking code fuse smd code P smd fuse marking code 15 smd fuse marking code T fuse smd code D fuse smd code c
Contextual Info: Document No TCF-04OS029E Issued date 2009/5/27 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

Contextual Info: V I S H AY I N T E R T E C H N O L O G Y, I N C . Capacitors – Hi-Rel COTS SMD Tantalum with Built-in Fuse I INNOVAT AND TEC O L OGY T86 Tantalum N HN CAPACITORS O 19 62-2012 T86 - Solid Tantalum Surface-Mount TANTAMOUNT , Molded Case, Hi-Rel COTS, Low ESR, Built-In Fuse

fuse smd code c

Abstract: fuse smd code x 0805 chip KAMAYA Kamaya FUSE E176847 SMD FUSE CODE M fuse smd code t am fuses fuse smd code h FCC32
Contextual Info: NEW! SMD CHIP FUSE FCC 20, 32 Kamaya’s new FCC chip fuse was developed with a very thin body for low profile applications. It provides excellent protection of downstream devices in applications such as: Laptop computers, Mobile Phones, CD-ROM Drives, Laser Printers,

smd fuse marking code T

Abstract: smd fuse marking code smd fuse marking code K 1 smd fuse marking code n smd FUSE CODE t smd fuse marking
Contextual Info: Document No TCH-XXOS001A Thin Film Chip Fuse Issued date 2012/01/18 Page 1/13 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code T

Abstract: CH06 smd fuse marking code K fuse smd code S smd fuse marking code 1 smd fuse marking code n fuse smd code P smd fuse marking x
Contextual Info: Document No TCH-XXOS001A Thin Film Chip Fuse Issued date 2012/06/28 Page 1/13 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

C26-C43

Abstract: TRIMMER 100k 251-8086 phoenixcontact J1 HE10 L4976D 50k-trimmer 50V 100uf he10 connector SMD Code J12
Contextual Info: PROJECT NAME:STEVAL-IHM015V1 BILL OF MATERIALS Item quantity Reference 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 21a 22 23 24 25 26 27 28 29 30 31 32 33 1 1 1 5 5 1 2 1 1 1 1 1 3 1 2 1 2 1 1 1 1 4 3 2 1 1 1 1 1 5 2 1 1 2 C1 C2 C3 C4,C5,C6,C8,C34

1 smd fuse marking code 32

Abstract: cfs12V CFS12V3T7R0 smd fuse marking 20 smd fuse marking code 20 CFS12V3T2R50 k smd fuse marking code fuse smd code N smd fuse marking code smd fuse marking code T
Contextual Info: Lead Free Thin Film Chip Fuse Document No TCFS-12OS051E Issued date 2009/5/27 Page 1/15 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate

fuse smd code N

Abstract: smd fuse marking code M smd fuse marking 20 1 smd fuse marking code n CFS06V5TR50 k smd fuse marking code smd fuse marking code K smd fuse marking code T SMD 1206 fuse fuse smd code P
Contextual Info: Lead Free Thin Film Chip Fuse Document No TCFS-06OS050E Issued date 2007/7/25 Page 1/15 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate

fuse smd code N

Abstract: smd fuse marking code T smd fuse marking 1 smd fuse marking code n smd fuse marking code K fuse smd code S FUSE SMD k smd fuse marking code CFS04V3T2R0 fuse smd code p
Contextual Info: Document No TCFS-04OS049E Lead Free Thin Film Chip Fuse 1. Issued date 2009/5/27 Page 1/15 Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate

CF06V2T2R50

Abstract: CF06V fuse i2t CF06V3T1R25 fuse smd code c fuse smd code N CF06V3T1R0 Chip Fuse smd marking code 45 Smd fuse marking 45 CF06V3TR63
Contextual Info: Document No TCF-06OS030E Issued date 2009/5/27 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

smd fuse marking code G

Abstract: fuse smd code Y 1 smd fuse marking code 32 CF12V3T2R50 CF06V2T2R50 SMD FUSE CODE M CF12V6TR80 smd fuse p Fuse 1206 1A CF12V6T1R25
Contextual Info: Document No TCF-12OS031D Issued date 2007/7/25 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

Contextual Info: Polymer PTC Resettable Fuse： ：KMC Series SMD Type Features 1. RoHS compliant 2. EIA size:1206~1812 3. Hold current ratings from 0.05 to 3A 4. Voltage ratings from 6V computer and electronic applications to 60V 5. Small footprint 6. Fast time to trip 7. Low resistance

KMC5S110

Abstract: KMC3S050 SMD1210P150TFT R50143386 SMD1812P300TF SMD1206P075TF thermistor PTC 1812 smd1206p035tf SMD1206P012TF SMD1206P020TF
Contextual Info: Polymer PTC Resettable Fuse： ：KMC Series SMD Type Features 1. RoHS compliant 2. EIA size:1206~1812 3. Hold current ratings from 0.05 to 3A 4. Voltage ratings from 6V computer and electronic applications to 60V 5. Small footprint 6. Fast time to trip 7. Low resistance

smd fuse marking code 20

Abstract: FUSE SMD 0603 fuse smd code d kMc Series fuse smd code Y smd fuse marking code T POLYMER THERMAL Fuse 0805 fuse marking code m fuse smd code j fuse smd code k
Contextual Info: Polymer PTC Resettable Fuse: KMC Series SMD 0603/0805 Type  Features 1. 2. 3. 4. 5. 6. 7. RoHS & Halogen-free compliant EIA size: 0603, 0805 Hold current ratings from 0.1 to 0.75A Small footprint Fast time to trip Operating & storage temperature range : -40~+85℃

SMD1206P110TF

Abstract: KMC5S110 SMD1812P260TFT SMD1812P200TFT SMD1206P200TF SMD1812P300TF SMD1812P014TF SMD1812P200TF SMD1812P150TF/24 SMD1812P110TF/24
Contextual Info: Polymer PTC Resettable Fuse： ：KMC Series SMD Type Features 1. RoHS compliant 2. EIA size:1206~1812 3. Hold current ratings from 0.05 to 3A 4. Voltage ratings from 6V computer and electronic applications to 60V 5. Small footprint 6. Fast time to trip 7. Low resistance

SLAU265

Abstract: MSP430Fxx mzp a 100 45 16 SMD transistor code NC CL05B CT2194MST-ND 1003 smd resistor mzp a 100 47 16 6 pin SMD CODE 151 SOT 363 m25p16vmn6p
Contextual Info: REP430F Replicator for MSP430 MCU User’s Manual PM041A01 Rev.0 October-23-2009 Elprotronic Inc. Elprotronic Inc. 16 Crossroads Drive Richmond Hill, Ontario, L4E-5C9 CANADA Web site: E-mail: Fax: Voice: www.elprotronic.com info@elprotronic.com 905-780-2414

IPC7351

Abstract: IPC-7351 0603 ipc-7351 61188-5-x
Contextual Info: V I S H AY I N T E R T E C H N O L O G Y, I N C . TFU 0 6 0 3 KEY BENEFITS • Proven thick film technology • Very quick acting fusing characteristic FF according to IEC 60127-4 • Halogen-free according to IEC 61249-2-21 definition APPLICATIONS • Cell phones

CPS06V3

Abstract: CPS12V3T3R00 CPS06V3T5R0 CPS12V6TR50 smd fuse marking code 20 CPS12V3T2R50 CPS12V6T1R50
Contextual Info: Document No TCPS-XXOS004F Thin Film Chip Fuse Issued date 2012/06/28 Page 1/19 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code 20

Abstract: fuse i2t fuse smd code t
Contextual Info: Document No TCPS-XXOS004F Thin Film Chip Fuse Issued date 2011/03/01 Page 1/18 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

code 842 8 PIN SMD

Abstract: IQB48020A033V VDE0805
Contextual Info: 1/6 DC to DC Converters Distributed Power Supplies for Systems, Insulation Type Quarter Brick Type iQB/iQC Series Power supply systems for infrastructure devices used in communication networks primarily use brick-type DC to DC converters. As the voltage used for LSIs continues to drop, power supplies are

smd fuse marking code 20

Contextual Info: Document No TCP-XXOS006H Issued date 2011/04/22 Page 1/17 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

CP06V3T2R0

Abstract: CHIP FUSE CP04V3TR50 CP06V3T5R0 fuse smd code t
Contextual Info: Document No TCP-XXOS006H Issued date 2012/06/28 Page 1/17 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code TK

Abstract: KMC2S010
Contextual Info: Polymer PTC Resettable Fuse: KMC Series SMD Type Features 1. RoHS & Halogen-Free HF compliant 2. EIA size: 0603, 0805, 1206, 1812 3. Hold current ratings from 0.05 to 3A 4. Voltage ratings from 6V computer and electronic applications to 60V 5. Small footprint

fuse smd code Y

Abstract: fuse smd code c SMD code mfu fuse smd code S SMD FUSE CODE M 1608M smd mFU FUSE SMD 0603 fuse smd code o fuse smd code 4
Contextual Info: MFU Series SMD Chip Fuse for Secondary Over-Current Protection FEATURES • Circuit protection • Very quick acting fuse characteristics • Outstanding stability of fusing characteristics • Supports lead Pb -free soldering • Meets requirements of IEC 60127-4 and UL 248-14