SIM READER AMPHENOL Search Results

CAD-0605-212

Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

SIM READER amphenol

Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

CAD-0605-202

Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

SIM READER amphenol

Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

CAD-0605-122

Abstract: CAD0605122
Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

c707 10M006 512

Abstract: SIM READER amphenol C707 10m006 C707 10M006 049 2 Sim card diagram C707-10M006 0 CAD-0605-122 10M006 sim c707 C70710M006512
Contextual Info: Amphenol Card Readers SIMLOCK SIM/SAM Card Readers Environmental - -40ºC thru 85ºC - IEC 60512-4, Test 6d - IEC 60512-4, Test 6c Features • Same footprint as SIM card • Polarized • Suitable for automated assembly • Custom geometries and layouts possible

SIM READER amphenol

Abstract: sim connector reader
Contextual Info: Amphenol SIM CARD Connector 1. Material: Contact: Alloy copper Switch:Alloy copper Shell:Stainless steel Insulator: High temperature. Thermoplastic, UL94V-0, Black. 2. Finish : Contact:0.38 micron gold plated at mating area. 3 micron Tin plated on solder tails.

montage METAL DETECTOR

Abstract: micro SD Card connector C707 C707-10M006 C707A C702 10M008 272 4 sim c707 "DIN 965" C702 10M008 230 SD card socket, footprint to PCB
Contextual Info: Amphenol Amphenol-Tuchel Electronics GmbH www.amphenol-tuchel.com Smart Card Connectors Series C 700 Security information It is the user’s responsibility to check whether the components illustrated in this catalogue comply with different regulations from those stated in special fields of application

SIM READER amphenol

Abstract: XT65 siemens MC1213 push sim card holder MC1213559-2 MC1213911 XT75 siemens molex U.FL-R-SMT XT75 SIM EDGE
Contextual Info: www.xt75.com www.xt65.com SIEMENS XT75 / XT65 SIEMENS XT75/XT65 XT75: GSM/GPRS module with GPS receiver, JAVA and EDGE for the satellite navigation XT65: GSM/GPRS module with GPS receiver and JAVA for the satellite navigation Technische Daten: ‰ ‰ ‰ ‰

siemens modem gsm m20 Terminal

Abstract: S30880-S8000-A100-1 siemens M20 S30880 sms based led scrolling display SMS controlled LED based scrolling message display RS323 class simcard reader circuit diagram star delta timer siemens M20-T
Contextual Info: Cellular Engine Siemens M20 / M20 Terminal Technical Description Data Voice SMS FAX V.24 How to use this book Table of contents Index  Siemens Information and Communication Products How to use this book The following navigation tools are available in addition to the Acrobat Reader toolbar or short-cut menu right

SIM READER amphenol

Contextual Info: TNo document k l h t iproperty of Amphenol Corporation and Is ddhared on that it la not to to dtodoMd, reproduced or uood, In whole or in part, tor manutoatura or oat* by anyone other then Amphenol CmuuuUun «tthaut Ito prior concert, ft that no right la granted to dbdooe

Contextual Info: TM« ôocumant to Uw e preeorty o f Amphenol Corporation and to ddlw rod on S o l ft to not to tw dtodoood, rapraducad o r u n d, tn «boto or In part, fe r manufactura or «ala by anyone othar than Amptanol Corporation «tthaut Ito prior concort, f t th a t no righ t la granted to dtodoao

Contextual Info: Smart Card Connector General Information Chip Cards Chip Cards, Smart Cards, IC Cards or whatever application specific term is used . have some commonality: • the outside dimensions, standardized acc. to ISO 7810, the size of a common credit card • and the position of the contact pads, which connect the embedded IC chip are fixed according to ISO 7816.

C707 10m006

Abstract: 358 ez 902 sim c707 C707 10M006 049 2 C707 C707D pci ped 358 ez 802 C707 10M006 537 2 C707 10M006 001 0
Contextual Info: Amphenol Amphenol-Tuchel Electronics GmbH Smart Card Connectors Series C700 www.smart-card-connector.info Our project competence for your innovative solutions Amphenol's development strategy is to partner with customers early in their development process. We bring a high level expertise

C702 10M008 925 4

Abstract: C707 10m006 358 ez 902 C702 10M008 230 40 C707 10M006 001 0 amphenol simlock C707 10M006 537 2 Smart Card Connector C707A Amphenol-Tuchel snap on tools for electronic
Contextual Info: Amphenol Amphenol-Tuchel Electronics GmbH Smart Card Connectors Series C700 www.smart-card-connector.info Our project competence for your innovative solutions Amphenol's development strategy is to partner with customers early in their development process. We bring a high level expertise

SIM READER amphenol

Abstract: SD card socket, footprint to PCB C700 C702 10M008 272 4 smart card based door access system Smart Card Connector C707A IEC C8 connector smart card Amphenol C707-10M006-049 IEC C8 pcb mount connector C707A
Contextual Info: Amphenol Amphenol-Tuchel Electronics GmbH www.amphenol-tuchel.com Smart Card Connectors Series C 700 Security information It is the user’s responsibility to check whether the components illustrated in this catalogue comply with different regulations from those stated in special fields of application

hk130

Contextual Info: TN» dooumtnt l i tho proport* of Amehonol Corporation and t i M M u d e th# wpraoo eondMan that R it not to b« dhdoN d, raareducod or uaad. « M o or in port, for monufoctur* or M i* by « g e n * ottwr than Amp Comorotion wtthout Ito prior concort, A that no right to granted to d