SIM BLOCK READER Search Results

Contextual Info: 9162 MOBO Slide-In SIM Card Reader GENERAL DESCRIPTION The standard SIM connector is specifically designed for handheld devices requiring secure subscriber identification. Following on from the introduction of our standard SIM block with an offering of 3 standard heights, 0.80mm, 1.60mm, 2.40mm, Elco is now adding

sim connector reader

Abstract: micro Sim Card connector sim card reader sim block reader
Contextual Info: 9162 MOBO Slide-In SIM Card Reader GENERAL DESCRIPTION The standard SIM connector is specifically designed for handheld devices requiring secure subscriber identification. Following on from the introduction of our standard SIM block with an offering of 3 standard heights, 0.80mm, 1.60mm, 2.40mm, Elco is now adding

Contextual Info: Slide-In SIM INTERCONNECT 9162-200 The standard SIM connector is specifically designed for handheld devices requiring secure subscriber identification. Following on from the introduction of our standard SIM block with an offering of 3 standard heights, 0.80mm, 1.60mm, or 2.40mm, AVX is now adding

Contextual Info: SIM Block INTERCONNECT 9162-000 The standard SIM connector is specifically designed for handheld devices requiring secure subscriber identification. The connectors are available in a standard 6 pin configuration on a 2.54mm pitch with a 0.8mm height. Contacts are stamped, gold plated, rated at 0.5A, and 5000 mechanical cycles.

Contextual Info: HIP9011 Semiconductor November 1998 Data Sheet Engine Knock Signal Processor Features The HIP9011 is used to provide a method of detecting premature detonation often referred to as “Knock or Ping” in internal combustion engines. • Two Sensor Inputs The IC is shown in the Sim plified Block Diagram. The chip

EM4094

Abstract: em 18 reader em4233 EM4233SLIC EM4033 EM4233-2K EM4133 EMDB408 EM4135 em 18 rfid
Contextual Info: EM MICROELECTRONIC - MARIN SA AN425 Application Note 425 Title: EM4094 RFID Reader User Guide Product Family: RFID Part Number: Keywords: Date: EMDB408 ISO15693 – EM4233 – EM4133 – EM4033 - ISO14443 Type A,B - EM4006 September 14, 2010 1. Introduction . 2

manchester code for ATMEGA8

Abstract: simcard EM4094 atmega32 with simcard c language RFID pulse interval encoding sim card with atmega32 EMDB408 SIMCOM EM4035 AN426
Contextual Info: EM MICROELECTRONIC - MARIN SA AN429 Application Note 429 Title: EM4094 RFID Reader Firmware Description Product Family: RFID Part Number: Keywords: Date: EMDB408 ISO15693 - ISO14443 Type A,B - EM4006, firmware, description April 3, 2007 1. INTRODUCTION .2

em4233

Abstract: Transponder ID 46 crypto EM4294 EM4233-2K EMDB410 em 18 rfid reader EM4135 AN433 em 18 reader ISO15693
Contextual Info: EM MICROELECTRONIC - MARIN SA AN433 Application Note AN433 Title: EMDB410 RFID Reader User Guide Product Family: RFID Solutions Part Number: Keywords: Date: EMDB410 – EM4294 RFID Reader ISO15693 - ISO14443 Type A,B November 10, 2009 1. Introduction . 2

EM4094

Abstract: em 18 rfid reader em4135 emdb408 em 18 reader 14443AB EM4035 EM4034 ISO15693 tag SWITCH
Contextual Info: EM MICROELECTRONIC - MARIN SA AN425 Application Note 425 Title: EM4094 RFID Reader User Guide Product Family: RFID Part Number: Keywords: Date: EMDB408 ISO15693 - ISO14443 Type A,B - EM4006 June 28, 2006 1. Introduction . 2

EM4094

Abstract: EM4233 EM4294 EM4035 EM4233-2K EMDB410 EM4135 14443-3 type A command read write transponder chip 8e Sim card diagram
Contextual Info: EM MICROELECTRONIC - MARIN SA AN432 Application Note 432 Title: EMDB410 RFID READER Description of the firmware protocol Product Family: RFID Solutions Part Number: Keywords: Date: EMDB410 EM4294 - EM4233 – ISO15693 - ISO14443 Type A, B November 11, 2009

EM4094

Abstract: em4233 EM4294 AN426 EM 18 rfid reader EM4033 EMDB408 EM4133 EM4233SLIC EM4006
Contextual Info: EM MICROELECTRONIC - MARIN SA AN426 Application Note 426 Title: EM4094 RFID READER Description of the firmware protocol Product Family: RFID Solutions Part Number: Keywords: Date: EMDB408 EM4094 – ISO15693 – EM4233 – EM4133 – EM4033 - ISO14443 Type A, B – SR176

EM4094

Abstract: EM4294 em4035 chip RFID loop antenna 13.56MHz EM4034 AN426 EMDB408 Sim card diagram EM Microelectronic RFID EM4035
Contextual Info: EM MICROELECTRONIC - MARIN SA AN426 Application Note 426 Title: EM4094 RFID READER Description of the firmware protocol Product Family: RFID Solutions Part Number: Keywords: Date: EMDB408 EM4094 - EM4034 – EM4035 – EM4135 - EM4006 – ISO15693 - ISO14443 Type A, B – SR176

IC ATMEGA16

Abstract: simcard c language RFID pulse interval encoding EM4094 fsk demodulation source code in C EM4294 ISO14443 sim card with atmega32 em4035 chip C code for ATMEGA16
Contextual Info: EM MICROELECTRONIC - MARIN SA AN431 Application Note 431 Title: EMDB410 RFID Reader Firmware Description Product Family: RFID Part Number: Keywords: Date: EMDB410 – EM4294 RFID Reader ISO15693 - ISO14443 Type A,B – EM4294 March 29, 2007 1. INTRODUCTION .2

Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

CAD-0605-202

Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

SIM READER amphenol

Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

CAD-0605-122

Abstract: CAD0605122
Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

CAD-0605-212

Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

SIM READER amphenol

Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated

Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated