SILVER EPOXY Search Results

Contextual Info: M A T E R IALS BUSHING PIN -COPPER ALLOY, NICKEL PLATED TERMINALS -COPPER ALLOY, SILVER PLATED WASHERS -GLASS PIN -COPPER HOUSING SLEEVE SHUNT EPOXY ALLOY, SILVER PLATED -BLACK THERMOPLASTIC, UL94V-0 - PHOS. BRONZE, PLATED SILVER PC B OA RD L A Y O U T 4 -

805 smd code capacitor

Abstract: MLCC rework S42E 4001 smd mlcc soldering S42 SMD high power diode 500v 210F J-STD-002 MIL-STD-202G method 103A
Contextual Info: Johanson Technology, Inc. 4001 Calle Tecate, Camarillo, CA 93012 805 -389-1166 www.johansontechnology.com S42E Silver Series Specification 1.0 Scope This capacitor belongs to the Silver Series family and is based on SMD Multilayer Ceramic technology. JTI uses nearly pure Silver electrodes while our competitors use Palladium electrodes. Silver is a much

Contextual Info: Mounting Instructions for Chip Capacitors 1 Terminations 1.1 Silver/nickel/tin terminations Sizes 0402, 0603, 0805, 1206, 1210 Tin Nickel Silver As shown in the diagram above, the terminations consist of three metallic layers. A primary silver layer with high conductivity provides for good electrical contact. “Leaching” of the silver is prevented

Contextual Info: Toggles Series MB2400 Electrical Capacity Resistive Load Power Level (silver): Logic Level (gold): Logic/Power Level: (gold over silver) C 3A @ 125V AC 0.4VA maximum @ 28V AC/DC maximum (Applicable Range 0.1mA ~ 0.1A @ 20mV ~ 28V) Combines silver & gold ratings

Contextual Info: Toggles Series MB2400 Electrical Capacity Resistive Load Power Level (silver): Logic Level (gold): Logic/Power Level: (gold over silver) C 3A @ 125V AC 0.4VA maximum @ 28V AC/DC maximum (Applicable Range 0.1mA ~ 0.1A @ 20mV ~ 28V) Combines silver & gold ratings

Contextual Info: Toggles Series M2 Electrical Capacity Resistive Load Power Level (silver): Logic Level (gold): Logic/Power Level: (gold over silver) C 1A @ 125V AC or 1A @ 30V DC 0.4VA maximum @ 28V AC/DC maximum (Applicable Range 0.1mA ~ 0.1A @ 20mV ~ 28V) Combines silver & gold ratings

RC1100 CE

Abstract: RC05 SN62 PB36 ag2 RC0550 RC1206 RC2010 RC-722 Vishay Techno RC
Contextual Info: RC Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold available

SN62 PB36 ag2

Contextual Info: RC www.vishay.com Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold

500 platinum Hot wire

Contextual Info: RC www.vishay.com Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination material: Gold, palladium silver, platinum gold, platinum silver or platinum

Contextual Info: RC Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold available

RC1206* Vishay

Contextual Info: RC www.vishay.com Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold

Contextual Info: RC Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold available

8288

Abstract: 2p3t MSS12AR 4p2t MSS12A 4P3T 2P4T MSS24AG
Contextual Info: MSS Series Standard Size Slide Switches SPECIFICATIONS FEATURES MODEL NO. O PLATING MSS12A SILVER MSS12AG GOLD VERTICAL ACTUATOR MODEL NO. PLATING MSS12AR SILVER Bifurcated wiping contact design. Epoxy sealed terminals. Wash-through open frame construction.

Contextual Info: PART NO. P C 7 I 2 A MATER I A L S PIN BUSHING - COPPER ALLOY, NICKEL PLATED TERMINALS - COPPER ALLOY, SILVER PLATED SILVER PLATED WASHERS - GLASS PIN - COPPER HOUSING SLEEVE PC BOARD I SHUNT ALLOY, THERMOPLASTIC, UL94V-0 - BERYLLIUM COPPER, SILVER PLATED

RC1206

Abstract: RC1206* Vishay
Contextual Info: RC Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications Available • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold RoHS*

QQ-S-571 MSDS

Contextual Info: Technical Data Sheet TRA-DUCT 2902 June-2010 PRODUCT DESCRIPTION TRA-DUCT 2902 provides the following product characteristics: Technology Epoxy Appearance Silver Filler Type Silver Cure Room Temperature or Heat Cure Components Two component - requires mixing

Contextual Info: Technical Data Sheet Product 3888 July 2003 PRODUCT DESCRIPTION LOCTITE 3888 Silver Filled Conductive Adhesive provides the following product characteristics: Technology Epoxy Chemical Type Epoxy Appearance Resin Silver pasteLMS Appearance (Hardener) Clear to amber liquidLMS

ASTM-D-2393

Abstract: amicon "good adhesive bonding starts" ASTM-D-257 amicon silver Cuming Amicon die attach adhesive Amicon D 125 ASTM-D-792 ASTMD257
Contextual Info: Technical Data Sheet AMICON C 850-6 Internet Address: www.emersoncuming.com Key Feature: • One component • Silver filled • Low viscosity Silver Filled, Epoxy Die Attach Adhesive Benefit: • Ease of use • Yields excellent electrical and thermal conductivities

RM73Z

Abstract: KOA Chip Resistors Packaging RK73Z
Contextual Info: RK73Z resistors zero ohm jumper chip resistor features • • • • • Silver element Anti-leaching nickel barrier terminations 90/10 solder plated terminations, standard Available in 100% tin terminations no lead Also available with epoxy bondable palladium silver

K680 varistor

Abstract: B72500T0250 CT1210K B72530T0300 b72510v0250 B72530V0350 B72530T0400 B72540V05 B72500V B72510T014
Contextual Info: SIOV Metal Oxide Varistors SMD Varistors Standard; MLV Series Multilayer (CT/CN) Standard Construction • Multilayer technology ■ Termination: nickel barrier or silver palladium (silver platinum for arrays) ■ No plastic or epoxy packaging assures better than UL 94 V-0 flammability rating

Contextual Info: Reportable Substances in Components Package Type : Lead #: No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Spot Silver Plating Silver Die Attach Epoxy Gold Wire Solder Lead Plating Silicon Die Rev ECN A 032006HC03 B 101410HC01 Component Weight :

Contextual Info: Reportable Substances in Components Package Type : TSSOP 16 Lead #: No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Spot Silver Plating Leadframe Plating Silver Die Attach Epoxy Gold Wire Silicon Die Content in % 51.84% 32.35% 1.01% 1.94% 2.44%

B72520V0110K062

Abstract: CN1206 EPCOS B72540V0350K062 CN0402 B72520V0080L062 CT1206K25G b72520v0600k062 B72540T0300K062 CN1206K25G K 241 VARISTOR
Contextual Info: SMD Varistors MLV; Standard Series Construction • Multilayer technology ■ Termination: nickel barrier CT series or silver palladium (CN series) or silver platinum (only for CN0402 … K2) ■ No plastic or epoxy encapsulation assures better than UL 94 V-0 flammability rating

Contextual Info: Reportable Substances in Components Package Type : Lead #: No 1 2 3 4 5 6 7 Material Component Weight : QFN 7x7mm Document No : 84 Process Type : Content in % Molding Compound 70.09% Copper Alloy Frame 15.36% Spot Silver Plating 0.07% Silver Die Attach Epoxy