SILICON NITRIDE Search Results

Contextual Info: Resistors Make Possible Wire Bondable Wire Capacitor Bondable Chip Chip Capacitor WBC Capacitor Series WBC Capacitor Series Nitride dielectric Silicon Dioxide/Silicon Capacitance range Nitride from 10pF to 1000pF • Silicon Dioxide/Silicon dielectric Silicon substrate

nichrome

Contextual Info: Hybrid Chip and HD! Components Nichrome on Silicon General Features EFI produces nichrome on silicon chip resistors similar in size and geometry to its tantalum nitride on silicon line. Nichrome resistors on silicon provide even better long term stability and tighter tolerance than

Contextual Info: Hybrid Chip and HDI Components Nichrome on Silicon General Features EFI produces nichrom e on silicon chip resistors similar in size and geometry to its tantalum nitride on silicon line. Nichrome resistors on silicon provide even better long term stability and tighter tolerance than

C0303

Abstract: C0505 C0202 C0404 C0606 capacitor 7900
Contextual Info: Wire Bondable Chip Capacitor WBC Capacitor Series • Silicon Dioxide/Silicon Nitride dielectric • Capacitance range from 10pF to 1000pF • Silicon substrate with gold or aluminum backing IRC’s wire-bondable chip capacitors are based on the successful

photosensor phototransistor

Abstract: Photosensor OPC200 OPC260
Contextual Info: OPTEK Product Bulletin OPC260 July 1996 NPN Silicon Phototransistor Chip Type OPC260 Features Optek Technology photosensor chips are fabricated using the latest silicon planar diffused technology and are silicon nitride passivated for long term stability. All photosensors have an

Contextual Info: NC Series www.vishay.com Vishay Electro-Films Thin Film Single Value Chip and Wire Capacitors FEATURES • Wire bondable • Small size: 0.020 inches square to 0.060 inches square • Substrate: Silicon with gold backing • Dielectric: Silicon dioxide/silicon nitride

C0303

Abstract: c0505 361 J capacitor
Contextual Info: Wire Bondable Chip Capacitor IRC Advanced Film Division WBC Series • Silicon substrate with gold backing • Silicon Dioxide/Silicon Nitride dielectric • Capacitance range from 10pF to 1000pF IRC’s wire-bondable chip capacitors are based on the successful

Contextual Info: NC Series www.vishay.com Vishay Electro-Films Thin Film Single Value Chip and Wire Capacitors FEATURES • Wire bondable • Small size: 0.020 inches square to 0.060 inches square • Substrate: Silicon with gold backing • Dielectric: Silicon dioxide/silicon nitride

diode v2

Abstract: ODS-186 MA4PBLP027
Contextual Info: MA4PBL027 HMIC Silicon Beamlead PIN Diode Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch and Impact Protection Low Parasitic Capacitance and Inductance Ultra Low Capacitance < 40 fF

Contextual Info: NC Series Vishay Electro-Films Thin Film Single Value Chip and Wire Capacitors FEATURES Product may not be to scale • Small size: 0.020 to 0.060 inches square • Substrate: silicon with gold backing • Dielectric: silicon dioxide/silicon nitride CHIP CAPACITORS

diode rj 93

Abstract: ma4p HP4291A M541 MA4PBL027 20E-14 W-band diode ODS-186
Contextual Info: HMICTM Silicon Beam-Lead PIN Diodes Features • • • • • • • • • • • MA4PBL027 V1 Case Style ODS-1302 Beam-Lead Device No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch and Impact Protection

40E-14

Abstract: 60E8 ODS-186 HP4291A M541 MA4PBL027 TTL LS 40e8 ODS-186 outline
Contextual Info: MA4PBL027 HMICTM Silicon Beam-Lead PIN Diodes Rev. V1 Features Absolute Maximum Ratings1 • • • • • • • • • • • @ TA = +25°C Unless otherwise specified Beam-Lead Device No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation

Contextual Info: Thin Film Single-Value Chip and Wire Capacitors FEATURES • Die sizes: 0.020 x 0.020 to 0.060 x 0.060 • Capacitance values: 0.50 pF to 1000 pF • Tightest tolerance: 2.5% • Dielectrics: Silicon dioxide MOS or silicon dioxide/silicon nitride (MNOS),

Thin Film Capacitors

Contextual Info: NC Series Vishay Electro-Films Thin Film Single Value Chip and Wire Capacitors FEATURES Product may not be to scale • Wire bondable • Small size: 0.020 to 0.060 inches square • Substrate: Silicon with gold backing • Dielectric: Silicon dioxide/silicon nitride

NC-AA

Abstract: NCEE10
Contextual Info: NC Series Vishay Electro-Films Thin Film Single Value Chip and Wire Capacitors FEATURES Product may not be to scale • Wire bondable • Small size: 0.020 inches square to 0.060 inches square • Substrate: Silicon with gold backing • Dielectric: Silicon dioxide/silicon nitride

Contextual Info: NC Series Vishay Electro-Films Thin Film Single Value Chip and Wire Capacitors FEATURES Product may not be to scale • Wire bondable • Small size: 0.020 inches square to 0.060 inches square • Substrate: Silicon with gold backing • Dielectric: Silicon dioxide/silicon nitride

D 5464

Contextual Info: NC Series Vishay Electro-Films Thin Film Single Value Chip and Wire Capacitors FEATURES Product may not be to scale • Substrate: silicon with gold backing • Dielectric: silicon dioxide/silicon nitride CHIP CAPACITORS The NC series of thin film capacitors has the advantage of

Contextual Info: NC Series Vishay Electro-Films Thin Film Single Value Chip and Wire Capacitors FEATURES Product may not be to scale • Substrate: silicon with gold backing • Dielectric: silicon dioxide/silicon nitride CHIP CAPACITORS The NC series of thin film capacitors has the advantage of

Contextual Info: NC Series Vishay Electro-Films Thin Film Single Value Chip and Wire Capacitors FEATURES Product may not be to scale • Substrate: silicon with gold backing • Dielectric: silicon dioxide/silicon nitride CHIP CAPACITORS The NC series of thin film capacitors has the advantage of

Contextual Info: NC Series Vishay Electro-Films Thin Film Single Value Chip and Wire Capacitors FEATURES Product may not be to scale • Substrate: silicon with gold backing • Dielectric: silicon dioxide/silicon nitride CHIP CAPACITORS The NC series of thin film capacitors has the advantage of

Contextual Info: NC Series Vishay Electro-Films Thin Film Single Value Chip and Wire Capacitors FEATURES Product may not be to scale • Substrate: silicon with gold backing • Dielectric: silicon dioxide/silicon nitride CHIP CAPACITORS The NC series of thin film capacitors has the advantage of

Contextual Info: NC Series Vishay Electro-Films Thin Film Single Value Chip and Wire Capacitors FEATURES Product may not be to scale • Substrate: silicon with gold backing • Dielectric: silicon dioxide/silicon nitride CHIP CAPACITORS The NC series of thin film capacitors has the advantage of

DC4403

Contextual Info: P ^ p i GEC P L E S S E Y DS3412-1.2 DC4400 Series SILICON NITRIDE CHIP CAPACITORS A range of Metal/Silicon-Nitride/Silicon MNS chip capacitors which compare extremely favourably with their ceram ic counterparts. Nitride dielectric ensures very low loss and excellent

Contextual Info: Tantalum on Silicon Chip Resistors SFX: High Density/High Value The SFX series are single, high value, 1 megQ to 20 megQ, tantalum nitride on silicon chip resistors in a 40 x 40 mil. size. The capability for extremely fine-line etching on the smooth silicon surface allows the defin­