SIGE MICROSYSTEMS Search Results

UHV 806

Abstract: metal detector plans seven wonders OC 140 germanium transistor microwaves Amplifier Research metal detector door bell chime receiver SiGe POWER TRANSISTOR frankfurt HFA3861
Contextual Info: SPECIAL REPORT SiGe Advances SiGe Technology Makes Practical Advances This novel device technology is making major strides in RF and digital integrated circuits for highfrequency, high-speed communications systems. JACK BROWNE Publisher/Editor ILICON germanium SiGe is a semiconductor technology made for

Contextual Info: BGA711N7 SiGe Bipolar 3G/3.5G/4G Single-Band LNA Data Sheet Revision 3.1, 2013-01-31 RF & Protection Devices Edition 2013-01-31 Published by Infineon Technologies AG 81726 Munich, Germany 2013 Infineon Technologies AG All Rights Reserved. Legal Disclaimer

Contextual Info: BGA751N7 SiGe Bipolar 3G/3.5G/4G Single-Band LNA Data Sheet Revision 3.1, 2013-01-31 RF & Protection Devices Edition 2013-01-31 Published by Infineon Technologies AG 81726 Munich, Germany 2013 Infineon Technologies AG All Rights Reserved. Legal Disclaimer

vhdl code for dice game

Abstract: Video Proc 3.3V 0.07A 64-Pin PQFP ez811 GRAPHICAL LCD interfaced with psoc 5 cypress ez-usb AN2131QC CYM9239 vhdl code PN 250 code generator CY3649 cy7c63723 Keyboard and Optical mouse program CY7C9689 ethernet
Contextual Info: Product Selector Guide Communications Products Description Pins Part Number Freq. Range Mbps ICC (mA) Packages* 3.3V SONET/SDH PMD Transceiver 2.5V SiGe Low Power SONET/SDH Transceiver SONET/SDH Transceiver w/ 100K Logic 2.5 G-Link w/ 100K Logic OC-48 Packet Over SONET (POS) Framer

vco 6ghz

Abstract: D602
Contextual Info: D602 3V, 6GHz Divide-by-2 Static Prescaler Production Information Applications Product Description 5GHz WLAN, IEEE 802.11a and HIPERLAN VSAT at 3.6 to 4.2 GHz Satellite Communications at 4.5 to 4.8 GHz 5 Gbps Clock Generator The D602 is a SiGe divide-by-2 low noise static

PA2423

Abstract: pcb footprint PA2423MB thermal pcb guidelines reflow profile SiGe Microsystems
Contextual Info: APPLICATION NOTE 10-APP-13 PA2423MB Component Mount Process Guidelines General Description PA2423MB is packaged in an 8 leads MSOP surface mount package with an exposed die pad. The package body size is 3 x 3 mm and the package footprint is 3 x 5 mm. The lead pitch is 0.65 mm

LNA marking CODE R0

Contextual Info: BGA715N7 Silicon Germanium Low Noise Amplifier for Global Navigation Satellite Systems GNSS Data Sheet Revision 1.0, 2013-01-29 Preliminary RF & Protection Devices Edition 2013-01-29 Published by Infineon Technologies AG 81726 Munich, Germany 2013 Infineon Technologies AG

Contextual Info: Singl e - Ch ip Si G e T r ans c ei ve r Chips et fo r E -ba nd Bac k h aul Applic atio ns fr o m 8 1 to 86 G Hz Applic atio n N ote A N 378 Revision: Rev. 1.0 2014-06-10 RF and P r otecti on D evic es Edition 2014-06-10 Published by Infineon Technologies AG

Contextual Info: BGA7M1N6 Silicon Germanium Low Noise Amplifier for LTE Data Sheet Revision 3.1 Min/Max , 2014-02-11 RF & Protection Devices Edition 2014-02-11 Published by Infineon Technologies AG 81726 Munich, Germany 2014 Infineon Technologies AG All Rights Reserved.

Contextual Info: BGA7L1N6 Silicon Germanium Low Noise Amplifier for LTE Data Sheet Revision 3.1 Min/Max , 2014-02-11 RF & Protection Devices Edition 2014-02-11 Published by Infineon Technologies AG 81726 Munich, Germany 2014 Infineon Technologies AG All Rights Reserved.