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    SIGC68T170R3E Price and Stock

    Infineon Technologies AG SIGC68T170R3EX1SA1

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC68T170R3EX1SA1)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SIGC68T170R3EX1SA1 Waffle Pack 20 Weeks 3,528
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    SIGC68T170R3E Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: SIGC68T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology  low turn-off losses  short tail current  positive temperature coefficient  easy paralleling This chip is used for:  power modules C Applications:  drives G


    Original     		SIGC68T170R3E L7761M, L7761T, L7761E, PDF

    Untitled

    Abstract: No abstract text available
    Text: SIGC68T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling This chip is used for: • power modules C Applications: • drives G


    Original     		SIGC68T170R3E L7761T, PDF