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    SIGC39T60S Search Results

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    SIGC39T60S Price and Stock

    Infineon Technologies AG SIGC39T60SEX1SA1

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC39T60SEX1SA1)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SIGC39T60SEX1SA1 Waffle Pack 111 Weeks 6,174
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    EBV Elektronik SIGC39T60SEX1SA1 2 Weeks 1
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    SIGC39T60S Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SIGC39T60S
    		Infineon Technologies IGBT Chips; Package: --; Technology: Fast IGBT 3; VDS (max): 600.0 V; IC (max): 75.0 A; VCE(sat) (max): 2.05 V; VGE(th) (min): 4.1 V; Original PDF

    SIGC39T60S Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: SIGC39T60S 3 IGBT Chip FEATURES: • 600V Trench & Field Stop technology • low VCE sat • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC39T60S VCE ICn 600V 75A This chip is used for:


    Original     		SIGC39T60S Q67050A4394-A101 L7571D, PDF