SIDE BRAZED Search Results

B-3067

Abstract: B-3226 TST-9107 DD-03182GP-200 ddc b-3067 DD-03282GP-200 B-3227 HS1-3182-5 ddc B-3226 DD-03282DC-120
Contextual Info: INDUSTRY CROSS REFERENCE GUIDE ARINC 429 PACKAGE HOLT PART DEI LINE DRIVER 16-PIN CERAMIC SIDE-BRAZED DIP 16-PIN CERAMIC SIDE-BRAZED DIP 16-PIN CERAMIC SIDE-BRAZED DIP 16-PIN CERAMIC SIDE-BRAZED DIP 28-PIN CERAMIC LEADLESS CHIP CARRIER 28-PIN CERAMIC LEADLESS CHIP CARRIER

5-Lead Plastic DD Pak ltc Q

Abstract: ADI TI 20 PIN LEADLESS CHIP CARRIER qfn 44 PACKAGE footprint 9mm DN SOT-223 8 lead side brazed MS8 PACKAGE footprint 5 lead dd pak maxim Cross Reference Search WO10
Contextual Info: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE SSOP Shrink Small Outline TSSOP Thin Shrink Small Outline SIDE BRAZED PACKAGE OUTLINE* DESCRIPTION LTC NSC ADI TI/BURR-BROWN MAXIM 8-Lead Side Brazed Hermetic D8 D D — DA 14-, 16-, 18- and 20-Lead Side Brazed (Hermetic)

117450

Abstract: TO253 lt941 ltc947 1624i LT 129i5 sm 2178a LT1510CGN sot23 1303 ltbw 83
Contextual Info: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D D ADI/PMI — l — — DA 14-, 16-, 18- and 20-Lead Side Brazed (Hermetic) D D D YB QB XB L — — DD, DE, DN, DP

LTC DWG 05-08-1661

Abstract: ks 15544 transistor FN 1016 MS10 SO18 SO20 SO24 WO10 TO253 WO14
Contextual Info: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D D ADI/PMI — l — — DA 14-, 16-, 18- and 20-Lead Side Brazed (Hermetic) D D D YB QB XB L — — DD, DE, DN, DP

Contextual Info: OVER-THE-SIDE IMMERSION HEATERS PRODUCT DESCRIPTION Over-the side immersion heaters are designed for vessels where through the side immersion heaters cannot be conveniently installed. These heaters are installed through the top of the vessel with the heated portion of the unit along the

DD 127 D TRANSISTOR

Abstract: FK 231 SA 220 transistor fn 1016 LTC DWG FN 1016 dp 502 t TO 220 MOT E SO18 TI 3-Lead Plastic DD Pak ltc m 5-Lead Plastic DD Pak ltc Q
Contextual Info: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE LCC METAL CAN CERDIP Ceramic Dual-In-Line METAL CANS SSOP Shrink Small Outline TSSOP Thin Shrink Small Outline SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D

LT1460BCS3-10

Abstract: marking code LTGG LTGF marking code sot 23 MARK LTGG LTKD MARKING CODE ltbw LM 3937 LT1460BCS3-2 LT1521CS8-3 LTHS
Contextual Info: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE LCC METAL CAN CERDIP Ceramic Dual-In-Line METAL CANS SSOP Shrink Small Outline TSSOP Thin Shrink Small Outline SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D

Contextual Info: 2.0 RADHARD MSI PACKAGES Side-Brazed Packages 245 RadHard MSI Logic Flatpack Packages RadHard MSI Logic 246

d1001-09

Abstract: d10-0109
Contextual Info: Supertex inc. Package Outline 20-Lead Ceramic Side-Brazed Package Outline C/NC .980x.280in. body, .200in. height (max), .100in. pitch D 20 Note 1 (Index Area) E1 E b1 1 b Top View View B View B Seating Plane A L A A1 e eA A eB Side View View A - A Note:

Contextual Info: 2.0 RAD-HARD MSI PACKAGES Side-Brazed Packages 237 Rad-Hard MSI Logic Flatpack Packages Rad-Hard MSI Logic 238

DS812

Abstract: Side Brazed Ceramic Dual-In-Line Packages lead side brazed hermetic
Contextual Info: data sheet CERAMIC / HERMETIC Side Braze Side Braze SB Amkor Technology is committed to continuing to service this long established standard industry package. The SB package comes in a wide range of lead counts: from 8-48 leads with a lead pitch of 100 mil inches. This thru-hole package consists

ansi y14.5m-1982

Abstract: 100-PIN CB100 XC3000
Contextual Info: NON LID SIDE LID SIDE s Y M B A2 DETAIL ’A’ □ DETAIL ’B’ NOTES: 1. ALL DIMENSIONING AND TOLERANCING CONFORM TO ANSI Y 1 4 .5 M - 1 982 2. SYMBOL ” N” IS THE NUMBER OF TERMINALS. 3. PACKAGES ARE SHIPPED UNFORMED. 4. LEAD FINISH: GOLD 50 MICROINCHES MINIMUM

Contextual Info: Package Outline 20-Lead Ceramic Side-Brazed Package Outline C/NC .980x.280in. body, .200in. height (max), .100in. pitch D 20 Note 1 (Index Area) E1 E b1 1 b Top View View B View B Seating Plane A L A A1 e eA A eB Side View View A - A Note: 1. A Pin 1 identifier must be located in the index area indicated. The Pin 1 identifier can be: a molded mark/identifier; an embedded metal marker; or

CB164

Abstract: XC3000 164-pin 007012c
Contextual Info: LID SIDE NON LID SIDE SECTION P - P s / Y M aTT ^ T jt t DETAIL ’A’ INCHES B bJ U DETAIL ’B’ □ L ,130 A1 ,110 AP ,020 C D l/ E l 1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y1 4 .5 M - 1 982 MAX, NDM, A B NOTES: MIN. ,007 ,005 ,006 ,012 ,009

ansi y14.5m-1982

Abstract: 100-PIN CB100 XC4000 5M-1982
Contextual Info: NON LID SIDE LID SIDE s Y M B A2 □ DETAIL ’A’ DETAIL ’B’ NOTES: L MIN, NDM. MAX, ,135 A Al ,115 A2 ,020 B C 1. ALL DIMENSIONING AND TOLERANCING CONFORM TO ANSI Y 1 4 .5 M -1 982 IN CH ES D l/ E l ,006 ,005 ,008 ,006 ,012 ,009 ,740 ,750 ,765 ,600 BSC

ISO103

Abstract: ISO103B PWS750-1
Contextual Info: ISO103 Low-Cost, Internally Powered ISOLATION AMPLIFIER FEATURES APPLICATIONS ● SIGNAL AND POWER IN ONE DOUBLE-WIDE 0.6" SIDE-BRAZED PACKAGE ● 5600Vpk TEST VOLTAGE ● 1500Vrms CONTINUOUS AC BARRIER RATING ● MULTICHANNEL ISOLATED DATA ACQUISITION

Contextual Info: Installation Tools Crimping Guidelines for PANDUIT P a n -TEr m ® Terminals and Disconnects C R IM P DIRECTIO N dznL= L IN SU LATIO N C R IM P A R E A IND EN TER SIDE B R A Z E D SEAM 1 i IND EN TER SIDE — ^ (B U TTE D SEAM ) J Insulated Terminals and Disconnects

Contextual Info: LID SIDE NON LID SIDE SEE DETAIL ’B’ £ SECTION P - P J_L 1 A1 A ¡rtrr s u u u U U □ DETAIL ’A ’ L B— NOTES: Y M B DETAIL ’B’ IN C H E S MIN, MAX, NDM, A Al ,130 ,081 ,090 ,105 A2 1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y 14.5 M —1982

ISO103

Abstract: pt100/RTD PT100 ISO103B PWS750-1 Isolated 4-20ma
Contextual Info: ISO103 Low-Cost, Internally Powered ISOLATION AMPLIFIER FEATURES APPLICATIONS ● SIGNAL AND POWER IN ONE DOUBLE-WIDE 0.6" SIDE-BRAZED PACKAGE ● 5600Vpk TEST VOLTAGE ● MULTICHANNEL ISOLATED DATA ACQUISITION ● 1500Vrms CONTINUOUS AC BARRIER RATING

AD2700

Contextual Info: S iP e X HS2700 SERIES "cofDOfatiori^ “ CofDOfatiori' SIGNAL PROCESSING EXCELLENCE PRECISION +10V, •10V, ±10V REFERENCES FEATURES ■ High accuracy: 10.000 volts, ±2,5mV ■ Low temperature coefficient: 3 ppm/°C ■ 14-pin ceramic side brazed package

DIL socket 16pin

Contextual Info: Quad Line Receiver Austin Semiconductor, Inc. Universal Hexadecimal Counter PIN ASSIGNMENT Top View AVAILABLE AS MILITARY SPECIFICATIONS 16-Pin Side Brazed DIP • Military Equivalent Screening - 883 1.2.2 VCC1 Q2 Q3 COUT\ D3 D2 S2 V EE GENERAL DESCRIPTION

DS33023

Abstract: PIC16C72 seminar Applications Book Maxim AN578 PIC16CR72
Contextual Info: M PIC16C72 SERIES 8-Bit CMOS Microcontrollers with A/D Converter Devices included: Pin Diagrams • PIC16C72 SDIP, SOIC, SSOP, Windowed Side Brazed Ceramic • PIC16CR72 Microcontroller Core Features:  1998 Microchip Technology Inc. •1 28 RB7 RA0/AN0

PIC16C72

Abstract: PIC Mid-Range Reference Manual DS33023
Contextual Info: PIC16C72 SERIES 8-Bit CMOS Microcontrollers with A/D Converter Devices included: Pin Diagrams • PIC16C72 SDIP, SOIC, SSOP, Windowed Side Brazed Ceramic • PIC16CR72 Microcontroller Core Features:  1998-2013 Microchip Technology Inc. •1 28 RB7 RA0/AN0

HV20420C

Contextual Info: HV204 inc. Objective Low Charge Injection 8-Channel High Voltage Analog Switch Ordering Information_ Package Options V - Vw NN * PP 28-pin ceramic*1 side-brazed DIP 200V Die in waffle pack 28-pin plastic DIP HV20420X HV20420P HV20420C