SHARP MICROWAVE OVEN Search Results

sharp 16x2 lcd

Abstract: LCD 16X1 sharp 32 pin eprom to eprom copier circuit SHARP electroluminescent display QVGA LCD Monochrome Sharp LCD display 16X1 sharp Sharp EL Displays sharp dbs digital tuner blue optical pickup head CD Pick-Up head
Contextual Info: Sharp Since 1912, our company has stood for technological innovation. Even its name comes from an innovation, the “Ever Sharp” automatic pencil. An these innovations are turned into products to meed their users’s need. 1915 1960 1962 1964 1969 1973 Ever Sharp Pencil

sharp microwave oven

Abstract: R31MA1 Microwave oven sharp catalogue AC200V PR31MA11NTZ oven heater circuit diagram sharp microwave
Contextual Info: PR31MA11NTZ PR31MA11NTZ 6-pin DIP Type SSR for Low Power Control • Features ■ Outline Dimensions 1. Low output current type. Recommended RMS ON-state current:MAX 60mA 2. Compact 5-pin dual-in-line package. Internal connection diagram 1. Electrical dampers for refrigerator.

LR63705

Abstract: S13MD01 HIGH VOLTAGE DIODE for microwave ovens
Contextual Info: S13MD01 S13MD01 8-pin DIP Type SSR for Low Power Control • Features ■ Outline Dimensions 1. Compact 8-pin dual-in-line package 2. RMS ON-state current IT:0.3Arms 3. Repetitive peak OFF-state voltage is high 4.Isolation voltage between input and output (Viso:4 000Vrms)

sharp microwave oven

Abstract: circuit diagram of refrigerator sharp Microwave oven sharp catalogue s21ma01 S11MA01
Contextual Info: S11MA01/S21MA01 S11MA01/S21MA01 6-pin DIP Type SSR for Low Power Control • Features ■ Outline Dimensions 1. Low operating current type MAX 60mArms 2. Compact 5-pin dual-in-line package type 3. Recognized by UL file No. E94758 S11MA01 Internal conection diagram

S201D01S201D02

Abstract: s201d02 S101D01
Contextual Info: SHARP S101D01/S101D02/S201D01/S201D02 S101D01/S101D02 S201D01/S201D02 16-Pin DIP Type SSR for Low Power Control • Features ■ Outline Dimensions 1. Compact Unit : mm Internal connection cSagram ( 16-pin dual-in-line package type) M — 3. Built-in zero-cross circuit

sharp microwave oven

Abstract: S201DH1 e94758
Contextual Info: S101DH1/S101DH2/S201DH1/S201DH2 S101DH1/S101DH2 S201DH1/S201DH2 16-Pin DIP Type SSR for Low Power Control • Features ■ Outline Dimensions Unit : mm Internal connection diagram 1. Compact ( 16-pin dual-in-line package type ) 2. High output current ( RMS ON-state current I T : 1.5A rms )

S11MA01

Contextual Info: SHARP» S11MA01/S21MA01 Power Control S 1 1 M A 0 1 /S 2 1 M A 01 • Features IOutline Dim ensions 1. Low operating current type S11MA01 MAX 60mA s (U n it : mm ) Internal conection diagram 2. Compact 5-pin dual-in-line package type 3. Recognized by UL file No. E94758

sharp microwave oven

Abstract: S201D01 S101D01 Microwave oven sharp catalogue s201d02
Contextual Info: S101D01/S101D02/S201D01/S201D02 S101D01/S101D02 S201D01/S201D02 16-Pin DIP Type SSR for Low Power Control • Features ■ Outline Dimensions 1. Compact 16-pin dual-in-line package type 2. RMS ON-state current I T : 1.2Arms 3. Built-in zero-cross circuit

S26MD02

Abstract: sharp microwave oven S16MD01 S16MD01 equivalent LR63705 S16MD02 S26MD01
Contextual Info: S16MD01/S16MD02/S26MD01/S26MD02 S16MD01/S16MD02 S26MD01/S26MD02 8-Pin DIP Type SSR for Low Power Control • Features ■ Outline Dimensions 1. Compact 8-pin dual-in-line package type 2. RMS ON-state current IT : 0.6Arms 3. Built-in zero-cross circuit S16MD02 / S26MD02

H31D

Abstract: MP4T243 MP42001 MP4T56800 MP4T6310 MP4T6325 MP4T6365 MP4T645 MP4T6825 MP4T856
Contextual Info: Microwave Table of Contents DIODES Mircowave Schottky Diodes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Zero bias Schottky Diodes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

S26MD02

Abstract: s26md02v SI6MD02 S26MD01 S26M001 S16MD01 e94758
Contextual Info: SHARP S16MD01 /S16MD02/S26MD01 /S26MD02 S16MD01/S16MD02 S26MD01 /S26MD02 a - Pin DIP Type SSR for Low Power Control • Features ■ Outlne Dimensions Unit : mm 1. Compact 8-pin dual-in-line package type 2. RMS ON-state current I t : 0.6Arms 3. Built-in zero-cross circuit

Contextual Info: HMC258CB1 MICROWAVE CORPORATION HMC258CB1 SUB-HARMONIC SMT MIXER 14 - 20 GHz FEBRUARY 2000 Features General Description RUGGED SMT BGA PACKAGE The HMC258CB1 is a 14 – 20 GHz surface mount sub-harmonically pumped x2 MMIC mixer with an integrated LO amplifier in a rugged

Sharp hybrid cooling SJ-LC42D

Abstract: crt television sharp sem 2005 backlight inverter Sharp 21c gs1 LCD Backlight MSDS AY-L28SX 21C-GS1 how to make ic copier LC-104S2-S SJ-LC42D
Contextual Info: 2000 ENVIRONMENTAL REPORT Table of Contents Table of Contents 1P A Message from the President 2P I Sharp's Core Competencies–Conserving Energy and Creating Clean Energy Doing the Work of a Forest 1.4 Times the Size of Tokyo 3P II

mrf 447

Abstract: sharp microwave oven
Contextual Info: HMC258CB1 MICROWAVE CORPORATION HMC258CB1 SUB-HARMONIC SMT MIXER 14 - 20 GHz FEBRUARY 2001 Features General Description RUGGED SMT BGA PACKAGE The HMC258CB1 is a 14 – 20 GHz surface mount sub-harmonically pumped x2 MMIC mixer with an integrated LO amplifier in a rugged

Contextual Info: '9 9 n ew ! HMC265CB1 MICROWAVE CORPORATION HMC265CB1 SUB-HARMONIC SMT MIXER 20 - 31 GHz SEPTEMBER 1999 Features General Description RUGGED SMT BGA PACKAGE The HMC265CB1 is a 20 – 31 GHz surface mount sub - harmonically pumped x2 MMIC downconverter with integrated LO & IF amplifiers in a rugged Ball Grid Array (BGA) package.

Contextual Info: MICROWAVE CORPORATION HMC300LM1 v02.1201 SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 25.5 - 33.5 GHz AMPLIFIERS - SMT 8 Typical Applications Features This amplifier is ideal for use as a power amplifier for 25.5 - 33.5 GHz applications: SMT mmWave Package • LMDS

Contextual Info: HMC292LM3C v00.0302 MICROWAVE CORPORATION GaAs MMIC DOUBLE-BALANCED SMT MIXER, 17 - 31 GHz Typical Applications Features The HMC292LM3C is ideal for: Input IP3: +19 dBm • Microwave Point to Point Radios LO / RF Isolation: 25 to 40 dB • Multi-Point/LMDS Radios

Contextual Info: HMC258LM3 v01.1201 MICROWAVE CORPORATION GaAs MMIC SUB-HARMONIC SMT MIXER, 14 - 20 GHz Typical Applications Features The HMC258LM3 is ideal for: Integrated LO Amplifier: 0 dBm Input • 14 and 20 GHz Microwave Radios Sub-Harmonically Pumped x2 LO • Point to Point Radios

sharp microwave oven

Abstract: HMC258LM3
Contextual Info: MICROWAVE CORPORATION HMC258LM3 v01.1201 GaAs MMIC SUB-HARMONIC SMT MIXER, 14 - 20 GHz Typical Applications Features The HMC258LM3 is ideal for: Integrated LO Amplifier: 0 dBm Input • 14 and 20 GHz Microwave Radios Sub-Harmonically Pumped x2 LO • Point to Point Radios

Contextual Info: HMC292LM3C v00.0302 MICROWAVE CORPORATION GaAs MMIC DOUBLE-BALANCED SMT MIXER, 17 - 31 GHz Typical Applications Features The HMC292LM3C is ideal for: Input IP3: +19 dBm • Microwave Point to Point Radios LO / RF Isolation: 25 to 40 dB • Multi-Point/LMDS Radios

sharp microwave oven

Abstract: HMC292LM3C
Contextual Info: HMC292LM3C v00.0302 MICROWAVE CORPORATION GaAs MMIC DOUBLE-BALANCED SMT MIXER, 17 - 31 GHz Typical Applications Features The HMC292LM3C is ideal for: Input IP3: +19 dBm • Microwave Point to Point Radios LO / RF Isolation: 25 to 40 dB • Multi-Point/LMDS Radios

Contextual Info: HMC261LM1 v03.1201 MICROWAVE CORPORATION SMT DISTRIBUTED GaAs MMIC AMPLIFIER, 20 - 32 GHz 1 Typical Applications Features The packaged HMC261LM1 amplifier enables economical PCB SMT assembly for: SMT mmWave Package 13 dB Gain • Millimeterwave Point-to-Point Radios

Contextual Info: HMC329LM3 v01.0505 GaAs MMIC DOUBLE-BALANCED SMT MIXER, 26 - 40 GHz Input IP3 vs. Temperature @ LO = +13 dBm 25 25 20 20 IP3 dBm IP3 (dBm) Input IP3 vs. LO Drive* 15 10 + 11 dBm + 13 dBm + 15 dBm 5 12 15 10 + 25 C + 85 C - 40 C 5 26 28 30 32 34 36 38 40

HMC265CB1

Contextual Info: HMC265CB1 MICROWAVE CORPORATION HMC265CB1 SUB-HARMONIC SMT MIXER 20 - 31 GHz FEBRUARY 2001 Features General Description RUGGED SMT BGA PACKAGE The HMC265CB1 is a 20 – 31 GHz surface mount sub - harmonically pumped x2 MMIC downconverter with integrated LO & IF amplifiers in a rugged Ball Grid Array (BGA) package.