GHz BGA Sockets-0.8mm; IC Size X (mm): 27; IC Size Y (mm): 27; IC Array X: Any; IC Array Y: Any; Max Pincount: Any; Top Pitch (mm): 1; IC Ball Coplanarity (mm): 0.15; IC Ball Diameter Max (mm): 0.8; IC Ball Height Max (mm): 0.9; IC Ball Height Min (mm): 0.8; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 3.298; Max Package Code: Backing Plate: yes; Cavity Down: no; Heat Sink: yes; IC Top Surface: Flip Chip + Caps; Socket Lid: Screws; Part Description: GHz BGA Socket (ZIF)