senju solder paste
Abstract: Senju
Text: !Solder and Flux 1 Solder Paste Reflow Soldering : Use RA type or equivalent type of solder paste (Sn:Pb:Ag=63wt%:35wt%:2wt%, Sn:Pb=60wt%:40wt% or Sn:Pb=63wt%:37wt%) For your reference, we are using 'SPT-70-0F-2063', manufactured by SENJU METAL INDUSTRY CO.,
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SPT-70-0F-2063'
senju solder paste
Senju
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Senju
Abstract: H60A senju h63a Senju Sn Pb 60 40 solder senju solder paste H63A Senju metal solder paste SPT-70-OF-2063 Ultrasonic flow
Text: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).
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SPT-70-OF-2063
Senju
H60A
senju h63a
Senju Sn Pb 60 40 solder
senju solder paste
H63A
Senju metal solder paste
Ultrasonic flow
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Senju
Abstract: SPT-70-OF-2063 senju h63a senju solder paste Senju flux solder paste H63A Senju metal solder paste H60A
Text: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).
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SPT-70-OF-2063
Senju
senju h63a
senju solder paste
Senju flux
solder paste
H63A
Senju metal solder paste
H60A
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Senju M705-GRN360-K2-V
Abstract: Senju M705-GRN360-K2-V solder paste Senju eco solder paste Senju M705-GRN360-K2-V TYPE 4 OZ63-221CM5-42-10 senju type 5
Text: 0.3 mm Pitch Back-lock FPC Connectors FF12 Series OUTLINE The FF12 series back-lock LIF connector allows for design flexibility by incorporating both an upper contact and a lower contact to interface with a 0.15mm thick FPC at a 0.3mm pitch. The low profile
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M705-GRN360-K2-V
Senju M705-GRN360-K2-V
Senju M705-GRN360-K2-V solder paste
Senju eco solder paste
Senju M705-GRN360-K2-V TYPE 4
OZ63-221CM5-42-10
senju type 5
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Untitled
Abstract: No abstract text available
Text: 0.5mm Pitch FPC/FFC/Membrane FF14A Series 【Cable Lock Type】 OUTLINE FF14A series is a 0.9mm height connector with a cable lock mechanism, in conformity to FPC of 0.5mm pitch and 0.2mm thick. Applicable cable is 0.2mm thick FPC, FFC and membrane. APPLICATIONS
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FF14A
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Untitled
Abstract: No abstract text available
Text: 0.5mm pitch low profile FPC LIF back-lock connector FF14C Series OUTLINE The FF14C series low profile FPC LIF connector has a back-lock mechanism with a 0.5mm contact pitch. It mates with a standard FPC circuit of 0.3mm thick. The upper contact is utilized as the electrical contact for the FPC material.
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FF14C
M705-GRN360-K2-V
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SENJU SOLDER PASTE
Abstract: Senju Senju metal solder paste Senju flux senju solder h63 37wt viscosity senju H63
Text: gSolder and Flux 1 Solder Paste 1) Flow Soldering : Use H60 (Sn:Pb=60wt%:40wt%) type, H63 (Sn:Pb=63wt%:37wt%) type or equivalent type of solder paste. 2) Reflow Soldering : Use RA type or equivalent type of solder paste (Sn:Pb:Ag=63wt%:35wt%:2wt%, Sn:Pb=60wt%:40wt% or Sn:Pb=63wt%:37wt%)
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SPT-70-0F-2063'
SENJU SOLDER PASTE
Senju
Senju metal solder paste
Senju flux
senju solder h63
37wt
viscosity
senju H63
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senju solder paste
Abstract: senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux Senju soldering paste solder powder 62Sn36Pb2Ag
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.3 SOLDER SUPPLY PROCESS 2.3.1 SOLDER PASTE 1 Material Composition Soldering paste is mainly made from soldering powder and flux. Soldering powder makes up approximately 80-95wt% of soldering paste
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80-95wt%
63Sn/37Pb)
62Sn/36Pb/2Ag)
senju solder paste
senju printing speed
Senju metal solder paste
viscometer
Rosin Flux Type RMA
Senju flux
Senju
soldering paste
solder powder
62Sn36Pb2Ag
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Senju M705
Abstract: M705 solder paste senju m705 solder paste
Text: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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Senju M705
Abstract: Senju Sn Pb 60 40 solder Senju PASTE Senju
Text: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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senju M705 solder paste
Abstract: Senju M705 senju solder paste M705 senju solder paste M705 solder paste Senju metal solder paste senju solder specification
Text: NEW 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. FH 25 Series 51pos. type 0.9mm 3.45mm 17 .1m m •Features No exposed contacts 1. Extremely light weight The largest version, with all contacts loaded, weights only 0.11gramms.
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51pos.
11gramms.
senju M705 solder paste
Senju M705
senju solder paste M705
senju solder paste
M705 solder paste
Senju metal solder paste
senju solder specification
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Senju M705
Abstract: Senju eco solder M705 Senju M705 m705 m705-tva Senju eco solder paste senju m705 solder paste Solder bar of Senju M705 M705-TVA03 Senju m705-tva senju solder bar
Text: Application Report SWPA156 – February 2009 Part – II Assembly Guidelines for 0.4-mm Package-On-Package Packages Steven Kummerl . OMAP ABSTRACT
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SWPA156
Senju M705
Senju eco solder M705
Senju M705 m705 m705-tva
Senju eco solder paste
senju m705 solder paste
Solder bar of Senju M705
M705-TVA03
Senju
m705-tva
senju solder bar
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Senju M705-GRN360-K2-V solder paste
Abstract: Senju M705-GRN360-K2-V
Text: 0.5mm Pitch Back-lock FPC Connectors FF14 Series OUTLINE The FF14 FPC connector utilizes a back-lock mechanism with 0.5mm pitch. This ultra-low profile ZIF connector has a height of only 0.9mm. The FF14 connector series offers flexibility in FPC design as it mates with 0.20mm thick or 0.12mm thick
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M705-GRN360-K2-V
Senju M705-GRN360-K2-V solder paste
Senju M705-GRN360-K2-V
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Untitled
Abstract: No abstract text available
Text: 0.3 mm Pitch Back-lock FPC Connectors FF12 Series OUTLINE The FF12 series has a back-lock mechanism connector with a 0.3mm contact pitch. It fits 0.15mm thick FPCs and has upper and lower contacts, but the connector height has a low profile of 0.9mm, making the PCB mounting space the smallest in the market.
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senju m705 solder paste
Abstract: Senju M705 SENJU mobile actuator ltds senju solder paste
Text: NEW 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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Senju M705
Abstract: No abstract text available
Text: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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Untitled
Abstract: No abstract text available
Text: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
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51pos.
11gramms.
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senju m705 solder paste
Abstract: Senju M705 SENJU SENJU SOLDER PASTE M705-221CM5 Senju metal solder paste standard ul94v0 plastic paste M705 solder paste
Text: NEW 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. FH 25 Series 51pos. type 0.9mm 3.45mm 17 .1m m •Features No exposed contacts 1. Extremely light weight The largest version, with all contacts loaded, weights only 0.11gramms.
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51pos.
11gramms.
senju m705 solder paste
Senju M705
SENJU
SENJU SOLDER PASTE
M705-221CM5
Senju metal solder paste
standard ul94v0 plastic paste
M705 solder paste
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Senju M705
Abstract: M705-221CM5 senju m705 solder paste senju solder paste senju Senju metal solder paste SENJU 221CM5 M7052 M705-221CM5-42-10 221CM5
Text: NEW 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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Senju paste 7100
Abstract: M705-221CM5 40 pin zif connector 1mm FPC LCD 40 pin zif connector 1mm FPC Senju 7100 reflow profile 1mm 30 pin fpc connector Senju 1mm 40 pin fpc connector 32 PIN FPC CONNECTOR FH26-13S-0.3SHW
Text: 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors FH26 Series 1.0mm ●Space saving 51 pos. shown 3.2mm 16.8mm Metal fittings do no protrude outside of the connector body •Features 1. Extremely light weight ●Can be mounted over conductive traces.
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Senju
Abstract: senju m705 solder paste M705 solder paste
Text: 0.3mm Contact Pitch, 1.25mm above the board, Flexible Printed Circuit Connectors FH 23 Series ●Staggered termination configuration. Only 1.25 mm above the board. Leadless type Completely enclosed bottom surface Lead type 1.25mm •Features 1. FPC low insertion force and high holding force
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0.5mm pitch 28 Conductor FPC Cable
Abstract: No abstract text available
Text: World's smallest & lightest 0.5mm pitch, 0.9mm above the board, Flexible Printed Circuit & Flexible Flat Cable Connectors FH19 & FH19S Series FH19 Series – FPC, FFC thickness: 0.2±0.03mm Actuator color: Dark brown FH19S Series – FPC, FFC thickness: 0.3±0.03mm
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FH19S
30pos.
0.5mm pitch 28 Conductor FPC Cable
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FH19S-40S-0.5SH
Abstract: FH19-30S-0.5SH FH19S-45S-0.5SH FFC 0.8mm FH19-13S-0.5SH FH19-6S-0.5SH FH19S-26S-0.5SH M705-221CM5 senju m705 solder paste FH12
Text: World's smallest & lightest 0.5mm pitch, 0.9mm above the board, Flexible Printed Circuit & Flexible Flat Cable Connectors FH19 & FH19S Series FH19 Series – FPC, FFC thickness: 0.2±0.03mm Actuator color: Dark brown FH19S Series – FPC, FFC thickness: 0.3±0.03mm
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FH19S
30pos.
FH19S
FH19S-40S-0.5SH
FH19-30S-0.5SH
FH19S-45S-0.5SH
FFC 0.8mm
FH19-13S-0.5SH
FH19-6S-0.5SH
FH19S-26S-0.5SH
M705-221CM5
senju m705 solder paste
FH12
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senju m705 solder paste
Abstract: 1mm 30 pin fpc connector datasheet 40 pin zif connector 1mm FPC FH26-35S-0.3SHW SN 0203 FPC CONNECTOR SENJU 221CM5 32 PIN FPC CONNECTOR FH26-13S-0.3SHW FH26-39S-0.3SHW
Text: 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors FH26 Series 1.0mm ●Space saving 51 pos. shown 3.2mm 16.8mm Metal fittings do no protrude outside of the connector body •Features 1. Extremely light weight ●Can be mounted over conductive traces.
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05N/pin
senju m705 solder paste
1mm 30 pin fpc connector datasheet
40 pin zif connector 1mm FPC
FH26-35S-0.3SHW
SN 0203
FPC CONNECTOR
SENJU 221CM5
32 PIN FPC CONNECTOR
FH26-13S-0.3SHW
FH26-39S-0.3SHW
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