SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY
Abstract: MS011800 bond wire gold copper bond wire cte table epoxy substrate soft solder wire dispensing NATIONAL SEMICONDUCTOR ink MARKING AU4A cte table ic bga PCB monitor spc
Text: Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board PCB .
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ceramic rework
Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability
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25x25x1
ceramic rework
CCGA
BGA Solder Ball collapse
90Pb 10Sn solder paste
304-pin ltcc
MPC105
MPC106
MPC107
BGA PROFILING
spray nozzles
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90Pb 10Sn solder paste
Abstract: 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola
Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Andrew Mawer, Terry Burnette, Thomas Koschmeider and Diane Hodges Final Manufacturing Technology Center Motorola Semiconductor Products Sector 3501 Ed Bluestein Blvd., MD: F25 Austin, Texas 78721 USA
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90Pb 10Sn solder paste
97Pb
BGA OUTLINE DRAWING
ceramic rework
BGA PROFILING
BGA Solder Ball collapse
fine BGA thermal profile
pcb warpage in ipc standard
bga rework
CBGA motorola
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D2PAK1
Abstract: No abstract text available
Text: Cherry Semiconductor offers a wide variety of traditional packages in addition to more advanced package technology. Flip Chip is an example of the advanced packaging technologies offered by Cherry Semiconductor. An application note included in this section explains the Flip Chip manufacturing process and the methods available for Flip Chip assembly.
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MS-026
MO-108
D2PAK1
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landing
Abstract: AN-19 AN-20 16 QSOP pcb footprint qsop 16 pcb footprint
Text: AN-20 Q QUALITY SEMICONDUCTOR, INC. Board Assembly Techniques for 0.4mm Pin Pitch Surface Mount Packages The need for higher performance systems continues to push both silicon and packaging technologies to new advances. As an example, in 1991 Quality Semiconductor QSI introduced the QSOP (Quarter
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AN-20
150-mil)
25-mil
MAPN-00020-00
landing
AN-19
AN-20
16 QSOP pcb footprint
qsop 16 pcb footprint
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conveyor belt
Abstract: AN8820 harris varistors 62Sn harris varistor varistor harris disc varistors Alpha Metals 62-SN mov VARISTOR
Text: Harris Semiconductor No. AN8820.2 Harris MOVs April 1993 Recommendations for Soldering Terminal Leads to MOV Varistor Discs Introduction Fluxes The CA series of MOV varistor discs with silver electrodes are specifically designed for custom assembly and packaging. To take advantage of the excellent performance and
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AN8820
62Sn/36Pb/2AG
179oC
221oC
96Sn/5
221oC
245oC
10Sn/88Pb/2Ag
268oC
302oC
conveyor belt
harris varistors
62Sn
harris varistor
varistor harris
disc varistors
Alpha Metals
62-SN
mov VARISTOR
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tamura solder paste
Abstract: AN-1035 SN63 PB37 multicore SN62 PB36 ag2 kester SN62 MP AN1035 tamura solder paste PROFILE Litton SN62 PB36 ag2 100N
Text: Application Note AN-1035 DirectFET Technology Board Mounting Table of Contents Page Device construction Design considerations Assembly considerations Mechanical test results Model-specific data 2 2 3 5 8 DirectFET™ is a new surface mount semiconductor technology designed primarily for boardmounted power applications. It eliminates unnecessary elements of packaging that contribute to
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AN-1035
150mm
025mm
500mm
tamura solder paste
AN-1035
SN63 PB37 multicore
SN62 PB36 ag2 kester
SN62 MP
AN1035
tamura solder paste PROFILE
Litton
SN62 PB36 ag2
100N
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ebonol
Abstract: 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
ebonol
260-4TH5B
ebonol c black
205cb
AB-275
204-CB
TUBE 1625
5 lead dd pak weight
260-6SH5B
205-CB
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ebonol
Abstract: 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
ebonol
217-36CT6
218-40CT3
218-40CT5
MO-169
204sb
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217-36CTT6
Abstract: ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
217-36CTT6
ebonol
217-36CT6
230-75AB-10
MO-169
204-CB
260-6SH5B
215AP
627 Series
260-4T5
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ebonol
Abstract: 215CB 647-25ABP 217-36CT6 230-75AB-10 MO-169 205-CB 281-2AB 204CB 1134 sot dm
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
ebonol
215CB
647-25ABP
217-36CT6
230-75AB-10
MO-169
205-CB
281-2AB
204CB
1134 sot dm
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Untitled
Abstract: No abstract text available
Text: BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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O-220,
OT-223,
SOL-20
217-36CTR6
1-866-9-OHMITE
217-36CTT6
O-263
MO-169
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ebonol
Abstract: abe sot-223 217-36CTRE6 217-36CT6 MO-169
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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O-220,
OT-223,
SOL-20
ebonol
abe sot-223
217-36CTRE6
217-36CT6
MO-169
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N10015
Abstract: 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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O-220,
OT-223,
SOL-20
292-AB
292-AB
N10015
218-40cte3
ebonol
outline of the heat sink for JEDEC
217-36CT6
MO-169
218-40CTE5
217-36CTTE6
unc screw
230-75ABE-01
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Untitled
Abstract: No abstract text available
Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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WTS001
p1-25
O-220,
OT-223,
SOL-20
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mos-fet darlington
Abstract: madison igbt module testing military switch POW-R-BRIK missile launching system SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY pioneer mosfet SCR Inverter datasheet NATIONAL IGBT
Text: MILITARY POWER From A Global Power In Power Semiconductor Technology Powerex . . . on the leading edge of research and manufacturing technology … The Mission Powerex has positioned itself as a prime supplier to the defense industry. Since 1986, Powerex has been a
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MPB-000
LVG-5K-6/01
mos-fet darlington
madison
igbt module testing
military switch
POW-R-BRIK
missile launching system
SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY
pioneer mosfet
SCR Inverter datasheet
NATIONAL IGBT
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lQFP256
Abstract: TEQFP208 QFP PACKAGE thermal resistance SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY BGA and QFP Package LQFP-256
Text: Technical Analysis Low-Cost Packaging Technology Using QFP Low-Cost Packaging Technology Using QFP The combination of bus bar technology and TEQFP technology is currently receiving attention in the development of a semiconductor package that realizes function
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JESD51-8
Abstract: JESD51-2 JEDEC JESD51-8 qfn 44 PACKAGE footprint 9mm surface mount package dimensions FREESCALE PACKING jesd51 8 JEDEC-STD-020 JEDEC-STD020 tqfp 44 PACKAGE footprint
Text: Freescale Semiconductor, Inc. ANALOG ICs INTEGRATED SOLUTIONS Freescale Semiconductor, Inc. PACKAGING Robust packaging is a key technology component of Analog Products. Motorola puts solutions together in single packages to accomodate power and high voltages.
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BR1568/D
JESD51-8
JESD51-2
JEDEC JESD51-8
qfn 44 PACKAGE footprint 9mm
surface mount package dimensions
FREESCALE PACKING
jesd51 8
JEDEC-STD-020
JEDEC-STD020
tqfp 44 PACKAGE footprint
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ipc 610D
Abstract: IPC-SM-7525A entek ht plus AN-9049 j-std-001d JESD22-B102D Fairchild, leadframe materials 100C IPC7525 J-STD-001C
Text: www.fairchildsemi.com Application Note AN-9049 Assembly Guidelines for Fairchild’s TinyBuck Packaging By Dennis Lang INTRODUCTION BOARD MOUNTING The Fairchild TinyBuck™ package is based on Molded Leadless Packaging MLP technology. This technology
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AN-9049
FAN2103MPX,
FAN2103EMPX,
FAN2106MPX,
FAN2106EMPX,
FAN2106MPX
AA3E249,
FAN2108MPX,
FAN2108EMPX,
FAN21SV06MPX,
ipc 610D
IPC-SM-7525A
entek ht plus
AN-9049
j-std-001d
JESD22-B102D
Fairchild, leadframe materials
100C
IPC7525
J-STD-001C
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pcb board of miniskiip 2
Abstract: semikron skiip IGBT Intelligent Power Module semikron semikron skiip SKIIP DRIVER SEMITOP weight miniskiip board SEMITOP 1 Package
Text: Reliable and cost effective power packages Pressure contacts in power semiconductor devices Autor: Klaus Backhaus, SEMIKRON International, e-mail: k.backhaus@semikron.com Introduction Power semiconductors ask for a modern packaging technology to achieve high output
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HC735
Abstract: 6 mhz quartz oscillator Quartz Oscillator AN279 analog Quartz Clock applications of blocking oscillator blocking oscillator applications HLMP-1485 quartz 20 MHZ Si500
Text: Advances in Silicon Technology Enables Replacement of Quartz-Based Oscillators I. Introduction With a market size estimated at more than $650M and more than 1.4B crystal oscillators supplied annually[1], quartz crystal oscillators have long been the preferred choice for clock generation in
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Si500
AN279:
HC735
6 mhz quartz oscillator
Quartz Oscillator
AN279
analog Quartz Clock
applications of blocking oscillator
blocking oscillator applications
HLMP-1485
quartz 20 MHZ
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Untitled
Abstract: No abstract text available
Text: TECHNOLOGY BACKGROUND &KLS6FDOH 3DFNDJLQJ IRU $0' ODVK 0HPRU\ 3URGXFWV 2 Chip-Scale Packaging Technology Background The AMD Fine-pitch Ball Grid Array FBGA) The FBGA package offers system designers a chip-scale package for Flash memories that provides a significant reduction in board real estate over TSOP packages and provides many
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Am29SL800
XXX-00-06/98
21627B
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Loctite 3567
Abstract: underfill Kester FDZ202P fbga Substrate design guidelines reflow hot air BGA fine BGA thermal profile reball INTEL underfill SMT
Text: Application Note 7001 March 2002 Guidelines for Mounting Fairchild’s BGA Packages Dennis Lang, Applications Engineer Introduction The development of MOSFETs in BGA packages was a technology breakthrough, producing a device that combined excellent thermal transfer characteristics, high-current handling capability, ultra-low profile
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4 PIN TO 220 IC
Abstract: dp 502 t
Text: Cherry Semiconductor offers a wide variety of traditional packages in addition to more advanced package technology. Flip Chip is an example of the advanced packaging technologies offered by Cherry Semiconductor. An application note included in this section explains the Flip Chip m anufacturing process and the m ethods available for Flip Chip assembly.
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