YEW-2755
Abstract: HP3478A MQ-1601 MC3015 MC30-101K MC30 High voltage
Text: MC30 Molded Chip Inductors A Dimensions In. B C A B C D E F G H I D F E I G Electrical Inductance Q: Measured on Q meter HP4342A, MQ1601. Self Resonant Frequency SRF: Measured on Impedance Analyzer HP4191A or HP4195A. DC Resistance RDC: Measured on Wheatstone Bridge
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HP4342A,
MQ1601.
HP4191A
HP4195A.
YEW-2755
HP3478A.
HP3478A
MQ-1601
MC3015
MC30-101K
MC30 High voltage
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led matrix 5x7 18
Abstract: 5 inch 5x7 Dot Matrix Display 14 pin diagram of LED dot matrix display 5x7 pin diagram of LED dot matrix display 5x7 pin diagram of LED dot matrix display 5x7 2 color 5 x 7 led dot matrix ALPHANUMERIC DISPLAY image DOT matrix LED display full decoder Ic led display board 8 x 8 Matrix LED Display Driver
Text: HDSP-2131, HDSP-2132, HDSP-2133, HDSP-2179 Eight Character 5.0 mm 0.2 inch Glass/Ceramic Intelligent 5x7 Alphanumeric Displays for Military Applications Data Sheet Description The HDSP-2131 (yellow), HDSP-2179 (orange), HDSP-2132 (high efficiency red) and the HDSP-2133
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HDSP-2131,
HDSP-2132,
HDSP-2133,
HDSP-2179
HDSP-2131
HDSP-2132
HDSP-2133
HDSP-213x
led matrix 5x7 18
5 inch 5x7 Dot Matrix Display
14 pin diagram of LED dot matrix display 5x7
pin diagram of LED dot matrix display 5x7
pin diagram of LED dot matrix display 5x7 2 color
5 x 7 led dot matrix
ALPHANUMERIC DISPLAY image
DOT matrix LED display full
decoder Ic led display board
8 x 8 Matrix LED Display Driver
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PDF
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3.3uH 1210 size inductor
Abstract: MCFT000154 inductor 100uH 2.2uH inductor 3.3uH inductor 4.7uH inductor MCFT000157 Inductor inductor 680uH INDUCTOR 220uH
Text: Wound Chip Ferrite Inductors Features: • • • • • Very strong solderability by flow soldering, soldering iron or wave soldering. Highly accurate dimensions, can be mounted automatically. Terminals are highly resistant to pull forces. Highly resistant to mechanical shocks and pressure.
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NL12T681
Abstract: NL05T100 NL12-T331 NL12-TC391 T120 crystal TC102 NL10 HP-4284 NL20 TR12
Text: Wound Chip Inductors Ferrite – NL Series These revolutionary, highly reliable wound chip inductors for automatic mounting, have been developed in response to the trend toward high density in electronic equipment. With metal terminals and a body of heat resistant resin, these inductors offer many superior features.
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100cycles
24hrs
1000hrs
NL12T681
NL05T100
NL12-T331
NL12-TC391
T120 crystal
TC102
NL10
HP-4284
NL20
TR12
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1R02
Abstract: rr0805 MIL-R-55342-D CHP CHP Vishay
Text: Data sheet E 2/3.720 - 10497 CHP HCHP ESA SCC 4001 CECC in progress high stability resistor chips – thick film technology SFERNICE thick film resistor chips are especially designed to meet very stringent specifications in terms of reliability, stability, homogeneity, reproductibility and quality.
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MIL-R-55342
1R02
rr0805
MIL-R-55342-D CHP
CHP Vishay
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28F160
Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING
Text: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than
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Zentech
Abstract: air humidity HP4285 INDUCTOR DIP Mil-std
Text: Reliability test conditions Part 04/2003 EMC & Inductive Solutions Max- Eyth-Str. 1 D-t4638 Waldenburg SMD WE-PD – Series 74477xxx QS-Level: Standard: MIL-STD-202F Method 215 AQL Visual 0.25% Electrical(0.015%) Characteristic DC Resistance(Rdc) Performance
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D-t4638
74477xxx
MIL-STD-202F
HP4285
Zentech3305
Zentech
air humidity
INDUCTOR DIP Mil-std
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MQ-1601
Abstract: No abstract text available
Text: Molded Chip Inductors A Dimensions In. A B C D E F G H I Allied Part Number MC20-R005M MC20-R010M MC20-R012M MC20-R015M MC20-R018M MC20-R022M MC20-R027M MC20-R033M MC20-R039M MC20-R047M MC20-R056M MC20-R068M MC20-R082M MC20-R10M MC20-R12M MC20-R15M MC20-R18M
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MC20-R005M
MC20-R010M
MC20-R012M
MC20-R015M
MC20-R018M
MC20-R022M
MC20-R027M
MC20-R033M
MC20-R039M
MC20-R047M
MQ-1601
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PDF
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YEW-2755
Abstract: HP3478 HP3478A top magnetics corporation top magnetics HWI322522-1R5M HWI322522-100K HWI322522-1R0M HWI322522-220K HWI322522-330K
Text: SPECIFICATION FOR APPROVAL Product Name MOLDED WIREWOUND CHIP INDUCTOR HIGH CURRENT TMC Part No. HWI322522 SERIES Page 2 Rev. No. 5. ELECTRICAL CHARACTERISTICS : TMC Part No. HWI322522-1R0M HWI322522-1R5M HWI322522-2R2M HWI322522-3R3M HWI322522-4R7M HWI322522-6R8M
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HWI322522
HWI322522-1R0M
HWI322522-1R5M
HWI322522-2R2M
HWI322522-3R3M
HWI322522-4R7M
HWI322522-6R8M
HWI322522-100K
HWI322522-150K
HWI322522-220K
YEW-2755
HP3478
HP3478A
top magnetics corporation
top magnetics
HWI322522-1R5M
HWI322522-100K
HWI322522-1R0M
HWI322522-220K
HWI322522-330K
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Copper wire to inductors
Abstract: R 4R7 inductor HWI322522-100 HWI322522-150 HWI322522-1R0 HWI322522-1R5 HWI322522-2R2 HWI322522-3R3 HWI322522-4R7 HWI322522-6R8
Text: MOLDED WIREWOUND CHIP INDUCTORS HWI322522 SERIES 1. PART NO. EXPRESSION : HW I 3 2 2 5 2 2 - 1 R 0 K F a (b) (c) (d)(e) (a) Series code (d) Tolerance code : K = ±10%, M = ±20% (b) Dimension code (e) F : Lead Free (c) Inductance code : 1R0 = 1.00uH 2. CONFIGURATION & DIMENSIONS :
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HWI322522
Specifica15
Copper wire to inductors
R 4R7 inductor
HWI322522-100
HWI322522-150
HWI322522-1R0
HWI322522-1R5
HWI322522-2R2
HWI322522-3R3
HWI322522-4R7
HWI322522-6R8
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pcb warpage in ipc standard
Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)
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NATIONAL SEMICONDUCTOR ink MARKING
Abstract: Die Attach epoxy stamping cte table flip chip substrate cte table ic bga JESD 49 gold wire bond failures due to ultrasonic cleaning Aluminum alloys physical properties FLIP CHIP PRODUCTS micro machine thermal conductivity coefficient of thermal expansion of thermal conductive pressure sensitive adhesive
Text: September 2000 Die Products Business Unit as watches, calculators and smart cards as well as leading edge multiple die applications like cellular handsets and digital cameras. Better device performance utilizing die show up in processor modules for computers, workstations and servers as
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5r6 inductor
Abstract: HWI453232 HWI453232-1R0 HWI453232-1R2 HWI453232-1R5 HWI453232-1R8 HWI453232-2R2 HWI453232-2R7 HWI453232-3R3 HWI453232-3R9
Text: MOLDED WIREWOUND CHIP INDUCTORS HWI453232 SERIES 1. PART NO. EXPRESSION : HW I 4 5 3 2 3 2 - 1 R 0 K F a (b) (c) (d)(e) (a) Series code (d) Tolerance code : K = ±10%, M = ±20% (b) Dimension code (e) F : Lead Free (c) Inductance code : 1R0 = 1.00uH 2. CONFIGURATION & DIMENSIONS :
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HWI453232
5r6 inductor
HWI453232-1R0
HWI453232-1R2
HWI453232-1R5
HWI453232-1R8
HWI453232-2R2
HWI453232-2R7
HWI453232-3R3
HWI453232-3R9
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WI322522-101
Abstract: marking code diode R12 FWI322522-R39 FWI322522-R47 YEW-2755 WI322522-R12KF
Text: MOLDED WIREWOUND CHIP INDUCTORS WI322522 SERIES 1. PART NO. EXPRESSION : WI322522-R12KF a (b) (c) (d)(e) (f) (a) Series code (d) Tolerance code : J = ±5%, K = ±10%, M = ±20% (b) Dimension code (e) F : RoHS Compliant (c) Inductance code : R12 = 0.12uH (f) 11 ~ 99 : Internal controlled number
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WI322522
WI322522-R12KF
WI322522-101
marking code diode R12
FWI322522-R39
FWI322522-R47
YEW-2755
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HPE4991A
Abstract: WI-453232-4R7
Text: MOLDED WIREWOUND CHIP INDUCTORS WI453232 SERIES 1. PART NO. EXPRESSION : WI453232-R10JF a (b) (c) (d)(e) (a) Series code (d) Tolerance code : J = ±5%, K = ±10%, M = ±20% (b) Dimension code (e) F : Lead Free (c) Inductance code : R10 = 0.10uH 2. CONFIGURATION & DIMENSIONS :
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WI453232
WI453232-R10JF
HPE4991A
WI-453232-4R7
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OMFZ2
Abstract: No abstract text available
Text: SPECIFICATION FOR APPROVAL REF : PAGE: 1 PROD. NAME WOUND CHIP INDUCTOR CC2520□□□□2□ ABC'S DWG NO. ABC'S ITEM NO. Ⅰ﹒CONFIGURATION & DIMENSIONS： 1R0 Marking : 2.5±0.2 m/m B : 2.0±0.2 m/m C : 1.8±0.2 m/m E : 1.4±0.1 m/m F : 0.45 m/m F F A
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CC2520â
E79029
E79029A
E59481
BM-21
BM-22
BM-23
EME-1100
EME-1200
EME-5961C
OMFZ2
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Intel reflow soldering profile BGA
Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems
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PBGA 256 reflow profile
Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)
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transistor b 1238
Abstract: PCB design for very fine pitch csp package tray datasheet bga 8x9 5 ball csp drawing BGA PACKAGE TOP MARK intel land pattern BGA 0.75 SCR Manual, General electric databook N4646 15 ball CSP bga 6x8 tray dimension
Text: The Micro Ball Grid Array µBGA Package The Micro Ball Grid Array (µBGA*) Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than
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E 102 M
Abstract: CC3225 E59481 AE001 eme-1100 EME-5961C 94hb HP16034E EME-1200 CC3225101KL
Text: SPECIFICATION FOR APPROVAL REF : PAGE: 1 PROD. NAME ABC'S DWG NO. WOUND CHIP INDUCTOR CC3225□□□□L□ ABC'S ITEM NO. Ⅰ﹒CONFIGURATION & DIMENSIONS： 100 Marking Inductance code 2.9±0.2 A : 3.2±0.4 m/m B : 2.5±0.2 m/m C : 2.2±0.2 m/m E : 1.0±0.2
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CC3225L
E59481
BM-21
BM-22
BM-23
EME-1100
EME-1200
EME-5961C
AE-001A
E 102 M
CC3225
E59481
AE001
eme-1100
EME-5961C
94hb
HP16034E
EME-1200
CC3225101KL
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at2910
Abstract: BT3000 SP8 taymar lt2900 BL0870 fusilier LIGHTER B873 LG980 pt2950 HG753 BURNER
Text: SPARES & ACCESSORIES PART NO PACK QTY. EAN PACKAGE Flame Spreader - For use with ET2850 Gas Torch. BL0870 and LG980 Blowlamps. Gives a broad flat flame ideal for paint stripping. Push-fit. 5012832 070101 Display Card 6 Pencil Flame Burner • For use with ET2850 Gas Torch,
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ET2850
BL0870
LG980
HG3750
at2910
BT3000
SP8 taymar lt2900
fusilier LIGHTER
B873
pt2950
HG753
BURNER
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PDF
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Untitled
Abstract: No abstract text available
Text: REVISIONS A LL RIGHTS RESERVED. NO PORTION OF THIS PUBLICATION, WHETHER IN WHOLE OR IN PART CAN BE REPRODUCED WITHOUT THE EXPRESS WRITTEN CONSENT O F SPC TECHNOLOGY. DCP # REV DESCRIPTION 2048 TECH N O L O G Y DOC. NO. SPC— F005 RELEASED DRAWN DATE JN
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1000hrs
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PDF
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Untitled
Abstract: No abstract text available
Text: Molded Chip Inductors MC30 Dimensions In. MC30 Allied Part Number MC30-R10M MC30-R12M MC30-R15M MC30-R18M MC30-R22M MC30-R27M MC30-R33M MC30-R39M MC30-R47M MC30-R56M MC30-R68M MC30-R82M MC30-1R0K MC30-1R2K MC30-1R5K MC30-1R8K MC30-2R2K MC30-2R7K MC30-3R3K
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MC30-R10M
MC30-R12M
MC30-R15M
MC30-R18M
MC30-R22M
MC30-R27M
MC30-R33M
MC30-R39M
MC30-R47M
MC30-R56M
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ELL8 P
Abstract: utfb bedok ELL8UV100M coil chip land spec ELL8UV270M 4R7 COIL CHIP
Text: 25 FEB 200! Si'NCOM INDUCTIVE TECH. Approval Specifications CUSTOMER Digi Key PART NAME CHIP CHOKE COIL CUSTOMER PART No. MATSUSHITA PART No. ELL8UVanoa MODEL NAM E/No. INDONESIA MANUFACTURED IN CUSTOMER'S ACKNOWLEDGEMENT PLEASE RETURN ONE COPY MATSUSHITA ELECTRONIC COMPONENTS S PTE. LTD.
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T1S-05013
100mm
400mm
22-Feb-2005
151-ELL8-023
500pcs.
ELL8 P
utfb
bedok
ELL8UV100M
coil chip land spec
ELL8UV270M
4R7 COIL CHIP
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