SAMSUNG 2012 Search Results

SAMSUNG 2012 Result Highlights (5)

Part	Manufacturer	Description
20121C00BD	Amphenol Communications Solutions	Elite Backplane connectors, BMA 12pair, 8position, NiS
MD28F020-12/B	Rochester Electronics LLC	Replacement for Intel part number MD28F020-12. Buy from authorized manufacturer Rochester Electronics.
MD28F020-12/R	Rochester Electronics LLC	28F020 - 256K X 8 Flash, Mil Temp
ME3220-123KLB	Coilcraft Inc	General Purpose Inductor, 12uH, 10%, 1 Element, Ferrite-Core, SMD, 1211, ROHS COMPLIANT
SER2012-681MLD	Coilcraft Inc	General Purpose Inductor, 0.68uH, 20%, 1 Element, Ferrite-Core, SMD, 7674, ROHS COMPLIANT

SAMSUNG 2012 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: SPECIFICATION • Supplier : Samsung electro-mechanics • Samsung P/N: RC2012FCS • Product : Thick - Film chip RESISTOR • Description : 2012, ±1%, 1Ω~1㏁ , 1/8W A. Samsung Part Number RC 2012 F CS ① ③ ④ ⑤ ② ① Code designation Samsung Thick - Film Chip Resistor	Original	PDF	RC2012F* 10seconds 100cycles, /30min 125/30min 000hours 90min 30min
Untitled Abstract: No abstract text available Text: SPECIFICATION • Supplier : Samsung electro-mechanics • Samsung P/N: RC2012GCS • Product : Thick - Film chip RESISTOR • Description : 2012, ±2%, 1Ω~1㏁ , 1/8W A. Samsung Part Number RC 2012 G CS ① ③ ④ ⑤ ② ① Code designation Samsung Thick - Film Chip Resistor	Original	PDF	RC2012G* 10seconds 100cycles, /30min 125/30min 000hours 90min 30min
S3FM02G Abstract: No abstract text available Text: S3FM02G 32-Bit CMOS Microcontrollers Revision 1.34 August 2012 User's Manual  2012 Samsung Electronics Co., Ltd. All rights reserved. Important Notice Samsung Electronics Co. Ltd. "Samsung" reserves the right to make changes to the information in this publication	Original	PDF	S3FM02G 32-Bit S3FM02G S3FM02G. 128-ETQFP-1414 128-ETQFP-1414 128ETQFP-1414
Untitled Abstract: No abstract text available Text: SPECIFICATION • Supplier :Samsung electro-mechanics • Product : Tantalum capacitor • Samsung P/N : TCSCS0J336MPAR • User Part No : • Description : CAP,TANTAL,33㎌,6.3V,±20%,2012-12 • Date : Aug 23, 2013 1. Samsung Part Number TC ① ① ② ③	Original	PDF	TCSCS0J336MPAR 10sec.
chip resistor 2012 Abstract: samsung 2012 Text: SPECIFICATION • Supplier : Samsung electro-mechanics • Samsung P/N: RC2012JCS • Product : Thick - Film chip RESISTOR • Description : 2012, ±5%, 1Ω~10㏁ , 1/8W A. Samsung Part Number RC 2012 J CS ① ③ ④ ⑤ ② ① Code designation	Original	PDF	RC2012J* 10seconds 100cycles, /30min 125/30min 000hours 90min 30min chip resistor 2012 samsung 2012
Untitled Abstract: No abstract text available Text: S3FM02G 32-Bit CMOS Microcontrollers Revision 1.20 October 2011 User's Manual  2011 Samsung Electronics Co., Ltd. All rights reserved. Important Notice Samsung Electronics Co. Ltd. "Samsung" reserves the right to make changes to the information in this publication	Original	PDF	S3FM02G 32-Bit S3FM02G S3FM02G. 128-ETQFP-1414 128-ETQFP-1414 128ETQFP-1414
MMZ1608S121AT Abstract: nc10 samsung 45-D2 Samsung ddr2 7SZ14 BA09-00009A INTEL945GMS SMD y8 samsung nc10 bios Socket AM2 Text: 4 3 1 2 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents D RIMINI CPU : INTEL YONAH-ULV	Original	PDF	945GMS BA41-00680A BA41-00683A Pag614 TP18615 TP18616 TP18617 TP18618 TP18619 TP18620 MMZ1608S121AT nc10 samsung 45-D2 Samsung ddr2 7SZ14 BA09-00009A INTEL945GMS SMD y8 samsung nc10 bios Socket AM2
Q514 Abstract: du508 Samsung ddr2 MIC500 EMI502 BA59-01869A BA09-00009A samsung hd50 d4.0 34C1 mx25l8005m2c-15g Text: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents D RIMINI CPU : INTEL YONAH-ULV	Original	PDF	945GMS BA41-00680A BA41-00683A TP18615 TP18616 TP18617 TP18618 TP18619 TP18620 TP18621 Q514 du508 Samsung ddr2 MIC500 EMI502 BA59-01869A BA09-00009A samsung hd50 d4.0 34C1 mx25l8005m2c-15g
ST T4 D560 Abstract: ST D560 T4 ST 1803 DHI B-566 u574 j5512 46d1 BA09-00009A SAMSUNG GDDR3 54B4 Text: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents CICHLID 3 CPU :Intel Yonah 533/667 Merom	Original	PDF	YONAH667 Sheet18. Sheet19. Sheet20 Sheet24. Sheet25 Sheet29. Sheet30 Sheet32. Sheet33. ST T4 D560 ST D560 T4 ST 1803 DHI B-566 u574 j5512 46d1 BA09-00009A SAMSUNG GDDR3 54B4
c945 g 528 Abstract: RX781M smd diode ae c604 SLG8SP628VTR 88E8057 RX781 SB700 slg8sp628v 22p smd H8S-2110B Text: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents QingDao-D D Model Name PBA Name	Original	PDF	ALC272 Sheet46 Sheet47 Sheet48 Sheet49 sheet12] Sheet50 c945 g 528 RX781M smd diode ae c604 SLG8SP628VTR 88E8057 RX781 SB700 slg8sp628v 22p smd H8S-2110B
AES2501 Abstract: ICS954305 TP960 C703 diode tp1332 VDD3310 TP950 33B3 diode DEBUG32 block diagram of intel 8254 chip Text: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. TABLE OF CONTENTS D FIRENZE-R C B CPU : Chip Set :	Original	PDF	CONTROLLERP1311 TP1312 TP1313 TP1314 TP1251 TP1252 TP1253 TP1254 TP1255 TP1256 AES2501 ICS954305 TP960 C703 diode tp1332 VDD3310 TP950 33B3 diode DEBUG32 block diagram of intel 8254 chip
MEC1308-NU Abstract: APW7141QAITRG AMD CPU S1g3 rx881 RX881M DIODE SMD AE22 TPS51125 N25 3KV SEC APW7141 mec1308 Text: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents Page. 1 Page. 2 Page. 3 Page. 4	Original	PDF	VDD18 BA41-xxxxxxA MEC1308-NU APW7141QAITRG AMD CPU S1g3 rx881 RX881M DIODE SMD AE22 TPS51125 N25 3KV SEC APW7141 mec1308
Untitled Abstract: No abstract text available Text: ISSUE NO : Rev: DATE OF ISSUE : 2012.11.19 SPECIFICATION MODEL : SPSWH1S16S2G White Side View CUSTOMER : CUSTOMER CHECKED CHECKED APPROVED SAMSUNG ELECTRONICS CO., LTD. DRAWN CHECKED APPROVED SAMSUNG ELECTRONICS CO,.LTD. SAN #24 NONGSEO-DONG, GIHEUNGGIHEUNG-GU,	Original	PDF	SPSWH1S16S2G SPSWH1S16S2G)
Untitled Abstract: No abstract text available Text: ISSUE NO : Rev: DATE OF ISSUE : 2012.11.19 SPECIFICATION MODEL : SPSWH2S25S3G WHITE SIDE VIEW CUSTOMER : CUSTOMER CHECKED CHECKED APPROVED SAMSUNG ELECTRONICS DRAWN CHECKED APPROVED SAMSUNG ELECTRONICS CO,.LTD. SAN #24 NONGSEO-DONG, GIHEUNGGIHEUNG-GU, YONGINYONGIN-CITY,	Original	PDF	SPSWH2S25S3G SPSWH2S25S3G)

B30C300 Abstract: 29A4 samsung electronics 10K 34C1 TP678 gfx E3 diode diode 39b2 TP730 NC7SZ175P6X_NL HDR-10P-SMD Text: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents Sheet 1. COVER Sheet 2 - 7. DIAGRAM Block/Power & ANNOTATIONS	Original	PDF	BA41-00574A YONAH667 Sheet18. Sheet19. 047nF RHU002N06 12-C4 B30C300 29A4 samsung electronics 10K 34C1 TP678 gfx E3 diode diode 39b2 TP730 NC7SZ175P6X_NL HDR-10P-SMD
BA41-00695A Abstract: TP1274 CONN-50P-FPC Socket AM2 samsung 30 pin lvds diagram 25a44 SMD AC P27 CY28447 samsung electronics ba41 GND103 Text: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents D Sheet 1. COVER Sheet 2 - 7. DIAGRAM Block/Power & ANNOTATIONS	Original	PDF	BA41-00694A BA41-00695A YONAH667 047nF RHU002N06 12-C4 TP1274 CONN-50P-FPC Socket AM2 samsung 30 pin lvds diagram 25a44 SMD AC P27 CY28447 samsung electronics ba41 GND103
Untitled Abstract: No abstract text available Text: ISSUE NO : Rev: DATE OF ISSUE : 2012.11.19 SPECIFICATION MODEL : SPSWH2S26S2G WHITE SIDE VIEW CUSTOMER : CUSTOMER CHECKED CHECKED APPROVED SAMSUNG ELECTRONICS CO., LTD. DRAWN CHECKED APPROVED SAMSUNG ELECTRONICS CO., Ltd. td. SAN #24 NONGSEONONGSEO-DONG, DONG, GIHEUNGGIHEUNG-GU,	Original	PDF	SPSWH2S26S2G SPSWH2S26S2G)
K4X2G323PD8GD8 Abstract: K9HFGY8S5A-HCK0 K4H511638JLCCC samsung eMMC 5.0 KLMBG4GE2A-A001 K9K8G08U0D-SIB0 K4X51163PK-FGD8 KLMAG2GE4A k4h561638n-lccc K4G10325FG-HC03 Text: PRODUCT SELECTION GUIDE Displays, Memory and Storage 2H 2012 Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, mobile, and graphics memory are found in computers—from	Original	PDF	BR-12-ALL-001 K4X2G323PD8GD8 K9HFGY8S5A-HCK0 K4H511638JLCCC samsung eMMC 5.0 KLMBG4GE2A-A001 K9K8G08U0D-SIB0 K4X51163PK-FGD8 KLMAG2GE4A k4h561638n-lccc K4G10325FG-HC03
Untitled Abstract: No abstract text available Text: SPECIFICATION • Supplier :Samsung electro-mechanics • Product : Tantalum capacitor • Samsung P/N : TCSHS0J226MPAR • User Part No : • Description : CAP,TANTAL,22㎌,6.3V,±20%,2012-12 • Last Revision Date :December.28.2009 • Date :November 16. 2009	Original	PDF	TCSHS0J226MPAR Perfo150% 10sec.
88E8057 Abstract: M82-SCE-XT BA41-00XXXA HDR-10P-1R-SMD RX781M 11070 J2 HDR-4P-1R-SMD R5538 SI2315BDS-T1 U528 Text: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED 4 BY SAMSUNG. D Cambridge g n l u a s i t m n a e S fid n o	Original	PDF	RX781M SB700 BA41-00XXXA DISCLOSsheet31] heet32 sheet32] heet33 sheet33] heet34 sheet34] 88E8057 M82-SCE-XT BA41-00XXXA HDR-10P-1R-SMD RX781M 11070 J2 HDR-4P-1R-SMD R5538 SI2315BDS-T1 U528
samsung ddr3 ram MTBF Abstract: KLM2G1HE3F-B001 KLM4G1FE3B-B001 KLMAG2GE4A-A001 k4B2G1646 KLMAG KLM8G2FE3B-B001 K4B2G0446 klm8g k4x2g323pd Text: PRODUCT SELECTION GUIDE LCD, Memory and Storage \| 1H 2012 + Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, SRAM products are found in computers—from ultra-mobile notebooks	Original	PDF	BR-12-ALL-001 samsung ddr3 ram MTBF KLM2G1HE3F-B001 KLM4G1FE3B-B001 KLMAG2GE4A-A001 k4B2G1646 KLMAG KLM8G2FE3B-B001 K4B2G0446 klm8g k4x2g323pd
S3FN60D Abstract: S3FN60D_UM_REV1.30 Text: S3FN60D USB Remote 32-bit MCU Revision 1.30 January 2012 User's Manual  2012 Samsung Electronics Co., Ltd. All rights reserved. Important Notice Samsung Electronics Co. Ltd. “Samsung” reserves the right to make changes to the information in this publication	Original	PDF	S3FN60D 32-bit S3FN60D 64-pin S3FN60D_UM_REV1.30
Untitled Abstract: No abstract text available Text: Rev: 0.0 ISSUE NO : DATE OF ISSUE : Feb. 27 2012 SPECIFICATION MODEL : SPFCW04301BL High Power Flash LED CUSTOMER : CUSTOMER : CHECKED CHECKED APPROVED SAMSUNG LED DRAWN CHECKED APPROVED SAMSUNG LED CO,.LTD. Nongseo-dong, Giheung-gu, Yongin-si, Gyeonggi-do, 446-711 KOREA	Original	PDF	SPFCW04301BL
Untitled Abstract: No abstract text available Text: Rev: 0.0 ISSUE NO : DATE OF ISSUE : Feb. 27 2012 SPECIFICATION MODEL : SPFCW14311BD High Power Flash LED CUSTOMER : CUSTOMER : CHECKED CHECKED APPROVED SAMSUNG LED DRAWN CHECKED APPROVED SAMSUNG LED CO,.LTD. Nongseo-dong, Giheung-gu, Yongin-si, Gyeonggi-do, 446-711 KOREA	Original	PDF	SPFCW14311BD elcyc1/srh42 Am003

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SAMSUNG 2012 Search Results

SAMSUNG 2012 Result Highlights (5)

SAMSUNG 2012 Datasheets Context Search

Untitled

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S3FM02G

Untitled

chip resistor 2012

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MMZ1608S121AT

Q514

ST T4 D560

c945 g 528

AES2501

MEC1308-NU

Untitled

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B30C300

BA41-00695A

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K4X2G323PD8GD8

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88E8057

samsung ddr3 ram MTBF

S3FN60D

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