Untitled
Abstract: No abstract text available
Text: DIP 14PIH OU TL IN E DR AWING DIP14-P-300 733 Un it in m m DIP 16PIN OUTLINE DRAWING (DIP16-P-30QA)_ Unit in m m DIP 1 SP IN OU TL IN E DR AW IN G (DIP18-P-300A) 18 U nit in mm 10 n i—i r—t i—> i—i i—i r-> -H u i i i i i ri i i ii ii i
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OCR Scan
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14PIH
DIP14-P-300)
16PIN
DIP16-P-30QA)
DIP18-P-300A)
20PIN
DIP20-P-300A)
DIP24-P-300)
24PIN
DIP24-P-600)
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PDF
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DIP18
Abstract: DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30
Text: 包装仕様一覧 1.概要 新日本無線は電子機器の軽薄短小化更には自動実装による省力化のニーズに対して、スティックケース、粘着テーピング、エンボステーピ ング、トレイ及びビニール袋にて出荷しております。
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Original
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50pcs/
25pcs/
20pcs/
16pcs/
10pcs/
DIP16
DIP18
DIP18
DIP20
DIP40
SDIP22
SDIP24
SDIP28
SDIP30
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PDF
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SS0P20
Abstract: NJM2366 NJM2366G NJM2366V SS0P-20
Text: NJM2366 C0BS NJM 2366IÌ, 4 1 • S jfiic - e fo r t S P i S t a i t ic cfc y , £ 1/ 1 3 f r b 1/ 1 9 £ - e f f ig i:l£ $ - t ? 5 £ T o l¡t# [ • r t « in l^ J : y i/ 1 3 ~ 1 / 1 9 / U T X A ''R r t g • 5 ¡Ü *< 0 1 Ü i± # ¡!£ • • a iÄ B ä S ^ t L '
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OCR Scan
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NJM2366
NJM2366IÃ
/13fr
SS0P-20)
S0P20,
SS0P20
NJM2366G
NJM2366V
NJM2366
S0P20)
SS0P-20
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PDF
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1P040
Abstract: 0FP100
Text: PACKAGE CODE • PACKAGE GODE TABLE NJRC vs. EIAJ GODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. EIAJ CODE NJRC CODE <DIP> DIP8 DIP14 DIP16 DIP18 DIP20 DIP22 DIP24
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OCR Scan
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DIP14
DIP16
DIP18
DIP20
DIP22
DIP24
DIP40
SDIP22
SDIP24
SDIP28
1P040
0FP100
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PDF
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Untitled
Abstract: No abstract text available
Text: RECOMMENDED MOUNTING METHOD • RECOMMENDED MOUNTING METHOD 1.Soldering Methods The recommended soldering methods for each package are shown in the following table. 1 Recommended Soldering Methods Table Through-Hole mounted device type package PKG TO-92
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OCR Scan
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T0-220F
DIP14
DIP16
DIP18
DIP20
DIP22
DIP28
DIP40
SDIP22
SDIP24
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PDF
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SSOP10
Abstract: DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30
Text: PACKING SPECIFICATION TABLE • General Description NJRC delivers ICs in 4 methods, plastic tube container, two kinds of Taping, tray and vinyl bag packing. Except adhesive tape treated anti electrostatic and contain carbon are using as the ESD Electrostatic
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Original
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25pcs/tube
20pcs/tube
14pcs/tube
10pcs/tube
SSOP10
SSOP10
DIP18
DIP20
DIP40
SDIP22
SDIP24
SDIP28
SDIP30
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PDF
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CXD1255Q
Abstract: cxa1337 cx-7925b sony frequency synthesizer pll ILX501 lhi 778 cn/A/U 237 BG CXD1149 Semicon volume 1 IU02 icx024
Text: Semiconductor IC Semiconductor Integrated Circuit Data Book 1992 List of Model Names/ Index by Usage Description CCD Image Sensor Color CCD Image Sensor (Black/White) CCD Image Sensor System Scanning System IC for Video Camera Signal Processing IC for Video
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Original
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DE91Z22-HP
CXD1255Q
cxa1337
cx-7925b sony frequency synthesizer pll
ILX501
lhi 778
cn/A/U 237 BG
CXD1149
Semicon volume 1
IU02
icx024
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PDF
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Untitled
Abstract: No abstract text available
Text: PACKAGE CODE • PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE EIAJ CODE <DIP> DIP8 DIP14 DIP16 DIP18 DIP20 DIP22 DIP24
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OCR Scan
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DIP14
DIP16
DIP18
DIP20
DIP22
DIP24
DIP40
SDIP22
SDIP24
SDIP28
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PDF
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BA1405F
Abstract: BA1335 BA6U BA8221 BA34168L ba843 BA8221AN BA3528FP 4236L BA-1320
Text: ICs for Audio Applications Block Diagram of Typical Applications 3V FM/AM stereo headphone system Front end B A 4425 20mW X 2 Mute sensor Í B A 3708 j VD 3V 32 n f HEADPHONES Stereo double cassette recorder system with radio and CD player IF+MPX U tM P X
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OCR Scan
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BA1442A
BA1448S
BA1332
BU2614
BU2616
BU2615
BU2611
BU2619
BU2621
BA1407A
BA1405F
BA1335
BA6U
BA8221
BA34168L
ba843
BA8221AN
BA3528FP
4236L
BA-1320
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PDF
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CDB455C3
Abstract: CXA1184M CXA1184N CDB455 QFP Package 128 lead .5mm
Text: CXA1184M/N Sony. Low-voltage FM IF Amplifier Unit: mm Package Outline CXA1184M Description C X A 1 184 M and C X A 1 184N are designed for FM communication devices. They incorporate a paging system, mixer, IF limiter, FM detector, operational amplifier, comparator, and others.
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OCR Scan
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CXA1184M/N
CXA1184M
CXA1184N
50MIL)
127mm
CDB455C3
CDB455
QFP Package 128 lead .5mm
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PDF
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DIP20
Abstract: DMP16 QFP44 SDIP22 SDIP24 SDIP28 SDIP42 SDMP30 S0P20
Text: 包装仕様一覧 1.概要 新日本無線は電子機器の軽薄短小化更には自動実装による省力化のニーズに対して、スティックケース、粘着テーピング、エンボステーピ ング、トレイ及びビニール袋にて出荷しております。
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Original
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DIP16
DIP20
25pcs/
20pcs/
14pcs/
50pcs/
DIP20
DMP16
QFP44
SDIP22
SDIP24
SDIP28
SDIP42
SDMP30
S0P20
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PDF
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50PCS
Abstract: DIP18 DIP20 DIP32 DIP40 SDIP22 SDIP24 SDIP28
Text: 包装仕様一覧 1.概要 新日本無線は電子機器の軽薄短小化更には自動実装による省力化のニーズに対して、スティックケース、エンボステーピング、トレイ及び ビニール袋にて出荷しております。
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Original
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DIP14
DIP16
DIP18
DIP20
DIP22
DIP24
DIP32
DIP40
SDIP22
SDIP24
50PCS
DIP18
DIP20
DIP32
DIP40
SDIP22
SDIP24
SDIP28
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PDF
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SS0P24
Abstract: SS0P-24 QFP64-E1 SS0P14 144/QFP64-E1
Text: csa RECOMMENDED MOUNTING METHOD A • RECONENDED MOUNTING METHOD 1.Solderins Methods The recommended soldering methods for each package are shown in the following table. 1 Recommended Soldering Methods Table Through-Hole mounted device type package PKG TO-92
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OCR Scan
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T0-220F
DIP14
DIP16
DIP18
DIP20
DIP22
DIP28
DIP40
SDIP22
SDIP24
SS0P24
SS0P-24
QFP64-E1
SS0P14
144/QFP64-E1
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PDF
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DIP18
Abstract: DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30
Text: 包装仕様一覧 1.概要 新日本無線は電子機器の軽薄短小化更には自動実装による省力化のニーズに対して、スティックケース、粘着テーピング、エンボステーピ ング、トレイ及びビニール袋にて出荷しております。
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Original
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50pcs/
25pcs/
20pcs/
16pcs/
10pcs/
DIP16
DIP18
DIP18
DIP20
DIP40
SDIP22
SDIP24
SDIP28
SDIP30
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PDF
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|
Untitled
Abstract: No abstract text available
Text: •SIP/HSIP{POWER TYPE /ZIP/SZIP T0220FP TO-92 ¿ 3 .2 ± 0 .1 n I 2.8 ?T 0.5±0.1 1.27 ! I 0 .45±D. I 1.27 2 .5 4 ± 0 .5 [2 .5 4 ± 0 . 5 Q‘ S ^ a SIPS P ll.8±0.2 2.d±0.2 □ U °-6 U 3 _c I °_'._55±0-1 I I 0.8 0 45±Q. I I".3 2.54 ]2.64 ^ SIPS SIP7
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OCR Scan
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T0220FP
DIP22
DIP24
DIP28
VQFP64
VQFP80
VQFP100
VQFP144
VQFP208
UQFP160
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PDF
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Untitled
Abstract: No abstract text available
Text: SONY. C X L 1 5 0 4 M CMOS-CCD 1 H Delay line for NTSC D e s c rip tio n C X L 1 50 4M is a delay line used in conjunction with an external low pass filier. Through P a c k a g e O u tlin e U n it mm 20 pin SOP plastic negative phase input and positive phase output
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OCR Scan
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S0P-20P-L0S
B3B23Ã
CXL1504M
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PDF
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S4 6ba
Abstract: No abstract text available
Text: TOSHIBA TLCS-47E Series TMP47C102/202 CMOS 4-Bit Microcontroller The 47C102/202 are high speed and high performance 4-bit single chip microcomputer, integrating ROM, RAM, input/out put ports and timer/counters on a chip. The 47C102/202 are the standard type devices in the TLCS-47E series.
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OCR Scan
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TLCS-47E
TMP47C102/202
47C102/202
TMP47C102P
TMP47C102M
EIP20
S0P20
TMP47P202VP
S4 6ba
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PDF
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T0220FP-5-V5
Abstract: No abstract text available
Text: Packaging Specifications Monolithic 1C ^ Monolithic ICs _ Quick reference of packaging specifications Package Container type DIP/SDIP Tube container SIP/HSIP/ZIP/SZIP Tube container Packaging specification code Tube container SO P/SSO P/HSO P Paper tape on reel
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OCR Scan
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T0220FP
T0220FP-5-V5
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PDF
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NJM2366
Abstract: NJM2366G NJM2366V SSOP20
Text: NJM2366 i « * NJM2366IÌ» £ • *icr*-r. * M » * J | M t Œ £ i/ i3 f r 61/19 mm • P*3S?fitn;iC ef c y i / 1 3 ~ 1 / 1 9 / W 7 X A < B l | | g • 5¡Ü*ICD*E£± • « » * * * • ffi*lW3ÌEA<*£l' • • ' I ' M i t / t v ' r — is SS0P-20
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OCR Scan
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NJM2366
SS0P-20)
S0P20,
SS0P20
NJM2366G
NJM2366V
SSOP20)
1/13BIAS
NJM2366V
SSOP20
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PDF
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25pcs
Abstract: DIP20 DMP16 SDIP22 SDIP24 SDIP28 SDIP42 SDMP30
Text: PACKING SPECIFICATION TABLE 1. GENERAL DESCRIPTION NJRC delivers ICs in 4 method of plastic tube container, two kind of Taping, tray and vinyl bag packing. Expect adhesive tape treated anti electrostatic and contain carbon are using as the ESD Electrostatic Discharge
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Original
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25pcs
20pcs
14pcs
50pcs
000pcs
500pcs
DIP20
DMP16
SDIP22
SDIP24
SDIP28
SDIP42
SDMP30
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PDF
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DIP18
Abstract: DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30 QFP-56
Text: 包装仕様一覧 1.概要 新日本無線は電子機器の軽薄短小化更には自動実装による省力化のニーズに対して、スティックケース、粘着テーピング、エンボステーピ ング、トレイ及びビニール袋にて出荷しております。
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Original
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50pcs/
25pcs/
20pcs/
16pcs/
10pcs/
DIP16
DIP18
DIP18
DIP20
DIP40
SDIP22
SDIP24
SDIP28
SDIP30
QFP-56
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PDF
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