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    Theta-JC QFP die down

    Abstract: G30-88 Theta-J G38-87 Theta JB
    Text: Freescale Semiconductor, Inc. Thermal Measurement Report Freescale Semiconductor, Inc. Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC


    Original     		PDF 2500AN 7304LC G38-87 115x102 Theta-JC QFP die down G30-88 Theta-J Theta JB

    G30-88

    Abstract: Theta JB QFP PACKAGE thermal resistance die down JC15-1 G-38-87 G38-87 Theta-J 32 QFP PACKAGE thermal resistance 2500AN QFP PACKAGE thermal resistance
    Text: Thermal Measurement Report Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC Assembled: ANAM Die: PST6 - 10.16 mm Square


    Original     		PDF 2500AN 7304LC G38-87 115x102 RXMN60 RBDT20 G30-88 Theta JB QFP PACKAGE thermal resistance die down JC15-1 G-38-87 Theta-J 32 QFP PACKAGE thermal resistance 2500AN QFP PACKAGE thermal resistance

    Theta JB

    Abstract: JC15-1 G30-88 G38-87
    Text: Freescale Semiconductor, Inc. Thermal Measurement Report Freescale Semiconductor, Inc. Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC


    Original     		PDF 2500AN 7304LC G38-87 115x102 RXMN60 RBDT20 Theta JB JC15-1 G30-88