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    Abstract: ROP101116 MP9801 rop101 ROP1011 rop10111 delamination leadframe 371P160C3
    Text: TEXAS INSTRUMENTS Informational Notification of Leadframe Coating and Solder Plate Changes for PLCC Packages July 17, 1996 Abstract As part of our continuing efforts to improve the quality and reliability of lead finish on our Plastic Leaded Chip Carrier PLCC products, Texas Instruments. will convert from Cu/Ni coated to Cu/Cu


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