ROHM PROCESS SOLDERING Search Results

Contextual Info: Introduction Outline of Rohm manufacturing processes Rohm's LEDs are checked thoroughly for reliability at the design stage. In addition, complete quality control is achieved at each manufacturing stage. The diagram shows the manufacturing process for LEDs.

FLUX TYPE ROL0

Abstract: ALLOY leadframe C7025 ST-300 C7025 strip specification smd EDL 63 ST-50 adrian borg 10X10 C151 C194
Contextual Info: The Qualification of a Pure Tin Plating Process as a Lead Free Finish for I.C. Packaging Joseph Gauci, Adrian-Michael Borg and Robert Caruana, ST Microelectronics, Malta Keith Whitlaw and Jeff Crosby, Rohm and Haas Electronic Materials, Coventry, UK Abstract

C7022

Abstract: JIS-C-7022 H63A
Contextual Info: Notes About Quality Assurance Hybrid 1C Notes About Quality Assurance Rohm hybrid IC s are guaranteed in terms of high prod­ uct quality and high reliability through the manufactur­ ing flow shown below. • H y b rid !C manufacturing process flow \ y /

C7022

Abstract: cutting paste C-7022 H63A
Contextual Info: Hybrid 1C Notes About Quality Assurance Notes About Quality Assurance Rohm hybrid ICs are guaranteed in terms of high prod­ uct quality and high reliability through the manufactur­ ing flow shown below. H y b rid 1C manufacturing process flow v1/ •Q u a lity assurance testing program

Contextual Info: Remote control receiver Modules Photo Link Modules Lead frame type zRecommended soldering conditions (Lead frame type) 1. Not to apply high temperature exceeding the maximum storage temperature to the epoxy resin. 2. Not to apply any force to the epoxy resin at high temperature.

Contextual Info: Attention Points In Handling Surface Mount Chip LEDs SML-F1* Series This product was developed as a surface mount LED especially suitable for soldering. Please take care of following points when using this device. 1. DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1.

Contextual Info: Attention Points In Handling Surface Mount Chip LEDs SML-A1* Series This product was developed as a surface mount LED especially suitable for soldering. Please take care of following points when using this device. 1. DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1.

Contextual Info: Attention Points In Handling Surface Mount Chip LEDs SML-V56* Series This product was developed as a surface mount LED especially suitable for reflow soldering. Please take care of following points when using this device. 2. 9 2. SOLDERING LED products do not contain reinforcement

washing machine circuit

Abstract: SMLV36 SML-V36
Contextual Info: Attention Points In Handling Surface Mount Chip LEDs SML-V36* Series This product was developed as a surface mount LED especially suitable for reflow soldering. Please take care of following points when using this device. 2. 9 2. SOLDERING LED products do not contain reinforcement

LF-301MA

Abstract: LF-301MK LF-301VA LF-301VK 7 segment LED display 7 Segment single Display COMMON anode PIN detail
Contextual Info: LF-301 A / K Series LED displays Single Digit Surface Mount LED Numeric Display LF-301 A / K Series zDimensions Unit : mm 5±0.5 0.2 13 11 8 1 (1) zFeatures 1) Re-flow soldering ∗ 2) Pb-free availabe 3) Automatic mounting with taping pack ∗Number of re-flow process shall be recommend

Contextual Info: LF-301 A / K Series LED displays Single Digit Surface Mount LED Numeric Display LF-301 A / K Series Dimensions Unit : mm 6.8 PIN No.6 P1.27x4=5.08 10-0.4 10˚ 0.2 (1 ) 13 11 8 1 Features 1) Re-flow soldering ∗ 2) Pb-free availabe 3) Automatic mounting with taping pack

Contextual Info: Attention Points In Handling Surface Mount Chip LEDs SML-21* Series This product was developed as a surface mount LED especially suitable for reflow soldering. Please take care of following points when using this device. 1.1mm 1.DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1.

Reflow Soldering

Contextual Info: Attention Points In Handling Surface Mount Chip LEDs SML-31* Series This product was developed as a surface mount LED especially suitable for soldering. Please take care of following points when using this device. 0.8mm 1.DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1.

silica gel

Abstract: rohm process soldering
Contextual Info: Attention Points In Handling Surface Mount Chip LEDs SML-R1* Series This product was developed as a surface mount LED especially suitable for soldering. Please take care of following points when using this device. 1.2mm 1. DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1.

SML-Y1

Contextual Info: Attention Points In Handling Surface Mount Chip LEDs SML-Y1* Series This product was developed as a surface mount LED especially suitable for soldering. Please take care of following points when using this device. 2.3mm 3.HANDING AFTER MOUNTING As shown right drawing, in case outside force is given

CSL0101

Contextual Info: Attention Points In Handling Surface Mount Chip LEDs CSL0101* Series This product was developed as a surface mount LED especially suitable for reflow soldering. Please take care of following points when using this device. 0.31mm Fig-1 1. DESIGNING OF PCB

Contextual Info: Attention Points In Handling Surface Mount Chip LEDs SML-D12*8 Series This product was developed as a surface mount LED especially suitable for reflow soldering. Please take care of following points when using this device. 0.8mm Fig-1 1. DESIGNING OF PCB

SML-P1

Abstract: ultra sonic
Contextual Info: Attention Points In Handling Surface Mount Chip LEDs SML-P1* Series This product was developed as a surface mount LED especially suitable for reflow soldering. Please take care of following points when using this device. 0.6mm Fig-1 1. DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1.

Contextual Info: Attention Points In Handling Surface Mount Chip LEDs SML-E1* Series This product was developed as a surface mount LED especially suitable for reflow soldering. Please take care of following points when using this device. 0.8mm 1. DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1.

MAX260

Contextual Info: Attention Points In Handling Surface Mount Chip LEDs SML-P2* Series This product was developed as a surface mount LED especially suitable for reflow soldering. Please take care of following points when using this device. Fig-1 1. DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1.

LF-301VA

Abstract: LF-301VK LF-301MA LF-301MK
Contextual Info: LF-301 A / K Series LED displays Single Digit Surface Mount LED Numeric Display LF-301 A / K Series zExternal dimensions Unit : mm 5±0.5 0.2 13 11 8 1 (1) zFeatures 1) Re-flow soldering ∗ 2) Pb-free availabe 3) Automatic mounting with taping pack ∗Number of re-flow process shall be recommend

SMLP34

Contextual Info: Attention Points In Handling Surface Mount Chip LEDs SML-P34* Series This product was developed as a surface mount LED especially suitable for reflow soldering. Please take care of following points when using this device. 0.45 0.4 0.45 2. SOLDERING Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu

Contextual Info: Attention Points In Handling Surface Mount Chip LEDs SML-J1* Series This product was developed as a surface mount LED especially suitable for soldering. Please take care of following points when using this device. 0.7 1.1 0.7 1.DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1.

Contextual Info: Attention Points In Handling Surface Mount Chip LEDs SML-P36* Series This product was developed as a surface mount LED especially suitable for reflow soldering. Please take care of following points when using this device. 0.4 0.45 0.45 0.45 0.4 0.45 1. DESIGNING OF PCB