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    ROBINSON NUGENT S2 Search Results

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    str w 6554 a

    Abstract: str 6554 STR 6456 str w 6554 str f 6456 str x 6456 BK2425-1320ALF str f 6554 NSH-03SB-S1-TG 12697
    Text: Central Component Manufacturing - Cross Reference CCM PART # GCTJ-08-2-H-A1-BK-8-P1-S 22-11-2032 22-11-2042 22-11-2062 22-12-2024 22-12-2034 22-12-2034 22-12-2044 22-12-2104 30190 382811-5 39-30-1241 39-30-1241 41A-9-750 43045-0602 43045-0612 43045-0614 43045-0802


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    PDF GCTJ-08-2-H-A1-BK-8-P1-S 1A-9-750 752D02-50CRB301 731-8818-22A ADT-911-G AFC-10-P-SG str w 6554 a str 6554 STR 6456 str w 6554 str f 6456 str x 6456 BK2425-1320ALF str f 6554 NSH-03SB-S1-TG 12697

    Robinson Nugent PAK-50

    Abstract: resistor 270 ohm ECU-V1H100DCN EPM9320ARC208-10 ECU-V1H471JCX 3 pins Variable resistor 10K ohm through hole 26 pin ecu connectors miniSMDC035 ERJ-6GEYJ10KV MINISMDC035-2
    Text: SCLR 06/06/00 Fermi National Accelerator Laboratory D0 Trigger Distribution System Serial Command Link Receiver SCLR June 6, 2000 Bill Haynes, Thinh Pham, Neal Wilcer and Ted Zmuda -TZ page i SCLR 6/6/00 1 GENERAL INFORMATION . 2


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    PDF 160-1169-1-ND 64-pin 160-1170-1-ND MINISMDC035-2 Robinson Nugent PAK-50 resistor 270 ohm ECU-V1H100DCN EPM9320ARC208-10 ECU-V1H471JCX 3 pins Variable resistor 10K ohm through hole 26 pin ecu connectors miniSMDC035 ERJ-6GEYJ10KV MINISMDC035-2

    Robinson Nugent sbl series

    Abstract: Robinson Nugent SBE Robinson Nugent SBE S2
    Text: Terminal Strips Robinson Nugent I Screw Machine — " CPP/CPL Series * Notched body snaps to custom sizes of 1 to 64 pins * Mates with the SBE/SBL Series * Variety of pin lengths to accommodate different board spacing requirements * High temp IR compatible CPP only


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    Robinson Nugent ice

    Abstract: Robinson Nugent s2
    Text: Board-to-Board Robinson Nugent CPP Series * Variety of pin lengths to meet specific board stacking applications * Mates with both ICE and ICT Series dip sockets * CPP Series consists of .118" profile body How to Order CPP Series CPP Series CPP — XX X Number of Contacts:


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    PDF CPP-063-X-X CPP-083-X-X CPP-143-X-X CPP-163-X-X CPP-183-X-X CPP-203-X-X CPP-243-X-X CPP-246-X-X CPP-286-X-X CPP-326-X-X Robinson Nugent ice Robinson Nugent s2

    Untitled

    Abstract: No abstract text available
    Text: RN ICPAK N uaant Specifications for TSOP Sockets MATERIALS Body: Liquid crystal polymer Plating: TT = 2.03 pm 80 pinch Tin/Lead overall. 1.27 pm (50 pinch) Nickel underplate. Frame: Glass-filled PPS Contact: Copper alloy Holder: Copper alloy Flammability: UL 94V-0


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    PDF 490m/s2 98m/s2 TSOP-4050XX-SMT-TT S13N30S TSOP-28XX-SMT-TT TSOP-32XX-SMT-TT TSOP-40XX-SMT-TT

    Robinson Nugent s2

    Abstract: No abstract text available
    Text: FINE PITCH SOCKETS E & D _ Specifications for SOP Sockets MATERIALS Body & Frame: Glass reinforced PPS UL 94V-0 Contact: Copper Alloy Plating: TT = 2.03 pm (80 pinch) Tin/Lead overall. 1.27 pm (50 pinch) Nickel underplate. ELECTRICAL Current Rating: 0.5 Ampere per contact


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    PDF 1000MQ 980m/S2 300mil) S13M30S OP-44EXX-SMT-TT Robinson Nugent s2

    ATMEL 32P

    Abstract: toshiba 94V-0
    Text: SOP— 40 D XX — SMT — TT .Plating Position:. 40 Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags D = .525" Row Spacing. m E h T falEOOOO TiEBDDb a FF na 3 65 1 = Body 2 = Frame 3 = SO Package IC R e c o m m e n d e d PC b o a r d


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    PDF OP-40DXX-SMT-TT Socke0GM-50-300B, FP-20DA, FP-20-D 375mll) P20GM-50-375B-3, P20GT-50-375B-2 FPT-20P-M02 751D-03 P24GM-50-300B-2 ATMEL 32P toshiba 94V-0

    Untitled

    Abstract: No abstract text available
    Text: 13 Od \ :r " \ V -—< { I T00S371 0000375 44b • O e t a I I ' A* S - l O : 1 ~Q) 1 = Body 2 = Contact 3 = Frame Holder EP TSOP — 40 50 XX — SMT — TT ' ” Number of Contacts: 40 _ T 50 = .50mm — Lead Spacing ~ — ~ . Plating -Blank = Standard Pack (5 parts/pack)


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    PDF T00S371 TSOP-4050XX-SMT-TT S13MOOS 100MH 100MQ 28P2C-A FPT-28P-M03 TSOP-814-K, TSOP32P-814-L

    Untitled

    Abstract: No abstract text available
    Text: SOCKETS TSOP — 32 12 XX — SMT — TT . Plating Number of Contacts: 32 12 = 1.27mm Lead Spacing— . Blank = Standard Pack 5 parts/pack TP = Tape & Reel (body only) 'Frames are packaged in vinyl bags 19- 0 5 i 0 . 1 1. 2 7 *0 . O' ?. 6 0 ± 0. 0 5 i =¡005371


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    PDF TSOP-3212XX-SMT 100MH 100MQ 28P2C-A FPT-28P-M03 TSOP-814-K, TSOP32P-814-L TFP-32DA, TFP-32DAR

    LA 7693

    Abstract: lm 7933 lm 3178 SO 607 mh 4S72 LM 2741 LM 7493 pa 3029 b Robinson Nugent s2 Lm 304 PN
    Text: RN PAK-50 Low Profile 2-Piece Connectors P50L Series Low profile .276" - .472" 7-12mm mated heights to address board stacking applications Eight sizes, 20-120 contacts Hlgh-temp Insulator compatible with IR and wave soldering Low insertion/withdrawal forces


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    PDF PAK-50 7-12mm) P50L-XXXP-A-TGF P50L-XXXS-A-T LA 7693 lm 7933 lm 3178 SO 607 mh 4S72 LM 2741 LM 7493 pa 3029 b Robinson Nugent s2 Lm 304 PN

    Robinson Nugent IC SOCKET

    Abstract: No abstract text available
    Text: SOCKETS SOP — XX B XX — SMT — TT Plating Position:. 20, 28 . Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags ‘nEOOOO TiESOOb B = .375" Row Spacing EEh s' PC board 1 = Body 2 = Frame 3 = SO Package IC oattern 1. 2 7 ± Q. Q5


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    PDF Plat50-300B, FP-20DA, FP-20-D 375mil) P20GM-50-375B-3, P20GT-50-375B-2 FPT-20P-M02 751D-03 P24GM-50-300B-2 Robinson Nugent IC SOCKET

    Untitled

    Abstract: No abstract text available
    Text: SOCKETS TSOP — 28 55 XX — SMT — TT Plating Number of Contacts: 28 <1005371 Blank = Standard Pack 5 parts/pack TP = Tape and Reel (body only) 'Frames are packaged in vinyl bag 55 = .55mm Lead Spacing K S e c t ion A-B 0000372 |5 5 « » - « B 737 1 = Body


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    PDF TSOP-2855XX-SMT-TT 100MH 100MQ TSOP-814-K, TSOP32P-814-L TFP-32DA, TFP-32DAR 28P2C-A FPT-28P-M03

    Untitled

    Abstract: No abstract text available
    Text: SOP — XX C XX — SMT — TT Plating Position:. 28, 32 C = .450" Row Spacing Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags T00S371 DD0D3tj7 PC Doara oattern 2 B 37T WWW 1. 271Q. 05 32 B A 2 1.85 24. B 16.51 19. 0 5


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    PDF T00S371 1650-300B, FP-20DA, FP-20-D 375mil) P20GM-50-375B-3, P20GT-50-375B-2 FPT-20P-M02 751D-03 P24GM-50-300B-2

    P20GT-50-375B-2

    Abstract: 945080
    Text: SOCKETS SOP — 44 E XX — SMT — TT Plating Position:. 44 Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags E = .600" Row Spacing T005371 000D370 I I I I I I Ijl I I I I I I I =lb4 am1 34 1= Body 2 = Frame 3 = SO Package IC


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    PDF T005371 000D370 OP-44EXX-SMT-TT Tin/0GM-50-300B, FP-20DA, FP-20-D 375mil) P20GM-50-375B-3, P20GT-50-375B-2 FPT-20P-M02 P20GT-50-375B-2 945080

    Untitled

    Abstract: No abstract text available
    Text: I ^DDS371 000 037 3 b73 TSOP — 32 50 XX Number of Contacts:. 32 — SMT — TT J 50 = .50mm Lead Spacing . Plating _ Blank = Standard Pack 5 parts/pack TP - Tape & Reel (body only) 'Fram es are packaged in vinyl bags ALL DIMENSIONS IN MILLIMETERS ± 0.3 General Tolerance


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    PDF DDS371 TSOP-3250XX-SMT-TT 100MH 100MQ 28P2C-A FPT-28P-M03 TSOP-814-K, TSOP32P-814-L TFP-32DA,

    Untitled

    Abstract: No abstract text available
    Text: HIGH DENSITY Pin Grid Array Headers PGH Series * High temp molded insulator body * Variety of pin lengths to accommodate different board spacing requirements SOCKETS * Mates with PGA Series "A" SQUARE Grid Size Dimension A 8x8 .800“ 20 . 32 9x9 .900" (22 . 86)


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    PDF 10x10 12x12 15x15 18x18 19x19

    P20GT-50-375B-2

    Abstract: No abstract text available
    Text: SMT — TT SOP — XX A XX Plating Position:_ 8, 14, 20, 24 A = .300" Row Spacing .Blank = Tube Pack TP = Tape and Reel body only *Frames are packaged in vinyl bags •Ì00S371 G0003fc>5 O CD lO t ST7 t 1 = Body 2 = Frame 3 = SO Package IC


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    PDF 00S371 G0003fc S13M00S Pla50-300B, FP-20DA, FP-20-D 375mil) P20GM-50-375B-3, P20GT-50-375B-2 FPT-20P-M02 P20GT-50-375B-2

    94v-0 m02

    Abstract: ATMEL 32P
    Text: SOCKETS SOP — 32 D XX — SMT — TT n Position:. 32 D = .525" Row Spacing Plating Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags ^005371 00003bfl D HGb PC board pattern j j P S ' ± 0.3 General Tolerance ALL DIMENSIONS


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    PDF 00003bfl OP-32DXX-SMT-XX Rati0GM-50-300B, FP-20DA, FP-20-D 375mil) P20GM-50-375B-3, P20GT-50-375B-2 FPT-20P-M02 751D-03 94v-0 m02 ATMEL 32P

    Robinson Nugent sbe row

    Abstract: Robinson Nugent sbe
    Text: BOARD-TO-BOARD TERMINAL STRIPS Screw Machine CPP/CPL Series • Notched body snaps to custom sizes of 1 to 64 pins • Mates with the SBE/SBL Series • Variety of pin lengths to accommodate different board spacing requirements • High temp IR compatible CPP only


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    si4221

    Abstract: Robinson Nugent ice
    Text: BOARD-TO-BOARD SCREW MACHINE DIP HEADERS CPP/CPT Series • Variety of pin lengths to meet specific board stacking applications • Mates with both ICE and ICT Series dip sockets • CPP Series consists of .118" profile body and CPT Series consists of .050" profile


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    PDF CPP-243-X-X CPP-246-X-X CPP-286-X-X CPP-326-X-X CPP-406-X-X CPP-426-X-X CPP-486-X-X TD0S371 si4221 Robinson Nugent ice

    Untitled

    Abstract: No abstract text available
    Text: HIGH DENSITY Pin Grid Array Headers PGH Series * High temp molded insulator body * Mates with PGA Series Grid Size Dimension A 8x8 .800* 20.32 9x9 .900“ (22 . 86) 10x10 1.000" (25 .40) 11 x 11 1.100" (27 . 94) 12x12 1.200" (30.48) 13x13 1.300" (33. 02)


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    Untitled

    Abstract: No abstract text available
    Text: Sockets HIGH DENSITY Pin Grid Array Headers 5X&tJ. PGH Series * High temp molded insulator body * Variety of pin lengths to accommodate different board spacing requirements * Mates with PGA Series "A" SQUARE .1 2 0 Grid Size Dimension A 8x8 .800" 20 . 32


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    PDF 10x10 11x11 12x12

    Untitled

    Abstract: No abstract text available
    Text: FINE PITCH SOCKETS Specifications for TSOP Sockets MATERIALS B o d y: Liquid crystal polym er Plating : T T = 2.0 3 pm 80 pinch Tin/Lead overall. F ram e: Glass-tilled P P S 1.27 pm (50 pinch) Nickel underplate. C o n tact: Copper alloy H o lder: C opper alloy


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    PDF TSOP-4050XX-SMT-TT

    tgn 600

    Abstract: No abstract text available
    Text: RN 1C PAK N uaent Specifications for SOP Sockets MATERIALS Body & Frame: Glass reinforced PPS UL 94V-0 Contact: Plating: TT = 2.03 pm (80 flinch) Tin/Lead overall. Phosphor Bronze 1.27 pm (50 pinch) Nickel underplate. SOCKETS ELECTRICAL Current Rating: 0.5 Ampere per contact


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    PDF 980m/S2 OP-40DXX-SMT-TT OP-44EXX-SMT-TT tgn 600