ROBINSON NUGENT PG Search Results

Contextual Info: Robinson Nugent- Screw Machine Terminal Strips I Solderless Backplane Socket r SBE-CP Series High reliability gas-tight connections Eliminates expensive manual soldering of backplanes Press-fit pin eliminates PCB damage Compatible with standard press-fit

Contextual Info: HIGH DENSITY PGA Socket Tooling PGA-ET Series • Allows device removal without damaging | or device body • Available for 10 x 10 through 21 x 21 grids • 18x18 through 21 x 21 extraction tools feature 4-sided pulling action DESCRIPTION PGA-ET-10x10 - Robinson Nugent, Inc. •

Robinson Nugent

Abstract: Robinson Nugent SCREW MACHINE SOCKET Motorola 68040
Contextual Info: HIGH DENSITY Pin Grid Array Socket with Heat Sink Tabs PGHS Series CLIP HEAT SINK • High temp molded insulator body compatible with IR and vapor phase soldering MICROPROCESSOR • Precision screw machine sockets for high reliability PGA SOCKET • “Ultra Low Force” 6-finger contact

ROBINSON NUGENT

Abstract: ROBINSON
Contextual Info: 50 mil Interconnect System Redundant Ribbon Contact Reliability Until now the standard pitch for PC board connectors has been 100 mil 2.54mm , but as systems become smaller and the corresponding mounting density ot PC boards increases, it becomes necessary to increase the density

Contextual Info: HIGH DENSITY_ PGA Interstitial Sockets PGA-INT Series 9 .050" staggered design mates with n high density devices 9 Molded high temperature body mate - Suitable for infrared and vapor ph soldering applications 9 Screw machine reliability 9 Uses RN’s ultra-low force contact

Contextual Info: 50 mil Interconnect System Redundant Ribbon Contact Reliability Until now the standard pitch for PC board connectors has been 100 mil 2.54mm , but as systems become smaller and the corresponding mounting density of PC boards increases, it becomes necessary to increase the density

Contextual Info: HIGH DENSITY Pin Grid Array Sockets . ^ ^ 7 . PGA SERIES * High temp molded insulator body 9 Stand-offs available to eliminate intermittent solder connections 9 Precision screw machine sockets for high reliability 9 Available with solder, wire wrap and press-fit

McKenzie technology

Abstract: burndy zif YAMAICHI 132 PGA MAXCONN ms McKenzie technology pga
Contextual Info: Sockets Below are two lists of manufactures known to offer sockets for Xilinx package types. This list does not imply an endorsement by Xilinx. Each user must evaluate the particular socket type. a compatible PGA socket with wire-wrap pins. Note that the board-layout then differs from a PGA board layout.

Contextual Info: HIGH DENSITY_ Pin Grid Array Sockets PGA SERIES * High temp molded insulator body 9 Stand-offs available to eliminate intermitte solder connections 9 Precision screw machine sockets for high reliability 9 Available with solder, wire wrap and press tails

Robinson Nugent pga

Abstract: Robinson Nugent
Contextual Info: HIGH DENSITY Pin Grid Array Sockets PGA SERIES * High temp molded insulator body * Stand-offs available to eliminate intermittent solder connections * Precision screw machine sockets for high reliability * Available with solder, wire wrap and press-fit tails

Robinson Nugent

Abstract: Robinson Nugent pga 18x18 Nugent
Contextual Info: HIGH DENSITY_ PGA Sockets with Solder Preforms PGA Series * Provides an excellent cost effective method for applying solder to inaccessible joints 9 Insures a reliable solder joint by provid­ ing an exact amount of solder * Eliminates the need for solder paste and

Contextual Info: Sockets HIGH DENSITY_ ^ Pin Grid Array Sockets with Heat Sink Tabs PGHS Series • High temp molded insulator body compatible with IR and vapor phase soldering • Precision screw machine sockets for high reliability • “Ultra Low Force” 6-finger contact

Contextual Info: HIGH DENSITY PGA Sockets PGA-ET Series 9 Allows device removal without damaging pins or device body 9 Available for 10 x 10 through 21 x 21 grids 9 18x18 through 21 x 21 extraction tools feature 4-sided pulling action DESCRIPTION PGA-ET-10X10 SOCKETS PGA-ET-11X11

Contextual Info: Sockets -interstitial Pin Grid Array Sockets PGA-INT Series * .050" staggered design mates with new high density devices * Molded high temperature body material - Suitable for infrared and vapor phase soldering applications * Screw machine reliability * Uses RN’s ultra-low force contact

Contextual Info: HIGH DENSITY Pin Grid Array Socket with Heat Sink Tabs PGHS Series 9 High temp molded insulator body compatible with IR and vapor phase soldering 9 Precision screw machine sockets for high reliability 9 “Ultra Low Force” 6-finger contact RN Part Description

str w 6554 a

Abstract: str 6554 STR 6456 str w 6554 str f 6456 str x 6456 BK2425-1320ALF str f 6554 NSH-03SB-S1-TG 12697
Contextual Info: Central Component Manufacturing - Cross Reference CCM PART # GCTJ-08-2-H-A1-BK-8-P1-S 22-11-2032 22-11-2042 22-11-2062 22-12-2024 22-12-2034 22-12-2034 22-12-2044 22-12-2104 30190 382811-5 39-30-1241 39-30-1241 41A-9-750 43045-0602 43045-0612 43045-0614 43045-0802

Contextual Info: HIGH DENSITY Pin Grid Array Headers PGH Series * High temp molded insulator body * Mates with PGA Series Grid Size Dimension A 8x8 .800* 20.32 9x9 .900“ (22 . 86) 10x10 1.000" (25 .40) 11 x 11 1.100" (27 . 94) 12x12 1.200" (30.48) 13x13 1.300" (33. 02)

Contextual Info: Sockets — N ugent-Interstitial Pin Grid Array Sockets PGA-INT Series • .050" staggered design mates with new high density devices * Molded high temperature body material - Suitable for infrared and vapor phase soldering applications • Screw machine reliability

Contextual Info: HIGH DENSITY_ PGA Interstitial Sockets 7.' t PGA-INT Series * .050" staggered design mates with new high density devices * Molded high temperature body material - Suitable for infrared and vapor phase soldering applications * Screw machine reliability

Contextual Info: Sockets HIGH DENSITY Pin Grid Array Headers 5X&tJ. PGH Series * High temp molded insulator body * Variety of pin lengths to accommodate different board spacing requirements * Mates with PGA Series "A" SQUARE .1 2 0 Grid Size Dimension A 8x8 .800" 20 . 32

Contextual Info: HIGH DENSITY PGA Sockets with Solder Preforms PGA Series * Provides an excellent cost effective method for applying solder to inaccessible joints * Insures a reliable solder joint by prc ing an exact amount of solder 9 Eliminates the need for solder paste

Contextual Info: Sockets HIGH DENSITY_ Pin Grid Array Sockets PGA SERIES * High temp molded insulator body * Stand-offs available to eliminate intermittent solder connections * Precision screw machine sockets for high reliability * Available with solder, wire wrap and press-fit

Robinson Nugent pga

Contextual Info: SCREW MACHINE Terminal Strips Solderless Backplane Socket SBE-CP Series High reliability gas-tight connections Eliminates expensive manual soldering of backplanes Press-fit pin eliminates PCB damage Compatible with standard press-fit assembly technology Hi temp IR compatible

PGHS179

Abstract: INTEL DX4 Motorola 68060
Contextual Info: HIGH DENSITY Pin Grid Array Sockets with Heat Sink Tabs PGHS Series SOCKETS * High temp molded insulator body compatible with IR and vapor phase soldering 9 Precision screw machine sockets for high reliability • “Ultra Low Force” 6-finger contact Heat Sink Vendor