ROBINSON NUGENT IC SOCKET Search Results

Robinson Nugent s2

Contextual Info: FINE PITCH SOCKETS E & D _ Specifications for SOP Sockets MATERIALS Body & Frame: Glass reinforced PPS UL 94V-0 Contact: Copper Alloy Plating: TT = 2.03 pm (80 pinch) Tin/Lead overall. 1.27 pm (50 pinch) Nickel underplate. ELECTRICAL Current Rating: 0.5 Ampere per contact

Robinson Nugent socket

Abstract: ROBINSON NUGENT
Contextual Info: HIGH DENSITY_ 8 Byte DIMM Sockets, DIMS Series * Effectively provides double density packaging 9 Durability - 60 cycles minimum 9 Vertical entry allows insertion/removal without disturbing “neighboring DIMMs” RN DIMMPAK 9 Superior shock and vibration performance

Contextual Info: FINE PITCH SOCKETS SOP Sockets REMARKS 1 2) Use a screen thickness of 0.2mm or 0.3mm during cream solder printing. When infrared reflow soldering the peak surface temperature of the PC board should not exceed 245°C. Recommended conditions for the reflow

96 pin DIN connector right angle

Abstract: Robinson Nugent 96 pin vme DIN connector 371D Robinson Nugent DIN-48CPC-XXX-TR DIN-96CPC-SR14A-TR Robinson Nugent 2.0 Robinson Nugent daughter Robinson Nugent cable to board
Contextual Info: DIN CONNECTORS_ Standard C-Form DIN Solder-To-Board Plug Connectors DIN-CP Series • 96 position connector used on VME, VXI, Multi-Bus II daughter cards • High temp SMT compatible insulator • EMLB groundng contacts allow “hot board” replacement see page 293

Contextual Info: RN ICPAK —Nuaent SOP Sockets REMARKS 1 Use a screen thickness of 0.2mm or 0.3mm during cream solder printing. 2) When infrared reflow soldering the peak surface temperature of the PC board should not exceed 245°C. Recommended conditions for the reflow

Robinson Nugent IC SOCKET

Contextual Info: SOCKETS SOP — XX B XX — SMT — TT Plating Position:. 20, 28 . Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags ‘nEOOOO TiESOOb B = .375" Row Spacing EEh s' PC board 1 = Body 2 = Frame 3 = SO Package IC oattern 1. 2 7 ± Q. Q5

MO-52

Contextual Info: R obinson — N u gen t- Sockets Sockets ELASTIC LEADED CHIP CARRIER SOCKETS PLCC-SMT Series Low profile; .200" maximum height Designed for automatic assembly Socket footprint same as device Open frame allows visual inspection of solder joints

P20GT-50-375B-2

Abstract: 945080
Contextual Info: SOCKETS SOP — 44 E XX — SMT — TT Plating Position:. 44 Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags E = .600" Row Spacing T005371 000D370 I I I I I I Ijl I I I I I I I =lb4 am1 34 1= Body 2 = Frame 3 = SO Package IC

ICL-406-S7-T

Contextual Info: Sockets PRODUCTION DIP Single Wipe Sockets ICL/ICU Series * High compression, single wipe contact provides high retention and gastight connections 9 Automatic insertion option compatible with most insertion equipment * Anti-overstress design prevents damage to

DIN 34 STANDARD

Abstract: 96 pin DIN connector right angle apple 30 pin connector DIN-96CPC-XXX-TR Robinson Nugent idc DIN-96CPC-SR14A-TR
Contextual Info: Robinson 2-Piece PC Nugent- Connectors Standard C-Form DIN Solder-To-Board Plug Connectors DIN-CP Series # 96 position connector used on VME, VXI, Multi-Bus II daughter cards • High temp SMT compatible insulator * EMLB groundng contacts allow “hot board’

ATMEL 32P

Abstract: toshiba 94V-0
Contextual Info: SOP— 40 D XX — SMT — TT .Plating Position:. 40 Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags D = .525" Row Spacing. m E h T falEOOOO TiEBDDb a FF na 3 65 1 = Body 2 = Frame 3 = SO Package IC R e c o m m e n d e d PC b o a r d

Robinson Nugent 100-pin

Abstract: Robinson Nugent IC SOCKET Robinson Nugent, IC Socket Robinson Nugent PAK-50 Robinson Nugent idc Robinson Nugent cable to board la 4631
Contextual Info: Robinson Nuaent— 50 mil Connectors Low Profile IDC Connectors P50LE Series Product supports 25 mil pitch cable Low profile - 11.8mm mated height RN PAK-50' One-touch locking ejector system Low insertion/withdrawal force Self-aligning mating Straight, right angle, and SMT options

Contextual Info: SOP — XX C XX — SMT — TT Plating Position:. 28, 32 C = .450" Row Spacing Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags T00S371 DD0D3tj7 PC Doara oattern 2 B 37T WWW 1. 271Q. 05 32 B A 2 1.85 24. B 16.51 19. 0 5

Robinson Nugent 20 DIP socket

Abstract: Robinson Nugent DIP socket
Contextual Info: S ockets PRODUCTION DIP Screw Machine Sockets 17- ICA Series * Four-finger Beryllium Copper contact pro­ vides low, stable contact resistance * High retention design prevents “1C Walk­ out” during heavy vibration 9 Pin socket contact prevents solder wicking

Contextual Info: Sockets PRODUCTION DIP Dual Wipe Sockets ICN Series • General purpose, dual leaf side wipe contact provides high reliability • Anti-wicking wafer prevents solder and flux wicking • Open body design provides excellent cooling properties How To Order ICN Series

Contextual Info: PRODUCTION DIP Crystal Oscillator Screw Machine Sockets ICA-SCO Series * Four high retention pins for shock and vibration applications * Low profile socket height * Positive closed bottom flux barrier SOCKETS * Other contact loadings available on request How To Order ICA-SCO Series

Contextual Info: PRODUCTION DIP_ Open Body Screw Machine Sockets ICE Series • Variety of pin lengths to meet specific board stacking applications • Open body provides convection cooling • 4-finger Beryllium Copper contact accept short 1C leads 9 48 and 64 pin sizes available for VLSI, LA

Contextual Info: DUAL WIPE SOCKETS SB/SBF/WB Series • Dual wipe contact 9 SB option allows flexible jumper strips leads to .025" SOCKETS * WB option is excellent for socketing ce­ ramic hybrids, LED’s and memory modules WB — XX — 55 — XX XXX XX XXX — X Product Series.

ICB163

Abstract: Robinson Nugent DIP socket
Contextual Info: Sockets PRODUCTION DIP Dual Wipe Sockets ICO/ICB Series * “Flux Fighter” closed bottom design prevents solder wicking and flux entrapment * Dual leaf, high compression contact provides gas-tight performance 9 Automatic insertion option compatible with

Robinson Nugent IC SOCKET

Abstract: Robinson Nugent DIP socket Robinson Nugent 20 DIP socket icx286 nugent pin socket ICX083 ICX-203-S8X-T ICX-183-S8X-T
Contextual Info: BQpn. PRODUCTION DIP Dual Wipe Sockets ICO/ICB Series * “Flux Fighter” closed bottom design pre­ vents solder wicking and flux entrapment * Dual leaf, high compression contact provides gas-tight performance 9 Automatic insertion option compatible with

Contextual Info: Sockets DUAL WIPE SOCKETS SB/SBF/WB Series • Dual wipe contact • SB option allows flexible jumper strips leads to .025" • WB option is excellent for socketing ce­ ramic hybrids, LED’s and memory modules WB — XX — 55 — XX XXX XX XXX — X T

P20GT-50-375B-2

Contextual Info: SMT — TT SOP — XX A XX Plating Position:_ 8, 14, 20, 24 A = .300" Row Spacing .Blank = Tube Pack TP = Tape and Reel body only *Frames are packaged in vinyl bags •Ì00S371 G0003fc>5 O CD lO t ST7 t 1 = Body 2 = Frame 3 = SO Package IC

Contextual Info: Robinson —Nugent- Production Dip Wire Wrap Dual Wipe Sockets ICN-WB Series * General purpose, dual leaf side wipe contact provides high reliability * Economical Tin plated tail/Gold plated contact available SOCKETS N um ber of C o n ta c ts

Contextual Info: Muaent SOJ Series * Small outline, dual in-line socket accommodates J leaded SRAMs, DRAMs and VRAMs * Low profile; .200" maximum height * Socket footprint same as device * Open frame allows visual inspection of solder joints and solder joint repair without