CDA 194
Abstract: CDA194 k711 k7110 transistor 9751 DS1259 DS1260
Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: 11/25/97 Subject: PRODUCT CHANGE NOTICE - K71101 Description: Qualification of 16L PDIP lead frame with CDA194 (Cu Alloy) Description of Change: The lead frame material for some 16 lead PDIP devices is being changed from Alloy 42 to CDA
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K71101
CDA194
CDA194
DS1259,
DS1260
CDA 194
k711
k7110
transistor 9751
DS1259
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6600CS
Abstract: DS1307 IC Compound DS27 DS1000 DS1004 DS1012 DS1033 IC DS1307 DS1040
Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: 5/27/98 Subject: PRODUCT CHANGE NOTICE – E81301 Description: Qualification of EME 6600CS Mold Compound.
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E81301
6600CS
DS1000,
DS1004,
DS1012,
DS1033,
DS1035,
DS1040,
DS1075,
DS1307 IC
Compound
DS27
DS1000
DS1004
DS1012
DS1033
IC DS1307
DS1040
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SUMITOMO EME-1100H
Abstract: mold compound SUMITOMO Compound DS2400 1100-H 1100H CARSEM DS1233 DS1410D
Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: March 6, 1997 Subject: PRODUCT CHANGE NOTICE – B70601 Description: Qual of 6710S Mold Compound at Carsem for SOT 233 Packages Description of Change: SOT 223 packages are currently assembled with SUMITOMO EME 1100H mold compound. Proposed
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B70601
6710S
1100H
6710S.
DS1233
DS2401
DS2223
DS2224
DS24S01
SUMITOMO EME-1100H
mold compound
SUMITOMO
Compound
DS2400
1100-H
CARSEM
DS1233
DS1410D
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CARSEM
Abstract: No abstract text available
Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: February 14, 1997 Subject: PRODUCT CHANGE NOTICE – A72801 Description: Carsem(s), Alternate Assembly Site for 20L TSSOP Description of Change: Carsem(S) has been qualified as an alternate source for assembly of the 20 lead TSSOP package.
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A72801
DS21S07
CARSEM
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DS2110
Abstract: DS1321 DS1803 DS2058 DS2105 DS2114 DS21T05 DS21T07 DS232 On semiconductor SOIC Traceability
Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: 7/29/98 Subject: PRODUCT CHANGE NOTICE - G80101 Description: Alternate assembly site Amkor Philippines, for 16 Lead SOIC (150 mil) package.
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G80101
DS21T05,
DS21T07,
DS232,
DS1321,
DS1803,
DS2058,
DS2105,
DS2110,
DS2114
DS2110
DS1321
DS1803
DS2058
DS2105
DS2114
DS21T05
DS21T07
DS232
On semiconductor SOIC Traceability
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dallas ds2501
Abstract: dallas ds2501 Datasheet DS2501 DS2501 transistor CARSEM ds2501 Datasheet TSOC tsoc package DS2401 DS2405
Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: 1/21/98 Subject: PRODUCT CHANGE NOTICE - A81401 Description: Alternate Package Assembly (Carsem S) for TSOC packages
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A81401
DS2401,
DS2405,
DS2407,
DS2423,
DS2502,
DS2505,
DS9502,
DS9503,
DS24A30,
dallas ds2501
dallas ds2501 Datasheet
DS2501
DS2501 transistor
CARSEM
ds2501 Datasheet
TSOC
tsoc package
DS2401
DS2405
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dallas date code
Abstract: transistor 9647 CARSEM leadframe materials DS5000 dALLAS MARKING CODE
Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: January 20, 1997 Subject: PRODUCT CHANGE NOTICE – A70201 Description: Package Change – 80 Lead MQFP at Carsem and Anam Description of Change: Dallas Semiconductor will change the leadframe material for the 80 lead MQFP built in Carsem and
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A70201
DS5000
DS5001
DS5002
dallas date code
transistor 9647
CARSEM
leadframe materials
DS5000
dALLAS MARKING CODE
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dALLAS MARKING CODE
Abstract: Ablebond 84lmisr4 tamac 4 DS1233 marking 84-LMISR4 tamac
Text: DALLAS SEMICONDUCTOR APPROVED DOCUMENT 40–01233–05Z ORIGINATOR DESCRIPTION REV. N PAGE 1 OF 4 ECN NUMBER DATE REV. Jerry Jordan Original Issue 05210 08/18/92 A Bruce McLaren Improve brand, add brand table 05550 10/14/92 B Ken Burdette Update die diagram
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DS1233
10/31/MICONDUCTOR
dALLAS MARKING CODE
Ablebond 84lmisr4
tamac 4
DS1233 marking
84-LMISR4
tamac
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