RESISTOR DIMENSIONS 1206 TO MM Search Results

Chip Resistors Parasitic capacitance

Abstract: Resistor dimensions 1206 to mm "Power Splitter" 1206 chip resistor size in mm transistor 8606 125MW chip resistor thin-film resistor power splitter -55
Contextual Info: Thin Film Chip Power Splitter RN 1632E Series This chip resistor power splitter is ideal for use at high frequencies due to low parasitic capacitance and inductance. • Frequency to 2.5GHz • 1206 Size • Power to 125mW 1206 Size Dimensions in mm Specifications:

ERJA1

Abstract: RESISTOR ARRAY 0402 land pattern
Contextual Info: Surface Mount Resistors Packaging Method Taping Surface Mount Resistors Series Products Type Size mm (inch) 0402 (01005) 0603 ERJ1GN (0201) 1005 ERJ2GE (0402) 1608 ERJ3GE (0603) 2012 ERJ6GE Thick Film (0805) 3216 Chip Resistors ERJ8GE (1206) 3225 ERJ14 (1210)

MMA0204

Abstract: MMB0207
Contextual Info: al Glaze General Purpose Metal Glaze™ General Purpose faceSurface Mount Power Resistor Mount Power Resistor Metal Glaze™ General Purpose •Surface Up to 2 watts Mount Power Resistor MM Series es watts 00 volts · Up to 1000 volts · 0.1 ohm to 2.2 megohm range

Contextual Info: Resistors Make Possible Metal Glaze General Purpose ™ Power Resistor Surface Mount Metal Glaze General Purpose Surface Mount Power Resistor MM Series Up to 2 watts Up to 1000 volts MM Series 0.1 ohm to 2.2 megohm range • Up to 2 watts 150°C maximum operating temperature

3610 footprint

Abstract: MMA-0204-50 mma0204-50
Contextual Info: Metal Glaze General Purpose Surface Mount Power Resistor Metal Glaze™ thick film element fired at 1000°C to solid ceramic substrate MM Series • Up to 2 watts • Up to 1000 volts High temperature dielectric coating • 0.1 ohm to 2.2 megohm range • 150°C maximum operating temperature

MMA0204

Abstract: MMA0204-50 MMC0310 1206 footprint dimension MMB0207 1R00 51R0 R250
Contextual Info: Metal Glaze General Purpose Surface Mount Power Resistor Metal Glaze™ thick film element fired at 1000°C to solid ceramic substrate MM Series • Up to 2 watts • Up to 1000 volts High temperature dielectric coating • 0.1 ohm to 2.2 megohm range • 150°C maximum operating temperature

FTA 002 23 01

Contextual Info: ÎS IB B f lC IIlB it n ït S Œ ^ B B ü Low Ohm ic Thick Film Chip Fixed Resistor Features I l i H : 4.7mn -lOOOmO Resistance values from 4.7m to 1000m ohm m / K mmm Miniature and lig h t weight Current detecting re sisto rs for power supply, motor c irc u its , etc

film resistors CR16

Abstract: Resistor 162 value package 1210 data sheet of resistor 33k CR-05J CR05-J-KITS 0603 5,11K 1
Contextual Info: THICK FILM CHIP RESISTORS 05/16/05 TAPE SCHEMATIC REEL DRAWINGS TAPE DIMENSIONS mm 7” Reel (M) A B W E F P1 T Tp 0201 0.41±0.1 0.71±0.1 8.0±0.2 1.75±0.10 3.5±0.05 2.0±0.05 0.5max 0.4+0.05 0402 0.65±0.1 1.15±0.1 8.0±0.2 1.75±0.10 3.5±0.05 2.0±0.05

Contextual Info: Chip Resistor Series 712 Package Dimensions Dimensions mm/inch Case Size L W T A 0.85 ± 0.10 0.45 ± 0.05 0603 1.60 ± 0.10 0.063 ± 0.004 0.033 ± 0.004 0.018 ± 0.002 1.30 ± 0.10 0.50 ± 0.05 0805 2.10 ± 0.10 0.083 ± 0.004 0.051 ± .004 0.020 ± 0.002

3610 resistor size

Abstract: RESISTOR FOOTPRINT 2010 BC 536 3610 footprint
Contextual Info: ISO-9001 Registered CHP FAMILY STANDARD SIZES, SOLDER PADS AND PACKAGING: DIMENSIONS Inches and (mm : L C W Size Code Industry Footprint Actual Size L W C 0.057±0.006 (1.45±0.15) 0.020±0.010 (0.51±0.25) B 1206 0.128±0.007 (3.25±0.18) C 1206 0.128±0.007

Contextual Info: Chip Resistor Networks Chip Resistor Networks Type: EXBD:1206 EXBE:1608 EXBA:2512 EXBQ:1506 n Features l High density placing for digital signal circuits á Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm ´ 1.6 mm ´ 0.55 mm, 0.635 mm pitch

Contextual Info: Chip Resistor Networks Chip Resistor Networks Type: EXBD:1206 EXBE:1608 EXBA:2512 EXBQ:1506 n Features l High density placing for digital signal circuits á Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm ´ 1.6 mm ´ 0.55 mm, 0.635 mm pitch

Contextual Info: Chip Resistor Networks Chip Resistor Networks Type: EXBD:1206 EXBE:1608 EXBA:2512 EXBQ:1506 n Features l High density placing for digital signal circuits á Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm ´ 1.6 mm ´ 0.55 mm, 0.635 mm pitch

Contextual Info: Chip Resistor Networks Chip Resistor Networks Type: EXBD:1206 EXBE:1608 EXBA:2512 EXBQ:1506 n Features l High density placing for digital signal circuits á Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm ´ 1.6 mm ´ 0.55 mm, 0.635 mm pitch

bc815

Abstract: "Infrared TRANSCEIVER" DATASHEET bc815 transistor capacitor Vishay VJ 1206 EIA232 MAX232 SO16L TFDS4000 TFDS4500 TFDS4500 IC
Contextual Info: TOIM3232 Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 mm Description The TOIM3232 IC provides proper pulse shaping for

bc815

Abstract: bc815 transistor MAX232 for level converter ic 293D EIA232 MAX232 SO16L TFDS4000 TFDS4500 capacitor Vishay VJ 1206
Contextual Info: TOIM3232 Not for new designs Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 mm Description The TOIM3232 is using a crystal clock 3.6864 MHz for

16550 uart national and Application Not

Abstract: TFDS4100 CRCW maxim 1987 maxim max 1987 EIA232 MAX232 TFDS4000 TFDU4100 XT49M
Contextual Info: TOIM4232 Vishay Telefunken SIR Endec for IrDA Applications Integrated Interface Circuits ULC Technology: High-performance gate array package using multiple metal layer CMOS technology featuring sub-micron channel lengths 0.35 mm Description The TOIM4232 Endec IC provides proper pulse

resistor exbd

Abstract: Resistor dimensions 1206 to mm
Contextual Info: Chip Resistor Networks • Features 1. High density placing for digital signal circuits ● Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm x 1.6 mm × 0.55 mm, 0.635 mm pitch EXBE: 4.0 mm × 2.1 mm × 0.55 mm, 0.8 mm pitch EXBA: 6.4 mm × 3.1 mm × 0.55 mm, 1.27 mm pitch

TTL RS232 Level Converter

Abstract: maxim 1987 MAX3232CSE maxim max 1987 4000 Series Integrated Infrared Transceiver Cannon connectors CMOS RS232 Level Converter sub-d9 "Infrared TRANSCEIVER" DATASHEET capacitor Vishay VJ 1206
Contextual Info: TOIM4232 Vishay Semiconductors SIR Endec for IrDA Applications Integrated Interface Circuits ULC Technology: High-performance gate array package using multiple metal layer CMOS technology featuring sub-micron channel lengths 0.35 mm Description The TOIM4232 Endec IC provides proper pulse

TFDU4500

Abstract: TFDS4100 1N4148 1206 CRCW maxim 1987 maxim max 1987 EIA232 MAX232 TFDS4000 TFDU4100
Contextual Info: TOIM4232 Vishay Telefunken SIR Endec for IrDA Applications Integrated Interface Circuits ULC Technology: High-performance gate array package using multiple metal layer CMOS technology featuring sub-micron channel lengths 0.35 mm Description The TOIM4232 Endec IC provides proper pulse

CRCW

Abstract: ic 293D 4000-Series
Contextual Info: TOIM3232 Not for new designs Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 mm Description The TOIM3232 is using a crystal clock 3.6864 MHz for

BC815-25

Abstract: bc815 CRCW 1n4145 Temic ulc ic 293D
Contextual Info: TOIM3232 Not for new designs Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 mm Description The TOIM3232 is using a crystal clock 3.6864 MHz for

BCN318

Abstract: capacitor 16K BCN 16 4A capacitor BCN E6-E12 BCN318RB
Contextual Info: bi441 short form 2007 dev.qxd 14 6/26/07 8:59 AM Page 14 Fixed Resistors Thick Film Chip Resistor Arrays Resistor Arrays Model BCN 10 4 BCN 16 4 BCN 16 8 Industrial Style, Inches mm 0804 (2010) 1206 (3216) 1206 (3216) Standard Resistance Range, Ohms 10 to 1 Meg

capacitor 22uF

Abstract: IRM5000 IRM7001
Contextual Info: IRM7001 SIR Modulator/Demodulator Dimensions in inches mm SOIC Package A .393 (10.0) .386 (9.8) B .157 (4.0) .244 (6.2) 8 .150 (3.8) .229 (5.8) 16 9 1 .050 (1.27) BSC .068 (1.75) .054 (1.35) R x 45° .009 (.25) .008 (.19) T .019 (.49) .014 (.35) FEATURES