HIGH VOLTAGE MLCC (SURFACE MOUNT)
Abstract: No abstract text available
Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking
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300MHz
HIGH VOLTAGE MLCC (SURFACE MOUNT)
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Untitled
Abstract: No abstract text available
Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking
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300MHz
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mlcc AVX
Abstract: HIGH VOLTAGE MLCC (SURFACE MOUNT)
Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking
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300MHz
mlcc AVX
HIGH VOLTAGE MLCC (SURFACE MOUNT)
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0508-8 X7S 6.3v 1
Abstract: No abstract text available
Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking
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300MHz
0508-8 X7S 6.3v 1
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resistor 0306 package
Abstract: bl 0306 0306 capacitor 0508-8 X7S 6.3v Licc avx
Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking
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300MHz
resistor 0306 package
bl 0306
0306 capacitor
0508-8 X7S 6.3v
Licc avx
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LD18
Abstract: LD17
Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking
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300MHz
LD18
LD17
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resistor 0306 package
Abstract: size 0204 capacitor
Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking
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300MHz
resistor 0306 package
size 0204 capacitor
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size 0204 capacitor
Abstract: LICC low inductance chip capacitor HIGH VOLTAGE MLCC (SURFACE MOUNT)
Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking
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300MHz
size 0204 capacitor
LICC
low inductance chip capacitor
HIGH VOLTAGE MLCC (SURFACE MOUNT)
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PDF
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LD18
Abstract: Capacitor 16v LD17
Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking
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300MHz
LD18
Capacitor 16v
LD17
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Untitled
Abstract: No abstract text available
Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking
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Original
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300MHz
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PDF
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Untitled
Abstract: No abstract text available
Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking
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300MHz
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LICA3T333M1FC4AA
Abstract: S55S LICA3T104P1FC1AA LICA3T134M1FC1AA LICA3T153P3FC4AA LICA3T193M3FC4AA LICA3T263P3FC4AA MIL-PRF-123 LICAZD504M3FC1AB current loop
Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking
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300MHz
H20-080
LICA3T333M1FC4AA
S55S
LICA3T104P1FC1AA
LICA3T134M1FC1AA
LICA3T153P3FC4AA
LICA3T193M3FC4AA
LICA3T263P3FC4AA
MIL-PRF-123
LICAZD504M3FC1AB
current loop
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PDF
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LICA3T104P1FC1AA
Abstract: LICA3T134M1FC1AA LICA3T153P3FC4AA LICA3T193M3FC4AA LICA3T263P3FC4AA LICA3T333M1FC4AA MIL-PRF-123 S55S 97Pb cap 0306 package
Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking
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Original
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300MHz
H20-080
LICA3T104P1FC1AA
LICA3T134M1FC1AA
LICA3T153P3FC4AA
LICA3T193M3FC4AA
LICA3T263P3FC4AA
LICA3T333M1FC4AA
MIL-PRF-123
S55S
97Pb
cap 0306 package
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PDF
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Low Inductance Capacitors
Abstract: No abstract text available
Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking
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300MHz
H20-080
Low Inductance Capacitors
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bl 0306
Abstract: No abstract text available
Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking
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Original
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300MHz
bl 0306
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Untitled
Abstract: No abstract text available
Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking
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300MHz
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lga components
Abstract: No abstract text available
Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking
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300MHz
lga components
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L68A
Abstract: bl 0306
Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking
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300MHz
L68A
bl 0306
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CRG0805
Abstract: No abstract text available
Text: Thick Film Chip Resistors Type CRG Series Characteristics Electrical Type CRG Series Rated Power @ 70 °C W Resistance Range (Ohms) Min Max Tolerance (%) Code letter Selection Series Temperature Coefficient (ppm/°C) 10 1M0 1 F E24 0402 0.063 1 10 5 J E24
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mpc5500
Abstract: EB643 MPC5500-Based AN2127 MPC500 HK10 EMC APPLICATION note AN2706 eb64
Text: Freescale Semiconductor Application Note AN2706 Rev. 0.1, 01/2005 EMC Guidelines for MPC5500-Based Systems by: Stevan Dobrasevic TECD Design Engineering This application note describes recommended EMC guidelines for reducing electromagnetic emissions in MPC5500-based systems.
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AN2706
MPC5500-Based
mpc5500
EB643
AN2127
MPC500
HK10
EMC APPLICATION note
AN2706
eb64
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PDF
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Susumu Date Code
Abstract: No abstract text available
Text: RR series SUSUMU CO.,LTD Precision 0.1% and 0.5%, tolerance Thin Film Chip Resistor FEATURES • Excellent low noise, THIN FILM NiCr construction • Low temperature coefficient and tight tolerance • EIA standard case size(0201, 0402, 0603, 0805) • RoHS Compliance and 100% Lead-Free (Matte Sn termination finished)
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RR1220
RR1632
RR2632
Susumu Date Code
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E96 Series colour code
Abstract: LR180
Text: Metal Film Fixed Resistors Type LR Series Characteristics Electrical Type LR Series The resistive element comprises a thin film of nickel-chrome alloy evaporated onto a high thermal conductivity ceramic element. Metal end caps are force fitted to the element prior to
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LR0204
E96 Series colour code
LR180
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relay driver ic ULN2803
Abstract: ULN2803 ULN2804AP ULN2804AFW ULN2803AFW ULN2803AP toshiba uln2803 LN2804A
Text: TOSHIBA ULN2803/04AP/AFW TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC ULN2803AP, ULN2803AFW, ULN2804AP, ULN2804AFW 8CH DARLINGTON SINK DRIVER The ULN2803AP/ AFW Series are high-voltage, high-current d a rling ton drivers comprised o f e ig h t NPN darlington
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OCR Scan
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ULN2803/04AP/AFW
ULN2803AP,
ULN2803AFW,
ULN2804AP,
ULN2804AFW
ULN2803AP/
500mA
ULN2803AP/AFW
SOL-18pin
relay driver ic ULN2803
ULN2803
ULN2804AP
ULN2803AFW
ULN2803AP
toshiba uln2803
LN2804A
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PDF
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Untitled
Abstract: No abstract text available
Text: TC90A36F TOSHIBA TENTATIVE TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TC90A36F FIELD DOUBL-SCAN CONVERTER IC FOR A MULTI-STANDARD COLOR TV TC90A36F converts YUV signals with 50Hz or 60Hz of fv Vertical Frequency into YUV signals with 100Hz or 120Hz
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OCR Scan
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TC90A36F
TC90A36F
100Hz
120Hz
TC90A36F,
625kHz
250kHz/
734kHz
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PDF
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