RESIN COMPOUND Search Results

RESIN COMPOUND Result Highlights (5)

Part	Manufacturer	Description
LM5111-4M/NOPB	Texas Instruments	Dual 5A Compound Gate Driver 8-SOIC
LM5111-4MY/NOPB	Texas Instruments	Dual 5A Compound Gate Driver 8-MSOP-PowerPAD
LM5111-1MYX/NOPB	Texas Instruments	Dual 5A Compound Gate Driver 8-MSOP-PowerPAD
LM5111-2MYX/NOPB	Texas Instruments	Dual 5A Compound Gate Driver 8-MSOP-PowerPAD
LM5111-1MY/NOPB	Texas Instruments	Dual 5A Compound Gate Driver 8-MSOP-PowerPAD

RESIN COMPOUND Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
HG-2 Abstract: 3060A 7471A AES chips E.04 Contextual Info: Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Cu Fe P Zn SOIC 150 mils 8 Pb-Free Molding Compound % of Compound Weight g 10 4.44 E-03 85 3.77 E-02 3 1.33 E-03 1.5 6.66 E-04	Original	6010B HG-2 3060A 7471A AES chips E.04	PDF
DSA0090625.txt Contextual Info: 5.0 mm DIA LED LAMP 599R2GYW-CC REV:A / 0 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange	Original	599R2GYW-CC DS-35-07-0235 HD-R/RD013 DSA0090625.txt	PDF
k2950 Abstract: IR 16713 Contextual Info: 5.0 mm DIA LED 540R2GY-CC LAMP REV:A / 0 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange	Original	540R2GY-CC DS-35-07-0235 HD-R/RD013 k2950 IR 16713	PDF
Contextual Info: 5.0 mm DIA LED LAMP REV:A / 1 520MY8C-f2 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange	Original	520MY8C-f2 DS-35-05-0057	PDF
Contextual Info: 5.0 mm DIA LED LAMP REV:A / 1 520CG6C-f2 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange	Original	520CG6C-f2 DS-35-08-0354	PDF
PA 0016 Abstract: 520LB7C D4463 Contextual Info: 5.0 mm DIA LED LAMP REV:A / 1 520LB7C-F2 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange	Original	520LB7C-F2 -400V DS-35-07-0016 HD-R/RD013 PA 0016 520LB7C D4463	PDF
d4515 Abstract: LED highlight Contextual Info: 5.0 mm DIA LED LAMP REV:A / 0 520PG2C-F2 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange	Original	520PG2C-F2 -400V DS-35-08-0395 mm8-12-24 d4515 LED highlight	PDF
Contextual Info: 12X12mm SMD LED WITH CERAMIC SUBSTRATE Part Number: KT-1213WG9SX9/10 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Materials: Features Dimensions : 12mmX12mmX1.2mm Package : Ceramics High power lighting. Encapsulating resin : Silicone resin	Original	12X12mm KT-1213WG9SX9/10 12mmX12mmX1 DSAK1042 OCT/07/2011	PDF
JESD22-A120 Contextual Info: 12X12mm SMD LED WITH CERAMIC SUBSTRATE Part Number: KT-1213WG9SX9/10 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features Materials: z Dimensions : 12mmX12mmX1.2mm Package : Ceramics z High power lighting. Encapsulating resin : Silicone resin	Original	12X12mm KT-1213WG9SX9/10 12mmX12mmX1 DSAK1042 OCT/07/2011 JESD22-A120	PDF
SB2336E-G Contextual Info: SB2336E-G Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin	Original	SB2336E-G 100pF, KSD-O8V005-003 SB2336E-G	PDF
SSB2336 Contextual Info: SSB2336E-GD2 Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin	Original	SSB2336E-GD2 100pF, KSD-O8V022-002 SSB2336	PDF
Contextual Info: SW2336E-H Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin	Original	SW2336E-H 100pF, KSD-O8V001-004	PDF
isopropyl alcohol Abstract: B589 Contextual Info: SY2336-HA Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin	Original	SY2336-HA KSD-O8V023-002 isopropyl alcohol B589	PDF
Contextual Info: SY2336-GA Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin	Original	SY2336-GA KSD-O8V026-003 SY2336-GA	PDF

Contextual Info: SSB2336E-GD3 Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin	Original	SSB2336E-GD3 100pF, KSD-O8V025-002	PDF
Contextual Info: SA2336-GA Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin	Original	SA2336-GA KSD-O8V031-001	PDF
Contextual Info: SA2336-GA Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin	Original	SA2336-GA KSD-O8V031-000	PDF
B1588 Contextual Info: SY2336-GA Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin	Original	SY2336-GA KSD-O8V026-004 B1588	PDF
Contextual Info: SW2336E-H Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin	Original	SW2336E-H 100pF, KSD-O8V001-003	PDF
Contextual Info: WT-U3A8TW-8538 TOP Mount Super Bright SMD LED Product Specifications Specification Material Quantity Resin White Silicone Resin Carrier tape EIA 481-1A specs Conductive black tape Reel EIA 481-1A specs Conductive black Label WT standard Paper Packing bag 220x240mm	Original	WT-U3A8TW-8538 81-1A 220x240mm 1000pcs 30sec, 01-Feb-2013	PDF
Contextual Info: Materials Declaration Data Sheet ASDM_ASDMB QFN 2.5 x 2.0 mm 12.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating	Original	NEX-130CT 8200T Q3-6646)	PDF
Contextual Info: WT-U3A8TW-8539 TOP Mount Super Bright SMD LED Product Specifications Specification Material Quantity Resin Cool White Silicone Resin Carrier tape EIA 481-1A specs Conductive black tape Reel EIA 481-1A specs Conductive black Label WT standard Paper Packing bag	Original	WT-U3A8TW-8539 81-1A 220x240mm 1000pcs 30sec, 01-Feb-2013	PDF
Q3-6646 Contextual Info: Materials Declaration Data Sheet ASEM_ASEMB QFN 3.2 x 2.5 mm 19.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating	Original	NEX-130CT 8200T Q3-6646) Q3-6646	PDF
Contextual Info: Materials Declaration Data Sheet ASFLM,ASFLMB QFN 5.0 x 3.2 mm 37.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating	Original	NEX-130CT 8200T Q3-6646)	PDF

RESIN COMPOUND Search Results

RESIN COMPOUND Result Highlights (5)

RESIN COMPOUND Datasheets Context Search

HG-2

DSA0090625.txt

k2950

PA 0016

d4515

JESD22-A120

SB2336E-G

SSB2336

isopropyl alcohol

B1588

Q3-6646