REQUIREMENTS FOR LAND GRID ARRAY LGA PACKAGES Search Results

REQUIREMENTS FOR LAND GRID ARRAY LGA PACKAGES Result Highlights (5)

Part	Manufacturer	Description
TPH9R00CQH	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N)
TPH2R408QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance
XPH2R106NC	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF)
XPH3R206NC	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF)
TPH4R008QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N)

REQUIREMENTS FOR LAND GRID ARRAY LGA PACKAGES Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
AN3281 Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.1, 12/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style	Original	AN3311 MC1320x MC1321x AN3281 LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate	PDF
LGA voiding Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style	Original	AN3311 MC1320x MC1321x LGA voiding AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale	PDF
diagrams hitachi ecu Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog" Text: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble	Original	D-85622 REJ01K0003-0200Z diagrams hitachi ecu SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"	PDF
LGA voiding Abstract: NC-SMQ230 Indalloy 181 Solder Paste, Indium, Type 3 AN2920 7313 28 pin freescale ltcc BGA cte hcte ipc 610D Text: Freescale Semiconductor Application Note Document Number: AN2920 Rev. 2, 12/2008 Manufacturing with the Land Grid Array Package by Networking & Multimedia Group Freescale Semiconductor, Inc. Austin, TX Freescale has introduced the High Coefficient of Thermal	Original	AN2920 LGA voiding NC-SMQ230 Indalloy 181 Solder Paste, Indium, Type 3 AN2920 7313 28 pin freescale ltcc BGA cte hcte ipc 610D	PDF
1000-pin bga 0,8 mm Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog" Text: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble	Original	Unit2607 REJ01K0003-0300 1000-pin bga 0,8 mm HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"	PDF
LGA rework Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework Text: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules	Original	AN3241 MC1320x MC1321x LGA rework AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework	PDF
lga16 land pattern Abstract: LGA16 footprint TN0018 LGA 16L 4x4x1 LGA16 L footprint LGA16 LGA land pattern ST LGA-16 JESD97 Text: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Introduction This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. Note: April 2008 Data provided in this document are to be intended as reference for PCB design and	Original	TN0018 lga16 land pattern LGA16 footprint TN0018 LGA 16L 4x4x1 LGA16 L footprint LGA16 LGA land pattern ST LGA-16 JESD97	PDF
LGA16 footprint Abstract: TN0018 lga16 land pattern LGA16 L footprint 788755 LGA voiding LGA16 JESD97 LGA14 lga16 land Text: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Abstract This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. October 2006 Rev 1 1/13 www.st.com Contents TN0018 Contents	Original	TN0018 LGA16 footprint TN0018 lga16 land pattern LGA16 L footprint 788755 LGA voiding LGA16 JESD97 LGA14 lga16 land	PDF
pcb design of zigbee Abstract: FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32 Text: Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual Document Number: ZHDCRM Rev. 1.3 08/2009 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor	Original	CH370 pcb design of zigbee FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32	PDF
pcb warpage in ipc standard Abstract: JEDEC J-STD-033A J-STD-033A LGA rework JSTD033A reflow profile FOR LGA COMPONENTS AN1028 8015 j AN-1028 AN-1029 Text: Application Note AN-1028 Recommended Design, Integration and Rework Guidelines for International Rectifier’s BGA and LGA Packages by Kevin Hu, International Rectifier Table of Contents Page Introduction .1	Original	AN-1028 AN-1029. pcb warpage in ipc standard JEDEC J-STD-033A J-STD-033A LGA rework JSTD033A reflow profile FOR LGA COMPONENTS AN1028 8015 j AN-1028 AN-1029	PDF
LTM 4606 EVALUATION BOARD Abstract: LTM4612 LTM4614 LTM4616 24v 2A regulator LTM4607 LTM4602 LTM4608 LT 5210 step down transformer 200mA Text: Linear Technology Chronicle High Performance Analog Solutions VOL 17 NO. 2 FOCUS. DC/DC µModule Power Supply Solutions Inside This Issue • Ultralow Noise Step-Downs · Dual Output Step-Downs · High Current Step-Downs · Low Input Voltage Step-Downs · High Input Voltage Step-Downs	Original	Corporation/0908/Printed LTM 4606 EVALUATION BOARD LTM4612 LTM4614 LTM4616 24v 2A regulator LTM4607 LTM4602 LTM4608 LT 5210 step down transformer 200mA	PDF
IPC-7527 Abstract: LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT Text: Application Note 100 February 2006 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single	Original	101752C 01049A an100fb AN100-10 434-0507CAwww IPC-7527 LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT	PDF
Untitled Abstract: No abstract text available Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking	Original	300MHz	PDF
lga components Abstract: No abstract text available Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking	Original	300MHz lga components	PDF

L68A Abstract: bl 0306 Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking	Original	300MHz L68A bl 0306	PDF
bl 0306 Abstract: No abstract text available Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking	Original	300MHz bl 0306	PDF
LGA voiding Abstract: IPC-7527 IPC7525 lga material koki solder paste LTM4600 an100fc AN100 IPC7525 reflowing profiles lga Water soluble flux Text: Application Note 100 February 2006 Revised January 2008 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 Introduction The Linear Technology Module solution combines integrated circuits and passive components in a single package.	Original	101752C 01049A an100fc AN100-14 LGA voiding IPC-7527 IPC7525 lga material koki solder paste LTM4600 an100fc AN100 IPC7525 reflowing profiles lga Water soluble flux	PDF
BTS4020 Abstract: BTS402 smd elco 10uf 35v smx 5138 microsd kyocera ceramic resonator through hole KC2520c military passive component smd elco 10*f 35v smx gsc3e qualcomm 7200 Text: AVX is the technology leader in the Passive electronic component and connector markets. Each year AVX Corporation accepts the challenge of helping Design Engineers create superior products for their customers. Our team of innovators around the world, utilize cutting edge research, design expertise and materials	Original	S-WN0815M608-R BTS4020 BTS402 smd elco 10uf 35v smx 5138 microsd kyocera ceramic resonator through hole KC2520c military passive component smd elco 10*f 35v smx gsc3e qualcomm 7200	PDF
IPC-7527 Abstract: IPC-7525 koki solder paste IPC7527 Text: Application Note 100 June 2005 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single	Original	101752C 01049A an100p AN100-10 434-0507CAwww IPC-7527 IPC-7525 koki solder paste IPC7527	PDF
vFBGA* 96 bALL Abstract: Amkor Wafer level mold compound amkor cabga thermal resistance BGA 256 PACKAGE thermal resistance Amkor Technology CABGA CTBGA MO-195 BGA PACKAGE thermal resistance amkor cabga Text: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: ChipArray® BGA CABGA / LFBGA Thin ChipArray® BGA (CTBGA / TFBGA) Very Thin ChipArray® BGA (CVBGA / VFBGA) Amkor’s ChipArray® packages are laminatebased Ball Grid Array (BGA) packages that are	Original		PDF
land pattern for TSOP 2 86 PIN Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730 Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS	Original		PDF
block diagram for RF transmitter AND RECEIVER Abstract: superheterodyne receiver GSM wcdma modulator CX74041 GSM transmitter receiver WCDMA duplexer CX74038 CX74040 IMT-2000 superheterodyne receiver WCDMA Text: wireless communications products WCDMA RF Subsystem Conexant Delivers Highly Integrated RF Chipset for WCDMA Applications Conexant offers a complete highly-integrated RF chipset to meet the needs of WCDMA terminal devices. The RF subsystem is designed and optimized for use in WCDMA and UMTS	Original	IMT-2000 101598B block diagram for RF transmitter AND RECEIVER superheterodyne receiver GSM wcdma modulator CX74041 GSM transmitter receiver WCDMA duplexer CX74038 CX74040 superheterodyne receiver WCDMA	PDF
Turn-Key Abstract: Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets Text:  RoHS ISO w i t h 900 d 08 20 i g n : 1 es Certified Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . 2 Catalog 26 Receptacles . . . . . . . . . . . . . . . . . . . . . 22 Package Conversion For Production Applications . . . . 24-25	Original	75GHz 50-80grams Turn-Key Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets	PDF
LY330ALH Abstract: LGA-10 LY330ALHTR gyroscope 9 AXIS LGA10 LGA land pattern MEMS Gyroscope Text: LY330ALH MEMS motion sensor: high performance ±300 dps analog yaw-rate gyroscope Features • 2.7 V to 3.6 V single-supply operation ■ Wide operating temperature range -40 °C to +85 °C ■ High stability over temperature ■ Analog absolute angular-rate outputs	Original	LY330ALH LGA-10 LY330ALH LGA-10 LY330ALHTR gyroscope 9 AXIS LGA10 LGA land pattern MEMS Gyroscope	PDF

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REQUIREMENTS FOR LAND GRID ARRAY LGA PACKAGES Search Results

REQUIREMENTS FOR LAND GRID ARRAY LGA PACKAGES Result Highlights (5)

REQUIREMENTS FOR LAND GRID ARRAY LGA PACKAGES Datasheets Context Search

AN3281

LGA voiding

diagrams hitachi ecu

LGA voiding

1000-pin bga 0,8 mm

LGA rework

lga16 land pattern

LGA16 footprint

pcb design of zigbee

pcb warpage in ipc standard

LTM 4606 EVALUATION BOARD

IPC-7527

Untitled

lga components

L68A

bl 0306

LGA voiding

BTS4020

IPC-7527

vFBGA* 96 bALL

land pattern for TSOP 2 86 PIN

block diagram for RF transmitter AND RECEIVER

Turn-Key

LY330ALH