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Abstract: No abstract text available
Text: Known Good Die: The Challenge of the Technology M ark Lippold and Sherburne Bridges National Semiconductor, Inc. South Portland, M aine Abstract The challenges of supplying high yield, high quality, cost effective Known Good Die KGD are discussed in detail. A review of the history behind die supply processing and technology drivers provide insight into the
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Abstract: No abstract text available
Text: SHARP OPTO-ELECTRONIC DEVICES DIVISION ELECTRO N IC COM PONENTS GROUP SHARP CORPORATION SPECIFICATION D EV ICE SPECIFICATION FO R PHOTOCOUPLER M O D EL No. PC815 Business dealing name PC815XJ0000F PC815XYJ000F Specified for Enclosed please find copies o f the Specifications which consists o f 14 pages including cover.
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PC815
PC815XJ0000F
PC815XYJ000F
171mm
PC815XYJOOOF)
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schematic WELDER
Abstract: gold melting furnace ultrasonic bond
Text: Bonding and Handling Procedures for Chip Devices DISCUSSION Chip diode devices for use in integrated circuit and hybrid integrated circuits have proliferated in the last few years. Today's circuit designer is faced with a multiplicity of alter natives in the selection of diodes and packaging with each
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OT-23
schematic WELDER
gold melting furnace
ultrasonic bond
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Abstract: No abstract text available
Text: PR33MA11NTZF PR33MA11NTZF IT rms ≤0.3A, Non-Zero Cross type DIP 6pin SSD •Description ■Agency approvals/Compliance PR33MA11NTZF Solid State Device (SSD) are an integration of an infrared emitting diode (IRED), a Phototriac Detector. These devices are ideally suited for controlling high
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PR33MA11NTZF
PR33MA11NTZF
OP13017EN
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reliability data analysis
Abstract: No abstract text available
Text: 1 GENERAL INFORMATION Reliability INTRODUCTION Vantis’ and AMD’s Qualification Maintenance Program QMP is used to measure the reliability of all process technologies on a regular basis. This is an extensive effort that is aimed at providing generic fab process coverage for all fab process technologies. Typically about 30,000 devices per
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MIL-STD-883 Method 2010
Abstract: No abstract text available
Text: DICE PRODUCTS INTRODUCTION Linear Technology Corporation LTC offers a wide variety of precision linear ICs in die form. It is our intent to offer dice electrically tested to levels which can be expected to yield the best possible performance in hybrid circuits.
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MIL-STD-883 Method 2010
Abstract: No abstract text available
Text: DICE PRODUCTS INTRODUCTION Linear Technology Corporation LTC offers a wide variety of precision linear ICs in die form. It is our intent to offer dice electrically tested to levels which can be expected to yield the best possible performance in hybrid circuits.
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MIL-STD-883 Method 2010
Abstract: No abstract text available
Text: DICE PRODUCTS INTRODUCTION Linear Technology Corporation LTC offers a wide variety of precision linear ICs in die form. It is our intent to offer dice electrically tested to levels which can be expected to yield the best possible performance in hybrid circuits.
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Untitled
Abstract: No abstract text available
Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK Standard & Custom Products, DC to 110 GHz! Analog, Digital & Mixed-Signal ICs, Modules, Subsystems & Instrumentation
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AS9100
MIL-PRF-38534-K
MIL-PRF-38535-S
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Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK Space Qualified Processes, People & Facilities! Analog, Digital & Mixed-Signal ICs, Modules, Subsystems & Instrumentation
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AS9100
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Moisture Sensitivity Level Rating
Abstract: JESD22-A113 moisture sensitive handling and packaging moisture sensitivity s2083 JEDEC J-STD-033 moisture handling and packaging S2080 J-STD-033
Text: Moisture Effects on the Soldering of Plastic Encapsulated Devices S2080 V4 Introduction Improper packaging, storage, and handling of plastic encapsulated devices PED’s can trap moisture within the devices and lead to damage during reflow soldering to printed circuit boards. As part of reliability qualification
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S2080
Moisture Sensitivity Level Rating
JESD22-A113
moisture sensitive handling and packaging
moisture sensitivity
s2083
JEDEC J-STD-033
moisture handling and packaging
S2080
J-STD-033
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S2083
Abstract: JESD22-A113 J-STD-033 S2080
Text: Application Note S2080 Moisture Effects on the Soldering of Plastic Encapsulated Devices Introduction Improper packaging, storage, and handling of plastic encapsulated devices PED’s can trap moisture within the devices and lead to damage during reflow soldering
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S2080
S2083
JESD22-A113
J-STD-033
S2080
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JEP140
Abstract: AN-400 JESD22-A102 JESD22-A103 JESD22-A108 JESD22-A110 JESD22-A113 JESD22-B100 JESD22-B102 JESD22-B105
Text: AN-400 April 2008 Surface Mount Plastic Packages for High Reliability Applications Applications Note Introduction Holt Integrated Circuits specializes in the design and manufacture of components for military and aerospace applications. Traditionally the aerospace industry has specified the
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AN-400
JEP140
AN-400
JESD22-A102
JESD22-A103
JESD22-A108
JESD22-A110
JESD22-A113
JESD22-B100
JESD22-B102
JESD22-B105
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x band diode detector waveguide
Abstract: CME7660-000 DIODE RL 207 8E08 detector doppler ka CDB7619-000 CDC7630-000 RF 207 Silicon Detector Diodes Alpha Industries
Text: Silicon Schottky Barrier Detector Diodes Features 3 Both P–Type and N–Type Low Barrier Silicon Available Low 1/f Noise Bonded Junctions for Reliability Planar Passivated Beam–Lead and Chip Construction See Also Zero Bias Silicon Schottky Barrier Detector Diodes
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ultrasonic bond
Abstract: schematic WELDER Gunn Diode schematic WELDER capacitor M541 varactor beam lead thermal conductive teflon mesa similar
Text: Application Note M an A M P com pany Bonding and Handling Procedures for Chip Diode Devices M541 V 2.00 Discussion Microstrip Packages and Chip Carriers Chip diode devices for use in integrated circuit and hybrid integrated circuits have proliferated in the last
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Untitled
Abstract: No abstract text available
Text: Packaged PIN Diodes RoHS Compliant Rev V.7 Maximum Power Dissipation Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ High Power Fast Speed Voltage Ratings to 1500 Volts Wide Selection of Carrier Lifetimes Wide Selection of Capacitances Assortment of Packages Styles Available Screened for Military Applications
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250mW
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MA4P504
Abstract: No abstract text available
Text: Packaged PIN Diodes RoHS Compliant Rev V.6 Maximum Power Dissipation Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ High Power Fast Speed Voltage Ratings to 1500 Volts Wide Selection of Carrier Lifetimes Wide Selection of Capacitances Assortment of Packages Styles Available Screened for Military Applications
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rover
Abstract: J1000
Text: SPEb^fo. / ED-Q2Û78 , x . ISSUE Maiçh;i8,20Q2 SHARP OPTOELECTRONIC DEVICES DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATION FOR INFRARED EMITTING DIODE MODEL No. G L 100M N 0M P1M Specified for Enclosed please find copies of the Specifications which consists of 14 pages including cover.
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ED-Q2078
GL100MN0MP1M
GL100MN0MP1M
rover
J1000
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RSC-164
Abstract: RSC164
Text: Application Note Quality and Reliability Introduction Sensory strives to improve customer satisfaction through the on-time delivery of quality products that meet or exceed customer expectations and requirements. To meet these needs, Sensory is committed to the goal
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s- band Waveguide limiter
Abstract: AEROFLEX Attenuators microwave transceiver MIL-STD-1553 cable connector Aeroflex KDI Resistor SURFACE MOUNT DIODES MIL GRADE GaAs tunnel diode GSM BTS antenna Ferrite Circulators at 15 ghz tunnel diode GaAs
Text: RF & Microwave Devices Components RF Modules & Subsystems Capabilities Brochure Microelectronic Solutions – RFMW 2006 R F & M O D U L E S S U B S Y S T E M S C O M P O N E N T S D E V I C E S P E R F O R M A N C E Aeroflex is a world leader in the design, manufacture
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S2080
Abstract: No abstract text available
Text: Application Note S2080 Moisture Effects on the Soldering of Plastic Encapsulated Devices Introduction Improper packaging, storage, and handling of plastic encapsulated devices PED’s can trap moisture within the devices and lead to damage during reflow soldering
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S2080
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diode RL 207
Abstract: gold metal detectors gold detector circuit free x band diode detector waveguide CDB7620-207 ka-band mixer DDB2503-250 DDB2504-000 DDB2504-230 DDB2265-000
Text: DATA SHEET Silicon Schottky Barrier Diodes: Packaged, Bondable Chips and Beam Leads Applications x Detectors Features x Available in both P-type and N-type low barrier silicon x Low 1/f noise x Bonded junctions for reliability x Planar passivated beam-lead and chip construction
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J-STD-020)
200847B
diode RL 207
gold metal detectors
gold detector circuit free
x band diode detector waveguide
CDB7620-207
ka-band mixer
DDB2503-250
DDB2504-000
DDB2504-230
DDB2265-000
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SMD Packages
Abstract: No abstract text available
Text: IPC/JEDEC J-STD-033A July 2002 Supersedes IPC/JEDEC J-STD-033 April 1999 JOINT INDUSTRY STANDARD Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of
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J-STD-033A
J-STD-033
SMD Packages
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PC3SH13YFZAX
Abstract: 3SH13
Text: PC3SH13YFZAX PC3SH13YFZAX VDRM : 600V, Reinforced insulation type Non-zero cross type DIP 4 pin Phototriac Coupler for triggering •Description ■Agency approvals/Compliance PC3SH13YFZAX reinforced insulation type Phototriac Coupler include an infrared emitting diode
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PC3SH13YFZAX
PC3SH13YFZAX
UL1577
E64380
3SH13)
CA95323
OP14020EN
3SH13
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