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    RELIABILITY DATA PLASTIC PACKAGES QFP 240 Search Results

    RELIABILITY DATA PLASTIC PACKAGES QFP 240 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    NFMJMPC226R0G3D Murata Manufacturing Co Ltd Data Line Filter, Visit Murata Manufacturing Co Ltd
    NFM15PC755R0G3D Murata Manufacturing Co Ltd Feed Through Capacitor, Visit Murata Manufacturing Co Ltd
    NFM15PC435R0G3D Murata Manufacturing Co Ltd Feed Through Capacitor, Visit Murata Manufacturing Co Ltd
    NFM15PC915R0G3D Murata Manufacturing Co Ltd Feed Through Capacitor, Visit Murata Manufacturing Co Ltd
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    RELIABILITY DATA PLASTIC PACKAGES QFP 240 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    PCB footprint cqfp 132

    Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318 PDF

    35 x 35 PBGA, 580 100 balls

    Abstract: of BGA Staggered Pins package BGA Ball Crack without underfill BGA PACKAGE thermal resistance 60um of BGA Staggered pins
    Text: NEW PRODUCTS 7 LATEST TECHNOLOGICAL TRENDS IN VLSI PACKAGES AND DEVELOPMENT OF NEW PACKAGES Hisao Kasuga/Miwa Momma Introduction Consumers expect constant progress in electronic systems and record-breaking size reduction each time a new product is released. To kindle consumers’ interest,


    Original     		PDF

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
    Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228 PDF

    BGA and QFP Altera Package mounting profile

    Abstract: BGA PROFILING JEP113-B infrared heating gun guidelines JEP113 Reliability Data Plastic Packages QFP J-STD-020A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
    Text: Reflow Soldering Guidelines for Surface-Mount Devices June 2002, ver. 4 Application Note 81 7 Introduction Altera’s surface-mount packages include quad flat pack QFP , plastic J-lead chip carriers (PLCC), and ball-grid array (BGA), including FineLine


    Original     		PDF

    footprint jedec MS-026 TQFP

    Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    JEDEC Package Code MS-026-AED

    Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
    Text: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    JESD22-A113

    Abstract: QFN-20 reflow ipc-SM-782 JESD47 JESD-47 QFN-20 JEDEC SMT reflow profile jstd for msl 3 qfn density metcal apr 5000
    Text: Silicon Laboratories SMT Soldering Guidelines for MCU Products SCOPE: For all of the Silicon Laboratories Microcontroller Products in QFN, TQFP/LQFP, and PDIP packages. I. SMT Soldering Considerations for QFN Packages • See the CARSEM QFN application note, which can be found at http://www.carsem.com/.


    Original     		IPC-SM-782 APR-5000 QFN-24 -QFN11 JESD22-A113 QFN-20 reflow JESD47 JESD-47 QFN-20 JEDEC SMT reflow profile jstd for msl 3 qfn density metcal apr 5000 PDF

    pin diagrams of basic gates

    Abstract: BGA and QFP Package Nand gate Crystal Oscillator 272000 astro tool HQFP-208 MCM NAND qcm 5 sim 980 CE61
    Text: To Top / Lineup / Index Product Line-up FUJITSU Semicustom Products Semicustom Products Gate arrays Sea-of-Gate CMOS Macro-embedded type cell arrays CMOS Standard cell CMOS Semicustom microcontrollers QCM series* ASTRO NT Bi-CMOS SIM/PLL SERIES Bi-CMOS SAW PLL


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    DC04 display

    Abstract: how to test POWER MOSFET with digital multimeter tektronix 576 curve tracer VISHAY VT 300 WEIGHT INDICATOR TSMC 0.35Um FLUKE 79 manual THERMAL ELECTRIC COOLER hp 4274A 532 nm laser diode PHOTO TRANSISTOR ppt
    Text: Quality And Reliability Report 2005 DC04-0001 Page 1 of 79


    Original     		DC04-0001 DC04 display how to test POWER MOSFET with digital multimeter tektronix 576 curve tracer VISHAY VT 300 WEIGHT INDICATOR TSMC 0.35Um FLUKE 79 manual THERMAL ELECTRIC COOLER hp 4274A 532 nm laser diode PHOTO TRANSISTOR ppt PDF

    nec 10f

    Abstract: CMOS-9HD electrical house wiring NEC PC 324 C CMOS9HD UPD65943 IC Ensemble NEC C 324 C nec cmos PS 229
    Text: 0.35 µm CMOS Gate Array CMOS-9HD Family .35 d e t gra e t n i ly h g i h tion uction a r e n -ge cost red d n o c Se le b a r e d Consi ay r r a e gat S O M µm C New s t c u d o r P FEATURES The CMOS-9HD Family is a channel-less type gate array that uses the 0.35-µm leading-edge process and realizes 960,000


    Original     		A12852EJ3V0PF00 nec 10f CMOS-9HD electrical house wiring NEC PC 324 C CMOS9HD UPD65943 IC Ensemble NEC C 324 C nec cmos PS 229 PDF

    tsmc 0.35um 2p4m cmos

    Abstract: K2411 specification of scr 2p4m teradyne j750 tester manual 2p4m equivalent Z0853006PSC SCR 2P4M Z84C1510FEC DC04 display Z0853006VSC
    Text: Quality And Reliability Report 2004 Period Covered: 2003


    Original     		DC04-0001 tsmc 0.35um 2p4m cmos K2411 specification of scr 2p4m teradyne j750 tester manual 2p4m equivalent Z0853006PSC SCR 2P4M Z84C1510FEC DC04 display Z0853006VSC PDF

    induction furnace

    Abstract: induction cooker component list on pcb induction furnace manual cmos microcircuit catalog ANISOLM induction heating cooker IC 452 in pqc induction heating furnace MATSUSHITA OSCILLATOR EF INCOMING RAW MATERIAL INSPECTION procedure
    Text: LCD Controller Driver Data Book Application Note 9/1/98 Notice When using this document, keep the following in mind: 1• This document may, wholly or partially, be subject to change without notice. 2• All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Order this data sheet by HDC/D MOTOROLA HDC SERIES SEMICONDUCTOR TECHNICAL DATA H IG H PER FO R M A NC E T R IP L E LAYER M ETAL HDC SERIES CMOS ARRAYS 1 .0 M IC R O N C M O S A R R A Y S B uilt on a 1.0 m icron, trip le -la y e r metal C M O S process, the HDC


    OCR Scan     		PDF

    PLE3-12 EP1810

    Abstract: No abstract text available
    Text: ÆoniM Glossary June 1996 A Altera Hardware Description Language AHDL A ltera's design entry language. AHDL is a highlevel, modular language that is com pletely integrated into M A X +P L U SII. You can create AHDL Text Design Files (.tdf) with the M A X+PLUS II Text Editor or any standard text


    OCR Scan     		PDF

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga PDF

    256FBGA

    Abstract: 240-PQFP "CHIP EXPRESS" 144TQFP PACKAGE proteus CHIP EXPRESS EPF10K30 RA10K10AQ-C-208 CHIPX semiconductors replacement guide
    Text: FPGA Replacement for Altera FLEX 10K Series Products Introduction Proteus for Altera FLEX 10K Series PLDs is the latest addition to the Proteus FPGA Replacement Program from Chip Express. Proteus devices are now available to replace OEM production FPGAs from Xilinx and


    Original     		CEC024) CEC004) CEC002) CEC003) EPF10K70 RA10K70Q-I-240 RA10K70R-I-240 240PQFP 240RQFP 256FBGA 240-PQFP "CHIP EXPRESS" 144TQFP PACKAGE proteus CHIP EXPRESS EPF10K30 RA10K10AQ-C-208 CHIPX semiconductors replacement guide PDF

    MICROPROCESSOR Z80

    Abstract: uPD72020 uPC5102 transistor 2p4m UPD6487 2SD1557 2SJ 3305 UPD77529 TRANSISTOR SOD MARKING CODE 352A micro servo 9g tower pro
    Text: The export of these products from Japan is regulated by the Japanese government. The export of some or all of these products may be prohibited without governmental license. To export or re-export some or all of these products from a country other than Japan may also be prohibited without a license from that country. Please call


    Original     		Z80TM V20TM, V20HLTM, V25TM, V25HSTM, V30TM, V30HLTM, V33TM, V33ATM, V35TM, MICROPROCESSOR Z80 uPD72020 uPC5102 transistor 2p4m UPD6487 2SD1557 2SJ 3305 UPD77529 TRANSISTOR SOD MARKING CODE 352A micro servo 9g tower pro PDF

    JEDEC TRAY DIMENSIONS

    Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
    Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors


    Original     		manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package PDF

    SIEMENS AVR GENERATOR

    Abstract: philips dect 80c51 manual pabx systems siemens PABX philips potentiometer philips rf manual 80C51 PCD5032 PCD5091
    Text: INTEGRATED CIRCUITS DATA SHEET PCD5095 DECT baseband controller Objective specification File under Integrated Circuits, IC17 1997 Nov 19 Philips Semiconductors Objective specification DECT baseband controller PCD5095 CONTENTS 1 FEATURES 1.1 DSP software features


    Original     		PCD5095 Philips31 SCA52 437027/1200/01/pp16 SIEMENS AVR GENERATOR philips dect 80c51 manual pabx systems siemens PABX philips potentiometer philips rf manual 80C51 PCD5032 PCD5091 PDF

    30n10

    Abstract: JIS-C-7022 visual inspection of raw materials SC-82AB reflow hot air
    Text: RATINGS AND CHARACTERISTICS This data book lists the absolute maximum ratings, electrical characteristics, and recommended operating conditions for each model. To help you design products offering the quality and reliability that can be gained by using ICs, the following


    Original     		OT-89 OT-89 30n10 JIS-C-7022 visual inspection of raw materials SC-82AB reflow hot air PDF

    ALTERA EPM7128SLC84

    Abstract: FLUKE 8840a FLUKE 8840a specification EPM7128SLC84-7 atmel 160 pin EPM7128SLC84-7 part number atmel programming in c altera altera Date Code Formats ATMEL 340 EPM7128S
    Text: White Paper ATF1500AS Analysis Report Introduction ® The Altera MAX 7000 family has many features that make it a leader in the programmable logic industry. MAX 7000 devices consume minimal power and are reliable at high frequencies. Additionally, these devices were designed for optimum timing characteristics and to support in-system programmability


    Original     		ATF1500AS EPM7128S, ALTERA EPM7128SLC84 FLUKE 8840a FLUKE 8840a specification EPM7128SLC84-7 atmel 160 pin EPM7128SLC84-7 part number atmel programming in c altera altera Date Code Formats ATMEL 340 EPM7128S PDF

    QFP44 footprint

    Abstract: QFP44 TDA8768 TDA8768H
    Text: INTEGRATED CIRCUITS DATA SHEET TDA8768 12-bit high-speed Analog-to-Digital Converter ADC Preliminary specification Supersedes data of 1998 Feb 25 File under Integrated Circuits, IC02 1998 Aug 26 Philips Semiconductors Preliminary specification 12-bit high-speed Analog-to-Digital


    Original     		TDA8768 12-bit SCA60 545104/750/02/pp20 QFP44 footprint QFP44 TDA8768 TDA8768H PDF

    AN01026

    Abstract: GTL2034PW JESD22-A114 JESD22-A115 JESD78 TSSOP14
    Text: GTL2034 4-bit GTL to GTL buffer Rev. 01 — 11 November 2005 Product data sheet 1. General description The GTL2034 is a 4-bit GTL−/GTL/GTL+ bus buffer. The GTL2034 GTL inputs and outputs operate up to 3.6 V, allowing the device to be used in higher voltage open-drain output applications.


    Original     		GTL2034 GTL2034 JESD22-A114, JESD22-A115, JESD22-CC101 JESD78 TSSOP14 AN01026 GTL2034PW JESD22-A114 JESD22-A115 JESD78 TSSOP14 PDF

    IEC134

    Abstract: QFP44 TDA8771A TDA8771AH kda 42 pin video dac
    Text: INTEGRATED CIRCUITS DATA SHEET TDA8771A Triple 8-bit video Digital-to-Analog Converter DAC Product specification File under Integrated Circuits, IC02 1996 Jan 25 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC)


    Original     		TDA8771A TDA8771A SCDS47 537021/1100/01/pp20 IEC134 QFP44 TDA8771AH kda 42 pin video dac PDF