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    REFLOW PROFILE SAC305 BGA Search Results

    REFLOW PROFILE SAC305 BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    LUSB3193002 Amphenol Communications Solutions Lockable USB 3.0, Right Angle, with locking latch, For IR Reflow Pin in Paste Visit Amphenol Communications Solutions
    68786-201 Amphenol Communications Solutions 1X2 LOW PROFILE JUMPER Visit Amphenol Communications Solutions
    68786-201LF Amphenol Communications Solutions 1X2 LOW PROFILE JUMPER Visit Amphenol Communications Solutions
    68786-302 Amphenol Communications Solutions Low Profile Jumper , Single Row, 2 Positions, 2.54mm (0.100in) Pitch Visit Amphenol Communications Solutions
    RJE051AA8110H Amphenol Communications Solutions Modular Jack - 10P10C, Right Angle, Low Profile, Single Port, Shield Visit Amphenol Communications Solutions

    REFLOW PROFILE SAC305 BGA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    S146

    Abstract: S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3
    Text: NEW High-Speed 10+Gbps BGA Mezzanine Connectors IT3 Series •Flexibility Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 10+Gbps systems. With the ability to transmit differential, single-ended,


    Original     		15mmH misali6-2-2557-7351 S146 S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3 PDF

    sn63pb37 solder wire

    Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
    Text: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information


    Original     		PDF

    24-7068-1407

    Abstract: 24-6337-8817 GR-63-CORE Zone 4 test 2460400010 24-6337-0027 K100LD sn62pb36ag2
    Text: 2013 RECOMMENDED Electronics Assembly Materials Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information 3-7 8-11 12-13 14-15 16 17 18 19 | 800 253 7837 | WWW.kester.com


    Original     		PDF

    LGA voiding

    Abstract: Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325
    Text: Assembly Considerations for Linear Technology ModuleTM LGA Packages September 2010 Linear Technology Corporation Outline • • • • Package Construction PCB Design Guidelines Moisture Sensitivity, Pack, Ship & Bake Board Assembly Process – Screen Print


    Original     		LTM4600 CCL-HL-832 LGA voiding Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325 PDF

    GR-78-CORE

    Abstract: ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527
    Text: 2010 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 Application EnviroMark™ 828 No-Clean Stencil Printing Water-Soluble Stencil Printing Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with


    Original     		65-0n-Tien GR-78-CORE ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527 PDF

    SN63PB37

    Abstract: No abstract text available
    Text: 2009 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 EnviroMark™ 828 Application No-Clean Stencil Printing Water-Soluble Stencil Printing Alloys Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Product


    Original     		EM907 EM828 SN63PB37 PDF

    sn63pb37 solder SPHERES

    Abstract: J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D
    Text: SMT Board Assembly Process Recommendations AN-353-4.0 Application Note This application note describes the board assembly process used in surface-mount technology SMT and focuses on the SMT component-to-board reflow soldering process and rework soldering if you are removing or replacing individual


    Original     		AN-353-4 AN-353 AN-81. sn63pb37 solder SPHERES J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D PDF

    BGA Solder Ball 0.35mm collapse

    Abstract: TB-2241 reballing circular thermocouple connector JEDEC tray standard dimension tb224 BGA Solder Ball 0.35mm BGA PROFILING SAC305 solder paste SAC305 reflow 13mm
    Text: AMPHENOL TCS TB-2241 TM DFM and SMT Assembly Guideline Revision “B“ Specification Revision Status Revision “A“ “B” SCR No. Description Initial Date S1647 S1884 Initial Release Implemented 6-Pr changes Updated PN Tree and connector weight table


    Original     		TB-2241 S1647 S1884 BGA Solder Ball 0.35mm collapse TB-2241 reballing circular thermocouple connector JEDEC tray standard dimension tb224 BGA Solder Ball 0.35mm BGA PROFILING SAC305 solder paste SAC305 reflow 13mm PDF

    TB-2082

    Abstract: TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS
    Text: AMPHENOL TCS TB-2082 DFM and SMT Assembly Guideline Revision “F“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 J. Proulx J. Proulx 9/17/02


    Original     		TB-2082 28mil TB-2082 TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS PDF

    IPC-7525

    Abstract: ipc 7525 IPC-9502 AN-9036 IPC9502 FDMS8660S JESD22-102D Soldering guidelines pin in paste JESD22-102 FDMS8660AS
    Text: AN-9036 Guidelines for Using Fairchild's Power56 Dennis Lang, Staff Engineer Introduction The Power56 minimizes both Printed Wiring Board PWB space and RDS(ON) in a convenient, familiar SO-8 sized footprint, with the addition of a large drain tab for improving thermal


    Original     		AN-9036 Power56 Power56 FDMS8460, FDMS8660AS, FDMS8660S, FDMS8662, FDMS8670AS, IPC-7525 ipc 7525 IPC-9502 AN-9036 IPC9502 FDMS8660S JESD22-102D Soldering guidelines pin in paste JESD22-102 FDMS8660AS PDF

    MT9V113

    Abstract: No abstract text available
    Text: Advance‡ MT9V113M02: 1/11-Inch VGA Reflowable Camera Features 1/11-Inch VGA SOC CMOS Digital Image Sensor Reflowable Camera Module with Parallel Output MT9V113M02 Features Table 2: • Reflowable module features – Ultracompact – 260°C Pb-free solder reflowable


    Original     		MT9V113M02: 1/11-Inch MT9V113M02 1/11-inch, 30-ball 10-bit, 09005aef82f87af5/Source: 09005aef82f88608 MT9V113 PDF

    Systems

    Abstract: systemtechnik 60352-5 component data SAC305 laser soldering through hole technology SAC305 DIN EN 60352-5 din mount pcb connector mini din 9 male
    Text: Electronic Board Assembly ERNI Systems Technology Systems Solutions - a one stop shop - www.erni.com Contents ERNI Systems Technology Soldering Technologies SMT soldering - Reflow Soldering of Surface Mount Devices THR soldering - Through Hole Components, reflow soldered


    Original     		PDF

    SAC266

    Abstract: SAC405 J-STD-012 IPC-6012 BGA Solder Ball compressive force WLCSP stencil design IPC-6012A LATTICE SEMICONDUCTOR Tape and Reel Specification IPC-4101 IPC-7525
    Text: Application Note 71 Design and Manufacturing with Summit Microelectronic’s WLCSP Products Introduction Per the IPC/JEDEC J-STD-012 definition, a CSP is a single-die, direct surface mountable package with an area of no more than 1.2 times the original die area.


    Original     		J-STD-012 SAC266 SAC405 IPC-6012 BGA Solder Ball compressive force WLCSP stencil design IPC-6012A LATTICE SEMICONDUCTOR Tape and Reel Specification IPC-4101 IPC-7525 PDF

    Untitled

    Abstract: No abstract text available
    Text: AN-617 Application Note One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Wafer Level Chip Scale Package by the Wafer Level Package Development Team GENERAL DESCRIPTION PURPOSE


    Original     		AN-617 AN03272-0-5/12 PDF

    Untitled

    Abstract: No abstract text available
    Text: LTM2881 Complete Isolated RS485/RS422 µModule Transceiver + Power DESCRIPTION FEATURES n n n n n n n n n n n n n n n n n n RS485/RS422 Transceiver: 2500VRMS for 1 Minute UL Recognized File #E151738 Isolated DC Power: 5V at Up to 200mA No External Components Required


    Original     		LTM2881 RS485/RS422 RS485/RS422 2500VRMS E151738 200mA 20Mbps 250kbps 30kV/Î LTM2881-3) PDF

    Untitled

    Abstract: No abstract text available
    Text: LTM8057 3.1VIN to 31VIN Isolated µModule DC/DC Converter FEATURES DESCRIPTION n n n The LTM 8057 is a 2kV AC isolated flyback µModule® micromodule DC/DC converter. Included in the package are the switching controller, power switches, transformer, and all support components. Operating over an input voltage range of 3.1V to 31V, the LTM8057 supports an output


    Original     		LTM8057 31VIN LTM8057 UL60950 EN55022 LTM8061 LTM4613 LTM8047 8057f PDF

    pcb warpage in ipc standard

    Abstract: IPC-9701A SAC405 IPC-9702 BGA PACKAGE thermal resistance Freescale ipc 9702 945 motherboard circuit semiconductor cross reference "IPC 1752" gold SAC387
    Text: Q2, 2010 Flip Chip Plastic Ball Grid Array FC-PBGA Application Note Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm Off. All other product or service names are the property of their respective owners. 2010 Freescale Semiconductor, Inc.


    Original     		PDF

    LTM4601Y

    Abstract: No abstract text available
    Text: LTM4601/LTM4601-1 12A µModule Regulators with PLL, Output Tracking and Margining Description Features n n n n n n n n n n n n n n n n n Complete Switch Mode Power Supply Wide Input Voltage Range: 4.5V to 20V 12A DC Typical, 14A Peak Output Current 0.6V to 5V Output Voltage


    Original     		LTM4601/LTM4601-1 LTM4601 LTM8061 com/LTM4601 4601fe LTM4601Y PDF

    NORTHBRIDGE* reflow

    Abstract: pin diagram AMD phenom II - X4 RX980 990FX RD990 ATI RADEON reflow profile RD980 amd RADEON igp 215-0716046 AMD Phenom II x4
    Text: AMD 990FX/990X/970 Databook Technical Reference Manual Rev 3.00 P/N: 48691_990FX_ds_nda 2012 Advanced Micro Devices, Inc. Trademarks AMD, the AMD Arrow logo, AMD Phenom, AMD Cool'n'Quiet, and combinations thereof, ATI, the ATI logo, Radeon, and CrossFire are trademarks of Advanced


    Original     		990FX/990X/970 RD990 NORTHBRIDGE* reflow pin diagram AMD phenom II - X4 RX980 990FX ATI RADEON reflow profile RD980 amd RADEON igp 215-0716046 AMD Phenom II x4 PDF

    LTM4619

    Abstract: No abstract text available
    Text: LTM4604A Low Voltage, 4A DC/DC µModule Regulator with Tracking Description Features n n n n n n n n n n n n n n n Complete Standalone Power Supply ±1.75% Max Total DC Output Error –40°C to 125°C Wide Input Voltage Range: 2.375V to 5.5V 4A DC, 5A Peak Output Current


    Original     		LTM4604A com/LTM4604A 4604afc LTM4619 PDF

    LTM4607

    Abstract: LTM4608
    Text: LTM4604A Low Voltage, 4A DC/DC µModule Regulator with Tracking Description Features n n n n n n n n n n n n n n n Complete Standalone Power Supply ±1.75% Max Total DC Output Error –40°C to 125°C Wide Input Voltage Range: 2.375V to 5.5V 4A DC, 5A Peak Output Current


    Original     		LTM4604A com/LTM4604A 4604afb LTM4607 LTM4608 PDF

    ATI Lead Free reflow soldering profile BGA

    Abstract: ATI RADEON reflow profile 216MQA6AVA12FG 216TQA6AVA12FG amd chipset 216mqa6ava12fg 216lqa6ava12fg amd RADEON igp AMD Turion 64 X2 RADEOn x700 RS690
    Text: AMD RS690 Databook Technical Reference Manual Rev. 3.04 P/N: 41977_rs690_ds 2007 Advanced Micro Devices, Inc Please note that in this databook, references to "DVI" and "HDMI" may refer to: 1 the function of the integrated DVI/HDMI interface described in details in section 2.2.1 and


    Original     		RS690 RS690 ATI Lead Free reflow soldering profile BGA ATI RADEON reflow profile 216MQA6AVA12FG 216TQA6AVA12FG amd chipset 216mqa6ava12fg 216lqa6ava12fg amd RADEON igp AMD Turion 64 X2 RADEOn x700 PDF

    Xilleon 215

    Abstract: amd chipset 216mqa6ava12fg amd RADEON databook
    Text: AMD RS690 Databook Technical Reference Manual Rev. 3.06 P/N: 41977_rs690_ds 2008 Advanced Micro Devices, Inc Please note that in this databook, references to "DVI" and "HDMI" may refer to: 1 the function of the integrated DVI/HDMI interface described in details in section 2.2.1 and


    Original     		RS690 RS690 RS690C) Xilleon 215 amd chipset 216mqa6ava12fg amd RADEON databook PDF

    Untitled

    Abstract: No abstract text available
    Text: LTM8001 36VIN, 5A µModule Regulator with 5-Output Configurable LDO Array Features Description Complete Step-Down Switch Mode Power Supply with Configurable Array of Five LDOs n Step-Down Switching Power Supply – Adjustable 10% Accurate Output Current Limit


    Original     		LTM8001 36VIN, 100Hz 16-Bit LTC2974 LTC3880 8001fc com/LTM8001 PDF