RECOMMENDED LAND PATTERN FOR 0805 Search Results

Contextual Info: Ver 201305 Chip Bead For EMI Suppression CIB/CIM21 Series 2012/ EIA 0805 APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN 0.8~1.2mm Perfect shape for automatic mounting, with no directionality.

Contextual Info: Ver. 201306 Multilayer Power Inductor CIG21L Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances

Contextual Info: Ver. 201306 Multilayer Power Inductor CIG21C Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Suit for small DC-DC converter and choke uses Magnetically shielded structure Free of all RoHS-regulated substances

Contextual Info: Ver. 201207 Chip Bead For High Current CIC21 Series 2012/ EIA 0805 APPLICATION Noise Suppression in power line FEATURES RECOMMENDED LAND PATTERN 0.8~1.2mm CIC series is used for high current. ) 0.9~1.6mm 0.6~1.2mm 0.6~1.2mm DIMENSION Type 21 Dimension [mm]

Contextual Info: Ver. 201207 Multilayer Power Inductor CIG21C Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Suit for small DC-DC converter and choke uses Magnetically shielded structure Free of all RoHS-regulated substances

inductor 2r2

Abstract: CIG21C2R2MNE
Contextual Info: Ver. 201011 Multilayer Power Inductor CIG21C Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Suit for small DC-DC converter and choke uses Magnetically shielded structure Free of all RoHS-regulated substances

Contextual Info: Ver. 201306 Multilayer Power Inductor CIG21F Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Much lower Profile than any other series (0.5mm max) Low DC resistance Magnetically shielded structure

Contextual Info: Ver. 201207 Multilayer Power Inductor CIG21F Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Much lower Profile than any other series (0.5mm max) Low DC resistance Magnetically shielded structure

Contextual Info: Ver. 201007 Multilayer Power Inductor CIG21F Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Much lower Profile than any other series (0.5mm max) Low DC resistance Magnetically shielded structure

Contextual Info: Ver. 201207 Multilayer Power Inductor CIG21W Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Low Profile (1.0mm max) Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances

land pattern 0805

Abstract: cig21w2r2mne
Contextual Info: Ver. 201007 Multilayer Power Inductor CIG21W Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Low Profile (1.0mm max) Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances

land pattern 0805

Abstract: CIG21LR47MNE CIG21L4R7MNE CIG21LR47M CIG21L1R0MNE CIG21L3R3MNE land pattern 0805 inductor land pattern inductor 0805 CIG21L2R2MNE
Contextual Info: Ver. 201007 Multilayer Power Inductor CIG21L Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Super Low DC resistance Low Profile (1.0mm max) Magnetically shielded structure Free of all RoHS-regulated substances

Contextual Info: Ver. 201207 Multilayer Power Inductor CIG21L Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Super Low DC resistance Low Profile (1.0mm max) Magnetically shielded structure Free of all RoHS-regulated substances

Contextual Info: Issue date : January 2014 3-terminal Filters For Power Line YFF-P Series Type: YFF15PC YFF18PC YFF18PH YFF18PW YFF21PC YFF31PC 1005 [0402 inch]* 1608 [0603 inch]* 1608 [0603 inch]* 1608 [0603 inch]* 2012 [0805 inch]* 3216 [1206 inch]* Feed through filter Feed through filter

220 uh inductors

Abstract: marking 25
Contextual Info: Inductors Chip Inductors &KLS ,QGXFWRUV 6HULHV 7\SH -DSDQ &KLS   ' & $ % 1'  &  (0805) (1008) )  (  (0402) (0603) $  %  (1210) (1812) 1RQ ZRXQG DQG ZLUH ZRXQG W\SH FKLS LQGXFWRUV IRU DXWRPDWLF DQG KLJKGHQVLW\ PRXQWLQJ

1H101

Abstract: YFF21SC1H102MT
Contextual Info: Issue date : November 2013 3-terminal Filters For Signal Line YFF-SC Series Type: YFF15SC YFF18SC YFF21SC 1005 [0402 inch]* Feed through filter 1608 [0603 inch] Feed through filter 2012 [0805 inch] Feed through filter * Dimensions Code JIS[EIA] All specifications are subject to change without notice.

Contextual Info: Issue date : September 2014 3-terminal Filters For Signal Line YFF-SC Series Type: YFF15SC YFF18SC YFF21SC 1005 [0402 inch]* Feed through filter 1608 [0603 inch] Feed through filter 2012 [0805 inch] Feed through filter * Dimensions Code JIS[EIA] All specifications are subject to change without notice.

ERJA1

Abstract: RESISTOR ARRAY 0402 land pattern
Contextual Info: Surface Mount Resistors Packaging Method Taping Surface Mount Resistors Series Products Type Size mm (inch) 0402 (01005) 0603 ERJ1GN (0201) 1005 ERJ2GE (0402) 1608 ERJ3GE (0603) 2012 ERJ6GE Thick Film (0805) 3216 Chip Resistors ERJ8GE (1206) 3225 ERJ14 (1210)

Contextual Info: E M C C o m p o n e n t s July 2013 3-terminal Filters For signal line MEM series MEM2012S MEM2012SC MEM2012V MEM2012F MEM1608P 2012[0805 inch]* 2012[0805 inch] 2012[0805 inch] 2012[0805 inch] 1608[0603 inch] * Dimensions Code JIS[EIA] 2/15 E M C C o m p o n e n t s

Contextual Info: E M C C o m p o n e n t s November 2013 3-terminal Filters For signal line MEM series MEM2012S MEM2012SC MEM2012V MEM2012F MEM1608P 2012[0805 inch]* 2012[0805 inch] 2012[0805 inch] 2012[0805 inch] 1608[0603 inch] * Dimensions Code JIS[EIA] 2/15 E M C C o m p o n e n t s

KF 520

Contextual Info: Chip Inductors • ND Type 2012 0805 ● Recommended Land Pattern in mm (not to scale) 1.25 0.9 to 1.3 1.0 1.25 ● Dimensions in mm (not to scale) (1.2) 1.0 to 1.2 3.0 to 3.8 0.4 2.0 ■ Standard Packing Quantity ● 3000 pcs./Reel ■ Standard Parts Inductnce

tu marking

Abstract: R015 ERJB2 ERJA1
Contextual Info: High Power Chip Resistors / Wide Terminal Type High Power Chip Resistors / Wide Terminal Type 2512, 2010, 1206, 0805 Type: ERJ A1, B1, B2, B3 • Features ■ Recommended Applications ● High solder-joint reliability by wide terminal construction ● Excellent heat dissipation characteristics by wide

ERJB2

Abstract: ERJA1
Contextual Info: High Power Chip Resistors / Wide Terminal Type High Power Chip Resistors / Wide Terminal Type 2512, 2010, 1206, 0805 Type: ERJ A1, B1, B2, B3 • Features ■ Recommended Applications ● High solder-joint reliability by wide terminal construction ● Excellent heat dissipation characteristics by wide

Contextual Info: VSM Series 0805, 1206, 1506, 2010, 2512 Vishay Foil Resistors Foil Wrap Around Surface Mount Chip Resistor with TCR of ± 2 ppm/°C and Load Life Stability of ± 0.01% FEATURES • • • • Top View INTRODUCTION Bulk Metal Foil (BMF) Technology out-performs all other