RE23 Search Results

Contextual Info: Prototyping Board not in Europe-format RE233-LF - EPOXY fibre-glass FR4 1.60 mm double-sided 35 µm CU (pth) - hole spacing 2.54 mm x 2.54 mm - 40 x 60 tracks of bored holes - 40 x 56 square lands 2.00 mm² - hole dia 1.02 mm (0.40") - max. working temperature 150° C

RE232-LF

Contextual Info: Laborkarte für Dual Inline ICs nicht im Europa-Format RE232-LF - Epoxyd FR4 Glasfaser 1,60 mm, einseitig 35 µm CU - heißverzinnt (HAL-leadfree) - Bestückungsdruck auf der Bauteileseite - Lochraster 2,54 x 2,54 mm - 40 x 60 Lochreihen - 3-Loch Lötinseln

RE232-LF

Contextual Info: Tarjeta experimental para DUAL INLINE ICs no en Euro-formato RE232-LF - fibra de vidrio epoxídica FR4 de 1,60 mm, por un lado 35 µm de CU - lado de soldadura estañado en caliente (HAL-leadfree) - Impresión de dotación por el lado de los componentes eléctricos

GRANDE

Abstract: cote
Contextual Info: Carte d´Expérimentation ne pas dans l´Euro-format RE231-LF - fibre de verre époxyde FR4 1,60 mm, deux faces 35 µm CU, sans métallisation des trous - étamés à chaud (HAL-leadfree) côté de composant - cadre de perforation 2,54 mm x 2,54 mm - 40 x 60 pistes de perforation

Contextual Info: Carte d´Expérimentation ne pas dans l´Euro-format RE233-LF - fibre de verre époxyde FR4 1,60 mm, deux faces 35 µm CU, métallisation des trous - étamé à chaud (HAL-leadfree) - 40 x 60 pistes de perforation - 40 x 58 îlots de brasage quadratiques 2,00 mm²

Contextual Info: Prototyping Board not in Europe-format RE230-LF - EPOXY fibre-glass FR4 1.60 mm single-sided 35 µm CU - hot air leveling (HAL-leadfree) with soldering stop mask - hole spacing 2.54 mm x 2.54 mm (1/20") - 40 x 60 tracks of bored holes - 40 x 58 square lands 2.00 mm²

Contextual Info: HF Prototyping Board not in Europe-format RE231-LF - EPOXY fibre-glass FR4 1.60 mm double-sided 35 µm CU (npt) - solder side and component side hot air leveling (HAL-leadfree) - hole spacing 2.54 mm x 2.54 mm - 40 x 60 tracks of bored holes - 40 x 58 square lands 2.00 mm²

Contextual Info: R&E R&E International Preliminary Product Specification for RE230-RE233 Relay Driver / Timer Products General Description This specification defines functional and electrical requirements for a family of relay drivers designed for Worldtronics International. These products are intended for use in irons modules

Contextual Info: Carte d´Expérimentation ne pas dans l´Euro-format RE230-LF - fibre de verre époxyde FR4 1,60 mm, simple face 35 µm CU - étamé à chaud (HAL-leadfree) recouvert avec un masque d´arrêt de soudure - pas 2,54 mm x 2,54 mm (1/20") - 40 x 60 pistes de perforation

RE232-LF

Contextual Info: Carte d´Expérimentation ne pas dans l´Euro-format RE232-LF - fibre de verre époxyde FR4 1,60 mm, simple face 35 µm CU - étamé à chaud (HAL-leadfree) - impression des circuits sur le côté des composants - cadre de perforation 2,54 mm x 2,54 mm - 40 x 60 pistes de perforation

Contextual Info: Tarjeta experimental no en Euro-formato RE230-LF - fibra de vidrio epoxídica FR4 de 1,60 mm, por un lado 35 µm de CU - lado de soldadura estañado en caliente (HAL-leadfree) y revestido con máscara inhibidora de soldadura (1/20") - trama de agujeros 2,54 mm x 2,54 mm

ALCAN

Contextual Info: Tarjeta experimental de AF no en Euro-formato RE231-LF - fibra de vidrio epoxídica FR4 de 1,60 mm, por dos lados 35 µm de CU (npth) - lado de soldadura y de componentes estañado en caliente (HAL-leadfree) - trama de agujeros 2,54 mm x 2,54 mm - 40 x 60 hileras de agujeros

CUI STACK

Abstract: RE23S
Contextual Info: RE23S M9 P0.75 2 7 Ø6.0 25.5 11.7 Ø 9.2 M9 13 3 2.5 9.5 0.5 travel 11.7 4 0.5 travel 8.2 Ø6 5 Panel Cutout/PCB Layout Panel Cutout 9.5 6  C U I Stack, Inc., 2002 RE23V 1 5-Ø1 4.3 8 15 L 18 L = 8, 12 8 6 9.8 RE23F 5 4 3 2 1 L 15 18.0 PC Board Panel Cutout/PCB Layout

RE232-LF

Contextual Info: Prototyping Board for Dual Inline ICs not in Europe-format RE232-LF - EPOXY fibre-glass FR4 1.60 mm single-side 35 µm CU - hot air leveling (HAL-leadfree) - component printing on the component side - hole spacing 2.54 mm x 2.54 mm - 40 x 60 tracks of bored holes

Contextual Info: HF-Laborkarte nicht in Europa-Format RE231-LF - Epoxyd FR4 Glasfaser 1,60 mm, zweiseitig 35 µm CU, (nicht durchkontaktiert) - Löt- und Bauteileseite heißverzinnt (HAL-leadfree) - Lochraster 2,54 x 2,54 mm - 40 x 60 Lochreihen - 40 x 58 quadratische Lötinseln 2,00 mm²

Contextual Info: Tarjeta experimental no en Euro-formato RE233-LF - fibra de vidrio epoxídica FR4 de 1,60 mm, por dos lados 35 µm de CU (pth) - lado de soldadura estañado en caliente (HASL) - trama de agujeros 2,54 mm x 2,54 mm - 40 x 60 hileras de agujeros - 40 x 58 nodos de soldadura cuadrados de 2,00 mm²

Europa

Contextual Info: Laborkarte nicht in Europa-Format RE230-LF - Epoxyd FR4 Glasfaser 1,60 mm, einseitig 35 µm CU - heißverzinnt (HAL-leadfree) - Lochraster 2,54 x 2,54 mm - 40 x 60 Lochreihen - 40 x 58 quadratische Lötinseln 2,00 mm² - Lochdurchmesser 1,02 mm (0,40") - max. Betriebstemperatur 150° C

SSD jumper pin

Abstract: SBC8360VEA 40 pin socket zip SBC8360 W83781D ess audio solo-1 RESET BIOS JUMPER DMI FUSE CT 69000
Contextual Info: SBC8360VEA 5.25" size All-in-One Ethernet DiskOnChip PCI/ISA CRT/LCD USB Flash BIOS Socket 370 Audio PC/104 IrDA Socket 370 Embedded SBC with Multi-media & Mechanical Backward Compatible Solutions CPU Fan Conn. LCD Conn. IDE 1 IDE 2 EISA Slot Intel® Power Conn.

MRC D6 16A

Contextual Info: Cover Marvell PXA270 Processor Developers Manual Doc. No. MV-S301039-00 , Rev. A April 2009 Marvell. Moving Forward Faster Released PXA270 Processor Developers Manual Document Conventions Note: Provides related information or information of special importance.

LM3530TMX-40

Abstract: analog output Ambient light sensor vls252010 12-bump apds9
Contextual Info: LM3530 High Efficiency White LED Driver with Programmable Ambient Light Sensing Capability and I2C-Compatible Interface General Description Features The LM3530 current mode boost converter supplies the power and controls the current in up to 11 series white LED’s. The

F300H

Abstract: FC44H BIT137
Contextual Info: CP3BT23 Reprogrammable Connectivity Processor with Bluetooth and Dual CAN Interfaces 1.0 General Description The CP3BT23 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip

Si24xx2G-DC

Abstract: DO214AA-NP cmc tp16 SOT23-BEC
Contextual Info: G l o b a l Vo i c e I S O m o d e m - E V B Evaluation Board for the Si2494/39/38/37/36/35/29/19/18/17 ISOModem Description Features The Global Voice ISOmodem EVB evaluation board provides the system designer with an easy way of evaluating the ISOmodem. The Voice ISOmodem EVB

avago trace code on the box

Contextual Info: LM3530 High Efficiency White LED Driver with Programmable Ambient Light Sensing Capability and I2C-Compatible Interface General Description Features The LM3530 current mode boost converter supplies the power and controls the current in up to 11 series white LED’s. The

1N4004 MCC SMD

Abstract: 1N4004 MCC TEA1114A TEA1114AT re22 MGK810
Contextual Info: INTEGRATED CIRCUITS DATA SHEET TEA1114A Low voltage telephone transmission circuit with dialler interface and regulated strong supply Product specification Supersedes data of 1998 Jun 12 File under Integrated Circuits, IC03 1999 Sep 14 Philips Semiconductors