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    TL783CKC

    Abstract: QTS06450
    Text: TEXAS INSTRUMENTS Final Notification for the Addition of BIDFET Process to the Sherman Wafer Fabrication Site and Die Revision for TL783CIN July 27, 1998 Abstract Texas Instrument’s Sherman Wafer Fabrication Facility has successfully completed Texas Instrument’s qualification requirements for the manufacture of products using the BIDFET process. The


    Original     		PDF TL783CIN TL783CIN QTS06450 TL783CKC