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    QFP MINIMUM PITCH SIZE Search Results

    QFP MINIMUM PITCH SIZE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    8501002YC Rochester Electronics LLC Microprocessor, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    8501001YA Rochester Electronics LLC Microprocessor, 16-Bit, 8MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    NG82370-16 Rochester Electronics LLC Multifunction Peripheral, CMOS, PQFP100, PLASTIC, QFP-100 Visit Rochester Electronics LLC Buy
    MQ80C196KB-12 Rochester Electronics LLC Microcontroller, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    TMC2081KBC Rochester Electronics LLC Consumer Circuit, PQFP128, METRIC, PLASTIC, QFP-128 Visit Rochester Electronics LLC Buy

    QFP MINIMUM PITCH SIZE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    EC1201A

    Abstract: Solder Tack weller AN11 ec1201 48TQFP AN114 Silicon Lab
    Text: A N 114 H A N D S O L D E R I N G TU T O R I A L Scope FOR FINE PITCH QFP DEVICES 5. Solder flux - liquid type in dispenser This document is intended to help designers create 6. Solder wick - size C 0.075" 1.9 mm their initial prototype systems using Silicon Lab's


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    CMOS 8bit counter

    Abstract: No abstract text available
    Text: CD-ROM Microcomputer 8-Bit CD-ROM X13769XJ2V0CD00 02-1 Microcomputer 8-Bit Single-Chip Microcontroller 78K/0S Series • 78K/0S Series Product Evolution Subseries names are shown inside frames. Small-scale general purpose µPD789046 44-pin Dual clock µPD789026


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    PDF X13769XJ2V0CD00 78K/0S PD789046 44-pin PD789026 42-pin PD789014 PD789104A 28-pin CMOS 8bit counter

    68HC705

    Abstract: 68HC705K1CP MC68HC05SC21 68HC705J1ACP 68HC705C8ACFN Motorola 68hc705j1acp MC68HC05SC27 XC68HC705V8 68HC705P6A MC68HC05SR3D
    Text: SG165/D REV. 21 QUARTER 3,1996 68HC05 MICROCONTROLLERS All 68HC05 products have a standard operating voltage range from 3 V to 5.5 V unless noted in Comments. All 68HC05 products have a standard operating temperature range from 0 to 70C. Contact a Motorola Sales Office for availability of extended temperature versions.


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    PDF SG165/D 68HC05 MC68HC05B4 MC68HC05B6 MC68HC05B8 MC68HC05B16 16-bit: 68HC705 68HC705K1CP MC68HC05SC21 68HC705J1ACP 68HC705C8ACFN Motorola 68hc705j1acp MC68HC05SC27 XC68HC705V8 68HC705P6A MC68HC05SR3D

    xc68hc805p18

    Abstract: XC68HC805 XC68HC708XL36 XC68HC705p XC68HC705V8 XC68HC705B32 XC68HC705L1 Motorola MC68HC05B16, 52 pin 68HC08AB32 XC68HC05P18
    Text: SG165/D REV. 25 QUARTER 3,1997 68HC08 MICROCONTROLLERS The 68HC08 Family is an evolutionary extension of the world’s most popular 8-bit microcontrollers, Motorola’s 68HC05 Family. The 68HC08 maintains 68HC05 code compatibility with an expanded instruction set and a more powerful processor.


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    PDF SG165/D 68HC08 68HC05 MC68HC08XL36 MC68HC708XL36 68HC080 68HC08AB32rola xc68hc805p18 XC68HC805 XC68HC708XL36 XC68HC705p XC68HC705V8 XC68HC705B32 XC68HC705L1 Motorola MC68HC05B16, 52 pin 68HC08AB32 XC68HC05P18

    MC68HC05SC27

    Abstract: Motorola MC68HC05B16, 52 pin XC68HC705B32 144 QFP body size MC68HC05SC24 pinout of motorola 68hc05 motorola 68hc05 interface 705k1 XC68HC705V8 68HC705B5
    Text: SG165/D REV. 23 QUARTER 1,1997 68HC08 MICROCONTROLLERS The 68HC08 Family is an evolutionary extension of the world’s most popular 8-bit microcontrollers, Motorola’s 68HC05 Family. The 68HC08 maintains 68HC05 code compatibility with an expanded instruction set and a more powerful processor.


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    PDF SG165/D 68HC08 68HC05 MC68HC08XL36 MC68HC708XL36 68HC08s 68HC08AB32r MC68HC05SC27 Motorola MC68HC05B16, 52 pin XC68HC705B32 144 QFP body size MC68HC05SC24 pinout of motorola 68hc05 motorola 68hc05 interface 705k1 XC68HC705V8 68HC705B5

    68HC705B16CFN

    Abstract: MC68HC05SC27 MC68HC05SC21 68HC705J1ACP 68HC705 MC68HC05SC MC68HC705G1 of 68HC705 68hc705j2 68HC705K1CDW
    Text: SG165/D REV. 22 QUARTER 4,1996 68HC05 MICROCONTROLLERS All 68HC05 products have a standard operating voltage range from 3 V to 5.5 V unless noted in Comments. All 68HC05 products have a standard operating temperature range from 0 to 70 °C. Contact a Motorola Sales Office for availability of extended temperature versions.


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    PDF SG165/D 68HC05 MC68HC05B4 MC68HC05B6 MC68HC05B8 MC68HC05B16 705B5 MC68HC05B6/D 68HC705B16CFN MC68HC05SC27 MC68HC05SC21 68HC705J1ACP 68HC705 MC68HC05SC MC68HC705G1 of 68HC705 68hc705j2 68HC705K1CDW

    ic59-64075-G4

    Abstract: IC51-0242-802 PC4600 ic59-64075 Eletech Electronics f 4556 IC51-0844-401-1 QFP 128 lead .5mm M32182 M32R
    Text: 2004.5 Renesas Microcomputers Developer Tools Accessory Guide 2004.3 Introduction Contact To meet the needs for target systems that vary from customer to Local Renesas Technology sales office or distributor. customer, Renesas Technology Corp. provides a wide selection of


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    XC68HC908AZ60

    Abstract: L 3055 motorola M68HC705KJ1 xc68hc908gp20 xc68hc805p18 XC68HC908AS60 68LK332 68HC12A XC68HC705B32 2516 2k eprom
    Text: Back Microcontroller Products In Brief . . . Page 68HC05 Microcontrollers . . . . . . . . . . . . . . . . . . . . . . . . 2.5–3 68HC05 One–Time Programmable OTP / Emulator MCUs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5–6 68HC08 Microcontrollers . . . . . . . . . . . . . . . . . . . . . . . . 2.5–8


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    PDF 68HC05 68HC08 M68HC11/M68L11 M68HC12 M68HC16 M68300 MPC500 XC68HC908AZ60 L 3055 motorola M68HC705KJ1 xc68hc908gp20 xc68hc805p18 XC68HC908AS60 68LK332 68HC12A XC68HC705B32 2516 2k eprom

    ic59-64075-G4

    Abstract: IC51-0242-802 zigzag 40pin connector IC51-0844-401-1 M32R M32170T-SDI 100P6-B Eletech Electronics f 4556 M3888 QFP 128 lead .5mm
    Text: 2004.5 Renesas Microcomputers Developer Tools Accessory Guide 2004.3 Introduction Contact To meet the needs for target systems that vary from customer to Local Renesas Technology sales office or distributor. customer, Renesas Technology Corp. provides a wide selection of


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    uPD3599

    Abstract: transistor nec 2SK2396 MOS FET BUZ 444 MC-7643 nec 3S4M 4305 regulator nec RD2.4S equivalent 2SC4305 NEC 2sA1441 nec NPN transistor SST 117
    Text: SEMICONDUCTORS SELECTION GUIDE Microcomputer 1 IC Memory 2 Seimi-Custom IC 3 Particular Purpose 4 General Purpose Linear IC 5 Transistor/Diode/Thyristor 6 GaAs Device/ Silicon Microwave Semiconductor 7 Optical Device 8 Packages 9 Index 10 April 1998 The export of these products from Japan is regulated by the Japanese government. The export of some or all of


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    PDF X10679EJFV0SG00 uPD3599 transistor nec 2SK2396 MOS FET BUZ 444 MC-7643 nec 3S4M 4305 regulator nec RD2.4S equivalent 2SC4305 NEC 2sA1441 nec NPN transistor SST 117

    lg crt monitor circuit diagram

    Abstract: micro servo 9g samsung lcd tv power supply diagrams MP 1008 es uPa2003 8049 microcontroller APPLICATION LG lcd tv tuner pioneer car dvd service manual lg washing machine circuit diagram 8ch pnp DARLINGTON TRANSISTOR ARRAY
    Text: SEMICONDUCTORS SELECTION GUIDE Microcomputer 1 IC Memory 2 Semi-Custom IC 3 Particular Purpose 4 General Purpose Linear IC 5 Transistor/Diode/Thyristor 6 GaAs Device/ Silicon Microwave Semiconductor 7 Optical Device 8 Packages 9 Index 10 October 1998 The export of these products from Japan is regulated by the Japanese government. The export of some or all of


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    PDF X10679EJGV0SG00 lg crt monitor circuit diagram micro servo 9g samsung lcd tv power supply diagrams MP 1008 es uPa2003 8049 microcontroller APPLICATION LG lcd tv tuner pioneer car dvd service manual lg washing machine circuit diagram 8ch pnp DARLINGTON TRANSISTOR ARRAY

    mc9s08aw32

    Abstract: MC9S08AW60 MC9S08AW16CPUE MC9S08AW60CFUE 68hc05 i2c MC9S08AW16 MC9S08AW60MFGE 68HC05 HCS08 SG1011
    Text: 8-bit Microcontrollers MC9S08AW60/32/16 Target Applications > Home appliances 8-bit HCS08 CPU Core > Industrial control > High-performance CPU 20 MHz Features > Security systems • 50 ns minimum instruction cycle time down to 2.7V @ 20 MHz bus > Motor control


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    PDF MC9S08AW60/32/16 HCS08 HCS08AW 9SO8AW603216FS 64-Pin 44-Pin 48-Pin mc9s08aw32 MC9S08AW60 MC9S08AW16CPUE MC9S08AW60CFUE 68hc05 i2c MC9S08AW16 MC9S08AW60MFGE 68HC05 SG1011

    MC9S08aw32cfue

    Abstract: MC9S08AW60CFUE MC9S08AW60/48/32 68hc05 i2c mc9s08aw32mfge MC9S08AW60MFGE 68HC05 HC08 HCS08 SG1011
    Text: 8-bit Microcontrollers MC9S08AW60/48/32 Target Applications > Home appliances 8-bit HCS08 CPU Core > Industrial control > High-performance CPU 20 MHz Features > Security systems • 50 ns minimum instruction cycle time down to 2.7V @ 20 MHz bus > Motor control


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    PDF MC9S08AW60/48/32 HCS08 48-Pin 44-Pin 9SO8AW604832FS MC9S08aw32cfue MC9S08AW60CFUE MC9S08AW60/48/32 68hc05 i2c mc9s08aw32mfge MC9S08AW60MFGE 68HC05 HC08 SG1011

    740-Family

    Abstract: 9907A M37783 m37602 M37780 FLX160-PRB ic59-64075-G4 M37702E4 m37774 M37798
    Text: Introduction To meet the needs for target systems that vary from customer to customer, Mitsubishi provides a wide selection of MCU packages and various types of accessories. These accessories can be used to connect the target and emulator, as well as mount an evaluation MCU on the target when its package is different from that of the actual


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    PDF 64-pin, 80-pin, 100pin PCA7754 PCA7755A PCA7755B PCA7756 SEAL100FP SEAL64FP SEAL80FP 740-Family 9907A M37783 m37602 M37780 FLX160-PRB ic59-64075-G4 M37702E4 m37774 M37798

    IC51-1844-1148

    Abstract: IC51-128 IC51-1964-1952 IC51-1284-1433 IC201 ic51-0804-795 IC51-1014 IC51-1284-1788 IC51-0804-711 IC51-1764-1505-5
    Text: QFP, PQFP, TQFP Clamshell IC51 Series IC51- 064 4- 038 Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Socket Series No. of Leads No. of Sides with Contacts Design No. Characteristics 1,000M½minimum at 500 VDC 700 VAC for 1 minute


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    PDF 10mA/20mV IC51-0324-805 IC51-0324-354 IC51-0324-1498 QFP11T044-001* IC51-0444-1195-3 IC51-0444-825 IC51-467-KS11247 IC51-0444-798 IC51-0444-615 IC51-1844-1148 IC51-128 IC51-1964-1952 IC51-1284-1433 IC201 ic51-0804-795 IC51-1014 IC51-1284-1788 IC51-0804-711 IC51-1764-1505-5

    MB95F136H

    Abstract: programmable timer
    Text: Series MB95F136H Minimum Command Execution Speed 0.1 Micro-seconds Internal 10 MHz Memory ROM 32 KB (Flash) 60 KB (Flash) 60 KB (Flash) RAM 1 KB 2 KB 2 KB UART (*1) or SIO 1 channel (ch) 1ch 1ch LIN or UART 1ch 1ch 1ch I²C (*2) None 1ch 1ch 10-bit A/D 8ch


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    PDF MB95F136H 10-bit 16-bit 8/16-bit 16-bit: MB95F136H programmable timer

    USBMULTILINKBDME

    Abstract: 68HC05 HCS08 MC9S08GT
    Text: 8-bit Microcontrollers MC9S08GT16A/8A Target Applications > ZigBee controller Features 8-bit HCS08 CPU Core > Handheld instruments > Low-power technology • Multiple power management modes including 20 nA powerdown > Utility meters > Security systems • Optional auto wake-up from Stop 2 or


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    PDF MC9S08GT16A/8A HCS08 MC9S08GT MC9S08GT8ACMBE MC9S08GT8AMFDE MC9S08GT8AMFBE MC9S08GT16ACFCE MC9S08GT16AFS MC9S08GT16A USBMULTILINKBDME 68HC05

    USBMULTILINKBDME

    Abstract: MC9S08GT 68HC05 HCS08 CYCLONEPROE Universal GT16A M68DEMO908GB60E
    Text: 8-bit Microcontrollers MC9S08GT16A/8A Target Applications > ZigBee controller Features 8-bit HCS08 CPU Core > Handheld instruments > Low-power technology • Multiple power management modes including 20 nA powerdown > Utility meters > Security systems • Optional auto wake-up from Stop 2 or


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    PDF MC9S08GT16A/8A HCS08 MC9S08GT MC9S08GT16AMFDE MC9S08GT16AMFBE GT16A8AFS MC9S08GT16A GT16A/GT8A USBMULTILINKBDME 68HC05 CYCLONEPROE Universal GT16A M68DEMO908GB60E

    90Pb 10Sn solder paste

    Abstract: 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola
    Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Andrew Mawer, Terry Burnette, Thomas Koschmeider and Diane Hodges Final Manufacturing Technology Center Motorola Semiconductor Products Sector 3501 Ed Bluestein Blvd., MD: F25 Austin, Texas 78721 USA


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    PDF 25x25x1 90Pb 10Sn solder paste 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola

    ceramic rework

    Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
    Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability


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    PDF 25x25x1 ceramic rework CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles

    free transistor equivalent book 2sc

    Abstract: uPA1556AH The Japanese Transistor Manual 1981 samsung UHF/VHF TV Tuner MOSFET cross-reference 2sk PD431000A-X upper arm digital sphygmomanometer circuit diagram PD72001 uPC1237 uPC 2002
    Text: SEMICONDUCTORS SELECTION GUIDE Microcomputer 1 IC Memory 2 Semi-Custom IC 3 Particular Purpose 4 General Purpose Linear IC 5 Transistor/Diode/Thyristor 6 RF and Microwave Devices 7 Optical Device 8 Index 9 April 1999 The export of these products from Japan is regulated by the Japanese government. The export of some or all of


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    PDF X10679EJHV0SG00 free transistor equivalent book 2sc uPA1556AH The Japanese Transistor Manual 1981 samsung UHF/VHF TV Tuner MOSFET cross-reference 2sk PD431000A-X upper arm digital sphygmomanometer circuit diagram PD72001 uPC1237 uPC 2002

    fbga 12 x 12 thermal resistance

    Abstract: FBGA160-P-1212
    Text: 1C PACKAGES Pin-inserting Type i Surface-mount Type 1C Pack. TCP Tape Carrier Package CSP (Chip Size Package) Stacked Package COB (Chip On Board) Nowadays, the prominence of higher performance, smaller and lighter electronic equipment is increasing. Accordingly, the role played by the


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    PDF developme5x24 fbga 12 x 12 thermal resistance FBGA160-P-1212

    Untitled

    Abstract: No abstract text available
    Text: Hy Custom Hybrid ICs Hybrid IC component specifications-BX series Item BX- 1 Process general process BX-II Double side through-holes Chip size Density (high-density process) Thickness 0.8mm, 4 layers BX- III (high-density process) Thickness 0.8mm, 4 to 6 layers


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    PDF LL--41 -65mm

    Cu53

    Abstract: No abstract text available
    Text: DS = doppelseitig / double-sided / double face / de dos lados EP = FR4 - Epoxydglashartgewebe / epoxy fibre-glas / fibre de verre époxyde / epôxido a base de résina fenôlica HP = FR2 - Phenolharzhartpapier / SRBP-Paper / Résine phénolplaste / papel dura


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