QFP JEDEC TRAY 208 Search Results

Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A87A-1 TQFP 28x28 1.4mm 208 pin QFP 28 × 28 Terminal Spacing Linear = 0.5 A B 156 157 105 104 detail of lead end C D S Q 53 52 208 1 F G H I J M K P M N NOTE L ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of

3525a

Abstract: OT-001T-01 LA-0525A-1 LA-3525A-1
Contextual Info: Mounting Pad Packing NEC Tray Name LA-3525A-1 LA-0525A-1 JEDEC Tray OT-001T-01 208 pin QFP 28 x 28 Terminal Spacing Linear = 0.5 A B 156 157 105 104 F Q R S C D detail of lead end 208 1 G 53 52 H I J M M P K N NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of

3525a

Abstract: LA-0525A-1 LA-3525A-1 0502N
Contextual Info: Mounting Pad Packing NEC Tray Name LA-3525A-1 LA-0525A-1 JEDEC Tray OT-001T-01 208 pin QFP 28 x 28 Terminal Spacing Linear = 0.5 A B 156 157 105 104 F 208 1 G R Q S D C detail of lead end 53 52 H I M J M P K N L NOTE ITEM Each lead centerline is located within 0.08 mm (0.003 inch) of

QFP JEDEC tray

Abstract: MAX. 50 Tray
Contextual Info: Packing NEC Tray Name LA-3508A-1 Mounting Pad JEDEC Tray OT-001T-01 208 pin QFP 28 x 28 Terminal Spacing Linear = 0.5 A B 156 157 105 104 detail of lead end S C D Q 208 1 R 53 52 F G H I J M P K N S S L M NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.12 mm (0.005 inch) of

strapack s-669

Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
Contextual Info: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,

QFP Shipping Trays

Abstract: ND-1420-2 QFP 100 pin QFP PACKAGE mass 64 leads qfp QFP JEDEC tray
Contextual Info: QFP Carrier & Development Socket August 1999, ver. 13 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical

ND-1420-2

Abstract: QFP JEDEC tray 304-Pin 304 QFP
Contextual Info: QFP Carrier & Development Socket June 1996, ver. 10 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical

QFP JEDEC tray

Contextual Info: QFP Carrier & Development Socket June 1996, ver. 10 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical

TO-220 JEDEC

Abstract: ND-1420-2 QFP Package 80 lead 4-0308 4040 data sheet 9 pin socket nd-3232-3.4 parts detail of 5.1 sound pcb QFP 100 pin QFP Shipping Trays
Contextual Info: QFP Carrier & Development Socket August 1999, ver. 13 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical

QFP JEDEC tray

Abstract: ND-3232-3 ND-2828-3 304-pin dimensions
Contextual Info: QFP Carrier & Development Socket January 1998, ver. 12 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical

removal tool from EPLD socket

Contextual Info: QFP Carrier & Development Socket M a rc h 1995, ver. 7 Features D ata S h ee t • ■ ■ ■ General Description Q uad flat pack QFP carriers protect fragile leads on Altera QFP devices during shipping and device handling. Development sockets allow on-board electrical and mechanical

7404

Abstract: jedec do 35 QFP JEDEC tray
Contextual Info: UNIT : mm HEAT PROOF 7 PPE A' 32.8 37.02 74.04 30.93 MQFP 28 x 28 3.2mm 135.9 A 32.8 37.02 27.93 259.14 315 322.6 SECTION A-A' 32.8 Applied Package 120-pin Plastic QFP 3.2mm thick 208-pin Plastic QFP (Fine Pitch) (3.2mm thick) Quantity (pcs) MAX. 24 Tray

7404

Abstract: MQFP Tray 28 QFP JEDEC tray 32MM
Contextual Info: UNIT : mm HEAT PROOF 7 PPE A' 32.8 37.02 74.04 30.93 MQFP 28 x 28 3.2mm 135.9 A 32.8 37.02 27.93 259.14 315.0 322.6 SECTION A-A' 32.8 3.82 6.35 7.62 27.3 Applied Package 208-pin Plastic QFP (Fine Pitch) (3.2mm thick) 256-pin Plastic QFP (Fine Pitch) (3.2mm thick)

ASE QFP

Contextual Info: QFP Carrier & Development Socket Features • ■ ■ ■ ■ General Description Q u ad flat pack QFP carriers protect fragile leads on QFP devices d u rin g shipping and device handling. QFP developm ent sockets allow on-board electrical and m echanical

QFP28

Abstract: 7404 QFP JEDEC tray JEDEC TRAY QFP
Contextual Info: TRAY CONTAINER UNIT : mm 3 x 8=24 NEC 135° C MAX. A' 34.20 37.02 27.93 34.20 74.04 30.93 37.02 QFP28×28×3.2A 135.9 PPE A 259.14 315.0 322.6 SECTION A-A' 34.20 (3.77) (6.35) 7.62 27.35 Applied Package Quantity (pcs) 120-pin Plastic QFP (3.2mm thick) 160-pin Plastic QFP (3.2mm thick)

7404

Abstract: QFP JEDEC tray JEDEC TRAY QFP 32 jedec tray
Contextual Info: TRAY CONTAINER HEAT PROOF 7 PPE A' 35.20 37.02 27.93 35.20 NEC 150°C MAX 30.93 A 3x8 = 24 37.02 74.04 MQFP28×28×3.2 ××× 135.9 UNIT : mm 259.14 315.0 322.6 SECTION A – A' 35.20 3.77 (6.35) 7.62 27.37 Applied Package Quantity (pcs) Material 120-pin plastic QFP (3.2mm thick)

daewon tray

Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA

NEC A39A

Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Contextual Info: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES

LGA 1156 PIN OUT diagram

Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)

IC 50061

Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing

IC51-128

Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
Contextual Info: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials

camtex trays

Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP

PLCC 84 PINS

Abstract: camtex trays MIL-I-8835A
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP

HT 1200-4

Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher