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    QFP 144 TRAY Search Results

    QFP 144 TRAY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    HD6417032VF12V Renesas Electronics Corporation 32-bit Microcontrollers (Non Promotion), QFP, /Tray Visit Renesas Electronics Corporation
    M30621FCPGP#U9C Renesas Electronics Corporation 16-bit Microcomputers (Non Promotion), QFP, /Tray Visit Renesas Electronics Corporation
    M30621FCAGP#U3 Renesas Electronics Corporation 16-bit Microcomputers (Non Promotion), QFP, /Tray Visit Renesas Electronics Corporation
    M30625FGAGP#U3 Renesas Electronics Corporation 16-bit Microcomputers (Non Promotion), QFP, /Tray Visit Renesas Electronics Corporation
    M30621FCPGP#U3C Renesas Electronics Corporation 16-bit Microcomputers (Non Promotion), QFP, /Tray Visit Renesas Electronics Corporation

    QFP 144 TRAY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    QFP 144 PACKAGE

    Abstract: QFP 144 package tray
    Text: TRAY CONTAINER UNIT : mm 335±1.0 19.9±0.5 295.2±0.5 23±0.5 32.8±0.1 33.5±0.1 PPE A' 23 134±0.5 180±1.0 A NEC LA-3523A-1 HEAT PROOF 23 SECTION A – A' 23 5.8 6.4 8.8 19.8 Applied Package 144-pin Plastic QFP Fine Pitch (1.4mm thick) 176-pin Plastic QFP(Fine Pitch)(1.4mm thick)


    Original     		PDF LA-3523A-1 144-pin 176-pin SSD-A-H5753-1 QFP 144 PACKAGE QFP 144 package tray

    code M.H

    Abstract: No abstract text available
    Text: Mounting Pad Packing NEC Tray Name LA-3519A-1 LA-0519A-1 144 pin QFP 20 x 20 Terminal Spacing Linear = 0.5 A B 108 109 73 72 F Q R S D C detail of lead end 144 1 37 36 G H I J M M P K N NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of


    Original     		PDF LA-3519A-1 LA-0519A-1 S144GJ-50-JE S144GJ-50-JEU, code M.H

    NEC 2701

    Abstract: 144 pin qfp 2701 NEC B108 JEDEC tray dimension NEC 596 S144GJ-50-3EN-3
    Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3519A-1 LA-0519A-1 MQFP 20x20 2.7mm 144 pin QFP 20 × 20 Terminal Spacing Linear = 0.5 A B 108 109 73 72 detail of lead end S C D R Q 144 1 37 36 F G H I J M K P S N S L NOTE 1. Controlling dimension millimeter.


    Original     		PDF LA-3519A-1 LA-0519A-1 S144GJ-50-3EN-3 SC-596-A* NEC 2701 144 pin qfp 2701 NEC B108 JEDEC tray dimension NEC 596 S144GJ-50-3EN-3

    QFP 144 tray

    Abstract: No abstract text available
    Text: UNIT : mm 335±1.0 19.9±0.5 295.2±0.5 23±0.5 32.8±0.1 134±0.5 180±1.0 33.5±0.1 PPE A' 25.3 A NEC LA-3519A-1 135°C MAX 25.3 SECTION A-A' 25.3 5.95 8.8 5.8 19.59 Applied Package Quantity pcs 120-pin • Plastic QFP (Fine Pitch) (2.7mm thick) 144-pin · Plastic QFP (Fine Pitch) (2.7mm thick)


    Original     		PDF LA-3519A-1 120-pin 144-pin QFP 144 tray

    144 pin qfp

    Abstract: No abstract text available
    Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3523A-1 TQFP 20x20 1.4mm 144 pin QFP 20 × 20 Terminal Spacing Linear = 0.5 A B 108 109 73 72 detail of lead end C D S R Q 144 1 37 36 F G H I M J K P M N NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of


    Original     		PDF LA-3523A-1 S144GJ-50-8EU-2 144 pin qfp

    QFP JEDEC tray

    Abstract: JEDEC TRAY QFP QFP 144 tray QFP 144 package tray
    Text: HEAT PROOF 23.4 A' 17.55 25.2 MQFP 20x20 2.7mm A PPE 7 100.8 135.9 UNIT : mm 23.4 25.4 17.8 279.4 315 322.6 SECTION A – A' 23.4 3.92 6.35 7.62 19.55 Applied Package Quantity pcs 144-pin Plastic QFP (Fine Pitch)(2.7mm thick) MAX. 60 Tray Material Heat Proof Temp.


    Original     		PDF 144-pin QFP JEDEC tray JEDEC TRAY QFP QFP 144 tray QFP 144 package tray

    a04a

    Abstract: No abstract text available
    Text: UNIT : mm 335±1.0 304±0.5 16±0.1 18±0.5 15.5±0.5 16±0.1 A' 144±0.5 180±1.0 A 9.55 NEC LA - A04A - 1 HEAT PROOF 9.55 SECTION A–A' 9.55 5.8 6.4 8.8 6.7 Applied Package Quantity pcs 48-pin • Plastic QFP (Fine Pitch)(2.2mm thick) MAX. 200 Tray LA-A04A-1


    Original     		PDF 48-pin LA-A04A-1 a04a

    3523A

    Abstract: LA-3523A-1 QFP 144 package tray
    Text: UNIT : mm 335±1.0 19.9±0.5 295.2±0.5 23±0.5 32.8±0.1 33.5±0.1 PPE A' 23 134±0.5 180±1.0 A NEC LA-3523A-1 HEAT PROOF 23 SECTION A – A' 23 8.8 5.8 6.4 19.8 Applied Package Quantity pcs 144-pin Plastic QFP(Fine Pitch)(1.4mm thick) MAX. 50 Tray LA-3523A-1


    Original     		PDF LA-3523A-1 144-pin 3523A LA-3523A-1 QFP 144 package tray

    R50-E2Y2-24

    Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
    Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.


    Original     		PDF PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01 R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001

    xc912dg128

    Abstract: MC9S12D64 xc912bc32 MC3PHAC XC68HC705B32 MC908AB32CFU MC9S12DP MC68 MC68376 MC908AZ60
    Text: MICROCONTROLLERS QUARTER 3, 2002 SG1006/D REV 1 WWW.MOTOROLA.COM/SEMICONDUCTORS What’s New! Product MC68HC908QT1 MC68HC908QT2 Description Introducing the Nitron Family of HC08s. This family of 8- and 16-pin microcontrollers includes six different devices featuring 1.5K to 4K bytes of FLASH, a 2-ch


    Original     		PDF SG1006/D MC68HC908QT1 MC68HC908QT2 HC08s. 16-pin 16-bit MC68HC908QT4 MC68HC908QY1 MC68HC908QY2 xc912dg128 MC9S12D64 xc912bc32 MC3PHAC XC68HC705B32 MC908AB32CFU MC9S12DP MC68 MC68376 MC908AZ60

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga

    S1L50552

    Abstract: tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon
    Text: ASICs Gate Arrays / Embedded Arrays / Standard Cells 2010 Our goal in the Epson Semiconductor Operations Division is to be a true partner for you, by looking to give you an edge in product development through our concept of "+less design". Gate Arrays / Embedded Arrays / Standard Cells


    Original     		PDF S1L60173F00A000 S1L50552 tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon

    xcm916

    Abstract: motorola mc68 908 97 mfu DIODE xc912dg128 908az60 MC68S711E MCM916 MC912 MC908AS60A PV 100 USB
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: DSP56F807VF80


    Original     		PDF DSP56F807VF80 SPSSG1006/D MC68HC08Aotorola xcm916 motorola mc68 908 97 mfu DIODE xc912dg128 908az60 MC68S711E MCM916 MC912 MC908AS60A PV 100 USB

    MPXY8600

    Abstract: MPC5674 MPC5603 MPC56xx MPC5668G MPC55XX JTAG MPXY8600A MC33730 MPC5516E MPC5517E
    Text: Automotive Quarter 4, 2009 SG187Q42009 Rev 37 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: i.MX and MPC5668G product families; S12XE, MPC551x, MPC560xS, MPC563xM, MPC560xB, MPC5533, MPC5534 and MPC5553 products in 208 MAPBGA packages.


    Original     		PDF SG187Q42009 MPC5668G S12XE, MPC551x, MPC560xS, MPC563xM, MPC560xB, MPC5533, MPC5534 MPC5553 MPXY8600 MPC5674 MPC5603 MPC56xx MPC55XX JTAG MPXY8600A MC33730 MPC5516E MPC5517E

    PCB footprint cqfp 132

    Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318

    mp 9141 es

    Abstract: MC33662 MPXY8600 MPC5673F MPC56xx fet e300 MPC5606B MC33905 mpxy8500 MPC5643L
    Text: Automotive Quarter 4, 2010 SG187Q42010 Rev 40 FREESCALE SEMICONDUCTOR ANALOG AND MIXED SIGNAL PRODUCTS The product categories range from Power Actuation and Network Transceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation covers a broad range of


    Original     		PDF SG187Q42010 mp 9141 es MC33662 MPXY8600 MPC5673F MPC56xx fet e300 MPC5606B MC33905 mpxy8500 MPC5643L

    strapack s-669

    Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
    Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,


    Original     		PDF

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
    Text: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208

    MO-83-AF

    Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128

    camtex trays

    Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
    Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP


    Original     		PDF

    PLCC 84 PINS

    Abstract: camtex trays MIL-I-8835A
    Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP


    Original     		PDF

    9s08dz32

    Abstract: 9s12xeq384 144 QFP 908QY1 9S12XDT256 manual 9S12XHZ256 9s08sg32 9S08DZ128 NEXUS iso MC33810 MC33882
    Text: Automotive Quarter 4, 2007 SG187Q42007 Rev 29 FREESCALE SEMICONDUCTOR ANALOG AND MIXED SIGNAL PRODUCTS The product categories range from Power Actuation and Network Transceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation covers a broad


    Original     		PDF SG187Q42007 9s08dz32 9s12xeq384 144 QFP 908QY1 9S12XDT256 manual 9S12XHZ256 9s08sg32 9S08DZ128 NEXUS iso MC33810 MC33882

    PCB design for very fine pitch csp package

    Abstract: 0.3mm pitch csp package oki pitch wcsp reliability 0.4mm pitch BGA 2asic oki packaging gps watch ceramic QFP Package 100 lead
    Text: Oki’s ASIC Wafer Level Chip Size Packaging Technology Overview March 2004 1 ASIC W-CSP 02/04 The Market’s Requirement for New ASIC Packaging Technology • The need for increased functionality, smaller device size and lower costs are major challenges for today’s ASIC design engineers


    Original     		PDF

    MIL-I-8835A

    Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
    Text: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from


    Original     		PDF