100L
Abstract: JESD51-2 JESD51-7 32 QFP PACKAGE thermal resistance tqfp 7x7 1.4 tray tqfp 7x7 tray tqfp 64 thermal resistance Techpoint
Text: TQFP Thin Profile Quad Flat Pack • 7 x 7mm to 14 x 14mm • 32 to 128 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 14 x 14mm The Thin Profile Quad Flat Pack TQFP belongs to STATS ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP
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BR931
Abstract: motorola mca MCA3200ETL MCA6200ETL MCA750ETL H4C018 Motorola Master Selection Guide H4C161 wirebond die flag lead frame an1512
Text: Semicustom Application Specific Integrated Circuits In Brief . . . Motorola supports strategic programs and co–development partnerships to accelerate the availability of advanced processes CMOS, BiCMOS, Bipolar , packaging and CAD technology. Extensive research,
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Arm processor vlsi technology
Abstract: PC302 QFP 128 bonding
Text: VLSI T e ch n o lo g y o.5-m ic r o n in c. _ PRELIMINARY ASIC PRODUCT FAMILY GENERAL SPECIFICATIONS FEATURES BENEFITS • 0.5-micron 0.45-micron effective two- and three-layer metal CMOS technology. Typical 2-input NAND (FO=2) spec
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45-micron
Arm processor vlsi technology
PC302
QFP 128 bonding
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MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR
Abstract: uPD65837 uPD65869 X17512 upd65839 RF Transistors Ceramic MARKING F25 marking code F302 535 D65841 uPD65851 X46358
Text: Design Manual CMOS-8L Family CMOS Gate Array Ver. 5.0 Document No. A12158EJ5V0DM00 5th edition Date Published June 1999 N CP(K) 1997, 1998 Printed in Japan 1 [MEMO] 2 Design Manual A12158EJ5V0DM00 NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
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Semiconductor2/9044
MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR
uPD65837
uPD65869
X17512
upd65839
RF Transistors Ceramic MARKING F25
marking code F302 535
D65841
uPD65851
X46358
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PC5004
Abstract: VGC650 VGC6P52 VGC600 IN01D1 NR02D1 QFP 128 bonding
Text: V L S I T ech n o lo gy, inc. O.6-MICRON _ ASIC PRODUCT FAMILY GENERAL SPECIFICATIONS FEATURES BENEFITS • 0.6-micron 0.55-micron effective two- and three-layer metal CMOS technology. Typical 2-input NAND (FO=2) spec - 5 V (4.5 to 5.5 V): 190 ps, 2.6 nW/MHz
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55-micron
PC5004
VGC650
VGC6P52
VGC600
IN01D1
NR02D1
QFP 128 bonding
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bi 240
Abstract: SnAgCu NA200 NA200 flux QFP-208 NA-200 paste profile SMD Packages QFP 128 bonding QFP PACKAGE thermal resistance
Text: Quality Evaluation Data for Lead-free SMD Peripheral Packages Sn-Bi plating August 30, 2002 Seiko Epson Corporation Contents 1. Observation of Surface Condition of Sn-Bi Type Lead Plating 2. Soldering Evaluation for Lead Plating 2-1 Solderability test results for stand-alone packages
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NA200)
bi 240
SnAgCu
NA200
NA200 flux
QFP-208
NA-200
paste profile
SMD Packages
QFP 128 bonding
QFP PACKAGE thermal resistance
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68hc26
Abstract: 68HC05C4 68hc705p9 68HC05B6 JPC3400 68hc805b6 68705r3 68HC05C12 68HC705B5 68HC68SE
Text: CSIC Microcontroller Division Reliability and Quality Quarter 2, 1996 Report MOTOROLA INC., 1996 CSIC MICROCONTROLLER DIVISION RELIABILITY AND QUALITY REPORT TECHNICAL INFORMATION . 1-1 RELIABILITY DATA BY TECHNOLOGY. 2-1
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NA200 flux
Abstract: bi 240 QFP 208 MT90810AK3 NA200 QFP208-pin epson, whisker
Text: Soldering Information for the MT90810AK3 Sn-Bi plating lead-free package 260 oC Peak Temperature from Seiko Epson Corporation For more information about Seiko Epson Lead-Free packages, Please consult their web site at :
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MT90810AK3
NA200)
NA200 flux
bi 240
QFP 208
MT90810AK3
NA200
QFP208-pin
epson, whisker
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68hc11pa8
Abstract: 68hc11kg4 68B09E 68HC11PH8 HC711KG4 68HC11KA4 68HC57 68HC11L6 HC705B16 motorola 68hc11kg4
Text: MCTG RELIABILITY AND QUALITY 1996 ANNUAL REPORT MRQSY96/D Microcontroller Technologies Group Reliability and Quality 1996 Annual Report To Our Valued Customers: Thank you for selecting Motorola as your preferred supplier of Microcontroller products. We in Motorola’s
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68hc11pa8
68hc11kg4
68B09E
68HC11PH8
HC711KG4
68HC11KA4
68HC57
68HC11L6
HC705B16
motorola 68hc11kg4
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116-Pin
Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size
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C13185EJ1V0PF00
116-Pin
PBGA 256 reflow profile
semiconductor cross index
Lead Free reflow soldering profile BGA
reflow soldering profile BGA
224-pin plastic ball grid array 0.8mm
JIS-Z0202
tray qfp 14x14 1.4
tray bga 10x10
pcb warpage after reflow
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synopsys Platform Architect
Abstract: clock tree balancing DesignWare SPI vhdl code for watchdog timer of ATM 0.18-um CMOS technology characteristics vhdl coding for analog to digital converter CML Vterm 27x27
Text: GS20 0.18-µm CMOS Standard Cell/Gate Array Version 1.1 May 19, 2000 Copyright Texas Instruments Incorporated, 2000 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the
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S1D15719
Abstract: S1D15722D01B S1D15719D22B S1D15714D01E s1d13517 S1D15722 Matrix CCD "line sensor" Epson epd driving S1D15712 S1D15721D01B
Text: CMOS LSIs Product Catalog 2009 SEIKO EPSON CORPORATION CMOS LSIs Contents Configuration of product number . 2 1 ASICs Application Specific IC 1-1 Gate Arrays . 4
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S1L60000
S1L50000
S1L30000
16-bit
32-bit
S1D15719
S1D15722D01B
S1D15719D22B
S1D15714D01E
s1d13517
S1D15722
Matrix CCD "line sensor" Epson
epd driving
S1D15712
S1D15721D01B
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68HC11L6
Abstract: 68hc11ka4 68HC11PH8 68HC11a1 527 MOSFET TRANSISTOR motorola D65C 68HC05N4 nippon denso 68HC05B6 128 QFP 14x20
Text: CMRQS/D REV 10 MOTOROLA MICROCONTROLLER TECHNOLOGIES GROUP RELIABILITY AND QUALITY MONITOR REPORT Quarter 1, 1997 Semiconductor Product Sector Test results contained herein are for information only. This report does not alter MotorolaÕs standard warranty or product speciÞcations.
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144 QFP body size
Abstract: 35x35 bga BGA and QFP Package vhdl code for usart DesignWare SPI 0.18-um CMOS technology characteristics ARM7 verilog code NEC-V850 PZT driver design vhdl coding for analog to digital converter
Text: GS20 0.18-µm CMOS Standard Cell/Gate Array Version 1.0 April 6, 1999 Copyright Texas Instruments Incorporated, 1999 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the
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NAND Flash Programmer with TSOP-48 adapter
Abstract: INTEL Core i7 860 schematic diagram inverter lcd monitor fujitsu MB506 ULTRA HIGH FREQUENCY PRESCALER fujitsu LVDS vga MB89625R VHDL code simple calculator of lcd display JTag Emulator MB90F497 Millbrook BGA TBA 129-5
Text: Master Product Selector Guide February 2001 Fujitsu Microelectronics, Inc. Contents Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Application Specific ICs ASICs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
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SSC3020
Abstract: SSC3030 F1841 SSC3110 F605 SSC3010 SSC3120 SSC3150
Text: S S C 3 0 0 0 s e r ie s HIGH SPEED CMOS STANDARD CELL • DESCRIPTION The SSC3000 Series is comprised of the SSC3000 and SSC3500 family of standard cells. Each family is offered in 20 preset gate to I/O combinations. Both the SSC3000 and SSC3500 offer high speed and high drive capability
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SSC3000
SSC3500
SSC3000Serles
SSC3020
SSC3030
F1841
SSC3110
F605
SSC3010
SSC3120
SSC3150
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FN 1016
Abstract: MPA 67 MPA1064DH BFR32 B1582 transistor fn 1016 DL201 MPA1016DD MPA1036HI 269 SL3.0/transistor fn 1016
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MPA1000 Product Description Motorola Programmable Array MPA products are a high density, high performance, low cost, solution for your reconfigurable logic needs. When used with our automatic high performance design tools, MPA delivers custom logic
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MPA1016
MPA1036
DL201
FN 1016
MPA 67
MPA1064DH
BFR32
B1582
transistor fn 1016
MPA1016DD
MPA1036HI
269 SL3.0/transistor fn 1016
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m60013
Abstract: M60016 m60011 M60014 z46n M60030 M60024 Z24N M60012 m60043
Text: A m its u b is h i CMOS GATE ARRAYS ELECTRONIC DEVICE GROUP Mitsubishi CMOS Gate Arrays INTRODUCTION Mitsubishi offers three fami lies of CMOS gate arrays: 1.0 /im, 1.3 /j.m, and 2.0 ji.m, with usable gates ranging from 200 to 35,000. The 1.0 and 1.3 p.m devices are
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MDS-GA-11-90-RK
m60013
M60016
m60011
M60014
z46n
M60030
M60024
Z24N
M60012
m60043
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KGA0E000BA
Abstract: kgc0g000dm KGB0F000BA fBGA package tray 12 x 19 FCMSP kga0a000am kgd0h000dm fBGA package tray 12 19 secucalm lsi SoC
Text: Mobile SoC Code Information • Microcontroller • MSP • MOS August 2009 -1- Part Number Decoder Microcontroller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte
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ARM10
16-bit
HT80Cer
KGA0E000BA
kgc0g000dm
KGB0F000BA
fBGA package tray 12 x 19
FCMSP
kga0a000am
kgd0h000dm
fBGA package tray 12 19
secucalm
lsi SoC
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Multi-Chip Modules motorola
Abstract: No abstract text available
Text: MOTOROLA SC •CNEI'IORY/ASI L^E D b3t.7ESl □Df iTbtn 053 M N0T3 MOTOROLA SEMICONDUCTOR Order by MCMLiD • TECHNICAL DATA Advance Information APPLICATION SPECIFIC MULTICHIP MODULES MCML SERIES MULTICHIP MODULES CMOS/BICMOS SEMICONDUCTORS This specification defines the product characteristics for the MCML Series of
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sma098
110T3
Multi-Chip Modules motorola
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Date Code Formats Altera EPF10K
Abstract: ep22v10 5962-9061102XA 5962-8854901xa 8686401LA 5962-8686401LA lift controller in vhdl ALTERA PART MARKING EPM7160 EPX780 transistor b2020
Text: Introduction Contents March 1995 Introduction The PLD Advantages of Altera
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exposed QFP 144
Abstract: exposed QFP 128 TQFP-EP AN 7823 EP 603 QFP-EP 100L 144L JESD51-2 JESD51-7
Text: QFP-ep Exposed Pad Quad Flat Pack • 7 x 7mm to 24 x 24mm body sizes • 32 to 216 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 24 x 24mm STATS ChipPAC’s Exposed Pad Quad Flat Pack QFP-ep is a thermally enhanced version of the QFP package. Thermal
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"Single-Port RAM"
Abstract: CE71 CE71J1 CE71J2 CE71J3 tb 304
Text: CE71 Series Embedded Array t 0.25µm CMOS Technology Features 0.18µm Leff 0.24µm drawn Propagation delay of 61 ps Separate core and I/O supply voltages Mixed-signal macros–A/D and D/A converters I/Os: 2.5V, 3.3V, 5V tolerant Core power supply voltage: 2.5V, 1.8V, 1.5V
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ASIC-FS-20655-11/99
"Single-Port RAM"
CE71
CE71J1
CE71J2
CE71J3
tb 304
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MSS30
Abstract: CE71 CE71J1 CE71J2 CE71J3 dual lvds vhdl fujitsu lvds standard
Text: CE71 Series Embedded Array t 0.25µm CMOS Technology Features 0.18µm Leff 0.24µm drawn Propagation delay of 61 ps Separate core and I/O supply voltages Mixed-signal macros–A/D and D/A converters I/Os: 2.5V, 3.3V, 5V tolerant Core power supply voltage: 2.5V, 1.8V, 1.5V
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MSS30
CE71
CE71J1
CE71J2
CE71J3
dual lvds vhdl
fujitsu lvds standard
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