QFN 5x5
Abstract: qfn stencil "exposed pad" PCB via "thermal via" solder mask P4171 X-RAY INSPECTION via diameter pitch 40-QFN QFN "exposed die"
Text: Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.7 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.15 mm min 0.20 mm typ 0.25 mm max PCA 40 QFN 5x5 NDG 40 package the land pattern dimensions should
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com/data/tb/TB389
dwg/plastic/P4171
QFN 5x5
qfn stencil
"exposed pad" PCB via
"thermal via"
solder mask
P4171
X-RAY INSPECTION
via diameter pitch
40-QFN
QFN "exposed die"
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QFN 5X5
Abstract: "thermal via" qfn land pattern
Text: Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.5 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.17 mm min 0.20 mm typ 0.25 mm max PCA 40 QFN 5x5 NDG 40 package the land pattern dimensions should
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com/data/tb/TB389
dwg/plastic/P4171
QFN 5X5
"thermal via"
qfn land pattern
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QFN leadframe
Abstract: omnix 5000 nsmd smd qfn stencil
Text: AND8086/D Board Mounting Notes for Quad Flat-Pack No-Lead Package QFN http://onsemi.com APPLICATION NOTE INTRODUCTION Various ON Semiconductor components are packaged in an advanced Quad Flat–pack No–Lead Package (QFN). Because the QFN platform represents the latest in surface
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AND8086/D
r14525
QFN leadframe
omnix 5000
nsmd smd
qfn stencil
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J-STD-005
Abstract: land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief March 27, 2008 TB389.5 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently
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TB389
J-STD-005
land pattern for DFN
qfn 10mm land pattern
nozzle heater
qfn Substrate design guidelines
two tinned touch pads
ipc-SM-782
PIC16F877A circuit diagram
pitch 0.4mm BGA
Technical Brief TB389
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IPC-7095B
Abstract: IPC-7095 7095B IPC 7095B EN5312QI en5312 qfn stencil
Text: Enpirion, Inc. EN5312QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5312QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package
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EN5312QI
IPC-7095B
IPC-7095
7095B
IPC 7095B
en5312
qfn stencil
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TB389
Abstract: No abstract text available
Text: Technical Brief 389 Authors: Mark Kwoka and Jim Benson PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently experiencing
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TEXAS INSTRUMENTS, Mold Compound QFN
Abstract: SLUA271 SLOA122 dsp layout guidelines QFN PACKAGE thermal resistance
Text: Application Report SLOA122 – July 2006 QFN Layout Guidelines Yang Boon Quek . HPL Audio Power Amplifiers 1 Introduction Board layout and stencil information for most Texas Instruments TI Quad Flat No-Lead (QFN) devices is
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SLOA122
TEXAS INSTRUMENTS, Mold Compound QFN
SLUA271
SLOA122
dsp layout guidelines
QFN PACKAGE thermal resistance
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J-STD-005
Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently
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J-STD-005
nozzle heater
Soldering guidelines and SMD footprint design
Technical Brief TB389
IPC-SM-782
MO-220
XQFN
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EN5311Qi
Abstract: EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil
Text: Enpirion, Inc. EN5311QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5311QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package
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EN5311QI
EN5311
IPC-7095
IPC-7095B
QFN PACKAGE thermal resistance
"exposed pad" PCB via
qfn 32 land pattern
qfn stencil
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qfn 32 land pattern
Abstract: MO-220 5x5mm "BGA Rework Practices", hakko vqfn 44 land pattern MO-220 qfp 32 land pattern jedec package MO-220 vkkd qfn land pattern
Text: APPLICATION NOTE QFN PACKAGES 32-pin leadless package Introduction to the QFN The QFN Quad Flat No lead package is a near chip scale plastic encapsulated package related to the plastic quad flat package. This style of package comes in several varieties and is known by several names such as MLF, LPCC, and
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32-pin
MO-220
199707558G
qfn 32 land pattern
MO-220 5x5mm
"BGA Rework Practices",
hakko
vqfn 44 land pattern
MO-220
qfp 32 land pattern
jedec package MO-220 vkkd
qfn land pattern
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NIS5102
Abstract: PNC0106A
Text: AND8249/D Board Mounting Notes for NIS5102 Leadless Package QFN Prepared by: Alan Ball ON Semiconductor http://onsemi.com APPLICATION NOTE Introduction Various ON Semiconductor components are packaged in an advanced Quad Flat−Pack No−Lead Package (QFN) or
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AND8249/D
NIS5102
PNC0106A
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QFN-48 LAND PATTERN
Abstract: QFN PACKAGE thermal resistance QFN-48 footprint qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo FOOTPRINT PCB qfn 48 7x7 stencil AN5060
Text: Optimum PCB and Stencil Layout for WirelessUSB QFN Package Introduction When designing a system board using the WirelessUSB™ LS/LR QFN chip for wireless product applications, there are several important factors to consider. It is advised to pay critical attention to PCB design and assembly aspects when
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3773 SMD
Abstract: smd 3773 NIS6111 PNC0106A
Text: AND8188/D Board Mounting Notes for NIS6111 Leadless Package QFN Prepared by: Alan Ball ON Semiconductor http://onsemi.com APPLICATION NOTE Introduction Various ON Semiconductor components are packaged in an advanced Quad Flat−Pack No−Lead Package (QFN) or
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AND8188/D
NIS6111
3773 SMD
smd 3773
PNC0106A
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3773 SMD
Abstract: smd 3773 metal package case 601 stencil tension NIS6111 PNC0106A
Text: AND8188/D Board Mounting Notes for NIS6111 Leadless Package QFN Prepared by: Alan Ball ON Semiconductor http://onsemi.com APPLICATION NOTE Introduction Various ON Semiconductor components are packaged in an advanced Quad Flat-Pack No-Lead Package (QFN) or
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AND8188/D
NIS6111
3773 SMD
smd 3773
metal package case 601
stencil tension
PNC0106A
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SLUA271
Abstract: IPC-7527 IPC7527 DUAL ROW QFN leadframe PCB design for very fine pitch csp package nozzle heater qfn Substrate design guidelines IPC-SM-782 qfn 28 land pattern Service Manual smd rework station
Text: Application Report SLUA271 - June 2002 QFN/SON PCB Attachment PMP Portable Power ABSTRACT Quad flatpack—no leads QFN and small outline—no leads (SON) are leadless packages with electrical connections made via lands on the bottom side of the component to the surface
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SLUA271
IPC-7527
IPC7527
DUAL ROW QFN leadframe
PCB design for very fine pitch csp package
nozzle heater
qfn Substrate design guidelines
IPC-SM-782
qfn 28 land pattern
Service Manual smd rework station
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qfn Substrate design guidelines
Abstract: j-std-001d IPC-SM-782 MO-220 TB389
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief August 17, 2006 TB389.3 Author: Mark Kwoka Introduction General Design Guidelines Intersil’s Quad Flat No Lead QFN package is a relatively new packaging concept that is currently experiencing rapid
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qfn Substrate design guidelines
j-std-001d
IPC-SM-782
MO-220
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J-STD-005
Abstract: nozzle heater paste profile qfn 10mm land pattern J-STD-001C solder joint IPC-SM-782 MO-220 TB389 MARK RAY QFN
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN MLFP Packages Technical Brief March 2004 TB389.2 Authors: Jim Benson, Mark Kwoka, Ray Claudio Introduction General Design Guidelines Intersil’s Quad Flat No Lead (QFN), Micro Lead Frame Plastic (MLFP) package is a relatively new packaging
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J-STD-005
nozzle heater
paste profile
qfn 10mm land pattern
J-STD-001C
solder joint
IPC-SM-782
MO-220
MARK RAY QFN
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qfn 48 7x7 stencil
Abstract: Soldering guidelines pin in paste standoff amkor exposed pad AT88RF1354 IPC-SM-782 qfn 44 7x7 PACKAGE footprint Soldering guidelines pin in paste 10x10 qfn qfn 48 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size
Text: 1. Introduction This document provides PCB designers with a set of guidelines for successful board mounting of Atmel’s QFN MicroLeadFrame package. The QFN package is a near chip scale plastic encapsulated package with a copper leadframe substrate. This is a leadless package where electrical
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Untitled
Abstract: No abstract text available
Text: MSWS3T-1004 PIN DIODE SWITCH ELEMENT PIN #10 PIN #13 PIN #8 PIN #2 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground Description Features A SP3T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and
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MSWS3T-1004
17ion
A17140
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Untitled
Abstract: No abstract text available
Text: MSWS3T-1004 PIN DIODE SWITCH ELEMENT PIN #10 PIN #13 PIN #8 PIN #2 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground Description Features A SP3T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and Thermal
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MSWS3T-1004
A17140
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Untitled
Abstract: No abstract text available
Text: MSWS3T-1004 PIN DIODE SWITCH ELEMENT PIN #10 PIN #13 PIN #8 PIN #2 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground Description Features A SP3T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and Thermal
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MSWS3T-1004
A17140
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Untitled
Abstract: No abstract text available
Text: MSW4T-1004 PIN DIODE SWITCH ELEMENT PIN #13 PIN #8 PIN #16 PIN #5 PIN #2 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground Description Features A SP4T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and Thermal
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MSW4T-1004
A17141
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Untitled
Abstract: No abstract text available
Text: MSWS4T-1004 PIN DIODE SWITCH ELEMENT PIN #13 PIN #8 PIN #16 PIN #5 PIN #2 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground Description Features A SP4T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and
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MSWS4T-1004
A17141
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marking la
Abstract: No abstract text available
Text: EMIF08-1005T16 8 lines IPAD low capacitance EMI filter and ESD protection in thin micro QFN Datasheet − production data Features • High efficiency in EMI filtering ■ ESD performances: up to 15 kV ■ Micro QFN 400 µm pitch ■ Low PCB space consuming with narrow
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marking la
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