QFN 7X7
Abstract: qfn 8x8 56 qfn 7x7 QFN 7X7 package QFN-4x4 QFN 56 7x7
Text: Package Diagram QFN 20-Lead QFN 4x4 mm LF20 51-85163-* 48-Lead QFN (7x7 mm) LF48 51-85152-* 1 Package Diagram 56-Lead QFN (8x8 mm) 51-85144-*A 2
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20-Lead
48-Lead
56-Lead
QFN 7X7
qfn 8x8
56 qfn 7x7
QFN 7X7 package
QFN-4x4
QFN 56 7x7
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Untitled
Abstract: No abstract text available
Text: 19-0526; Rev 0; 5/06 KIT ATION EVALU E L B AVAILA 10-Bit, 7.5Msps, Full-Duplex Analog Front-End MAX19710ETN+ 56 Thin QFN-EP* T5677-1 *All devices are specified over the -40°C to +85°C operating range. *EP = Exposed paddle. +Denotes lead-free package. DA4
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10-Bit,
620kHz
400mV
10-bit
MAX19710
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USB3250-ABZJ
Abstract: 875u abzj
Text: GT3200 64-PIN TQFP PACKAGES USB3250 (56-PIN QFN PACKAGE) USB2.0 PHY IC PRODUCT FEATURES • ■ ■ ■ ■ ■ ■ ■ Datasheet USB-IF "Hi-Speed" certified to USB2.0 electrical specification Interface compliant with the UTMI specification (60MHz 8-bit unidirectional interface or 30MHz 16-bit
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GT3200
64-PIN
USB3250
56-PIN
60MHz
30MHz
16-bit
480Mbps
12Mbps
12MHz
USB3250-ABZJ
875u
abzj
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ic 812
Abstract: USB3250-ABZJ 56-PIN CRC-16 GT3200 GT3200-JD GT3200-JN USB3250
Text: GT3200 64-PIN TQFP PACKAGES USB3250 (56-PIN QFN PACKAGE) USB2.0 PHY IC PRODUCT FEATURES • ■ ■ ■ ■ ■ ■ ■ Datasheet USB-IF "Hi-Speed" certified to USB2.0 electrical specification Interface compliant with the UTMI specification (60MHz 8-bit unidirectional interface or 30MHz 16-bit
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GT3200
64-PIN
USB3250
56-PIN
60MHz
30MHz
16-bit
480Mbps
12Mbps
12MHz
ic 812
USB3250-ABZJ
CRC-16
GT3200
GT3200-JD
GT3200-JN
USB3250
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USB3250-ABZJ
Abstract: USB3250 GT3200-JV MO-220 8x8 68 56-PIN CRC-16 GT3200 GT3200-JD GT3200-JN debounce IC
Text: GT3200 64-PIN TQFP PACKAGES USB3250 (56-PIN QFN PACKAGE) USB2.0 PHY IC PRODUCT FEATURES Datasheet USB-IF "Hi-Speed" certified to USB2.0 electrical specification Interface compliant with the UTMI specification (60MHz 8-bit unidirectional interface or 30MHz 16-bit
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GT3200
64-PIN
USB3250
56-PIN
60MHz
30MHz
16-bit
480Mbps
12Mbps
12MHz
USB3250-ABZJ
USB3250
GT3200-JV
MO-220 8x8 68
CRC-16
GT3200
GT3200-JD
GT3200-JN
debounce IC
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Untitled
Abstract: No abstract text available
Text: C O N F I D E N T I A L LX24232 TM 32 CHANNEL LED BACKLIGHT CONTROLLER D ATASHEET DESCRIPTION KEY FEATURES Plastic MLPQ 8 x 8mm QFN 56 pin RoHS Compliant/Pb free MSL1 LX24232ILQ -40° to +85°C Note: Available in Tape & Reel. Append the letters ”TR” to part number. LX24232ILQ-TR
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LX24232
LX24232ILQ
LX24232ILQ-TR)
LX24232
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qfn 8x8 reel
Abstract: CHL8328 56-pin 7x7 QFN chl8326 IR3536MTR i2c/IR3536
Text: IR3536/38 CHL8326/28 Digital Multi-Phase Buck Controller FEATURES DESCRIPTION • 6-phase & 8-phase dual output PWM Controller Phases are flexibly assigned between Loops 1 & 2 Intel VR12, AMD® 3.4MHz SVI/PVI & Memory modes Overclocking & Gaming Mode with Vmax setting
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IR3536/38
CHL8326/28
200kHz
IR3536/CHL8326
IR3538/CHL8328
qfn 8x8 reel
CHL8328
56-pin 7x7 QFN
chl8326
IR3536MTR
i2c/IR3536
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Untitled
Abstract: No abstract text available
Text: IR3536/38 CHL8326/28 Digital Multi-Phase Buck Controller FEATURES DESCRIPTION • 6-phase & 8-phase dual output PWM Controller Phases are flexibly assigned between Loops 1 & 2 Intel VR12, AMD® 3.4MHz SVI/PVI & Memory modes Overclocking & Gaming Mode with Vmax setting
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IR3536/38
CHL8326/28
200kHz
IR3538/
CHL8328
IR3538/CHL8328
IR3536/CHL8326
CHL8328
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XP1080-QU-0NP0
Abstract: No abstract text available
Text: 37.0-40.0 GHz GaAs Power Amplifier QFN, 7x7mm P1080-QU December 2009 - Rev 10-Dec-09 Features Linear Power Amplifier On-Chip Power Detector Output Power Adjust 25.0 dB Small Signal Gain +27.0 dBm P1dB Compression Point +38.0 dBm OIP3 General Description Absolute Maximum Ratings1,2
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10-Dec-09
P1080-QU
XP1080-QU
XP1080-QU-0NP0
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P1080-QU
Abstract: XB1014-QT PDC 14
Text: 37.0-40.0 GHz GaAs Power Amplifier QFN, 7x7mm P1080-QU January 2010 - Rev 22-Jan-10 Features Linear Power Amplifier On-Chip Power Detector Output Power Adjust 25.0 dB Small Signal Gain +27.0 dBm P1dB Compression Point +38.0 dBm OIP3 General Description Absolute Maximum Ratings1,2
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P1080-QU
22-Jan-10
XP1080-QU
P1080-QU
XB1014-QT
PDC 14
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P1080-QU
Abstract: xp1080 329mm
Text: 37.0-40.0 GHz GaAs Power Amplifier QFN, 7x7mm P1080-QU January 2011 - Rev 10-Jan-11 Features Linear Power Amplifier On-Chip Power Detector Output Power Adjust 25.0 dB Small Signal Gain +27.0 dBm P1dB Compression Point +38.0 dBm OIP3 General Description Absolute Maximum Ratings1,2
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10-Jan-11
P1080-QU
XP1080-QU
P1080-QU
xp1080
329mm
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QFN 56 7x7 footprint
Abstract: QFN 56 7x7 0.5 TEXTOOL 56 qfn 7x7
Text: 3MTM TEXTOOLTM OPEN-TOP SOCKETS FOR QFN APPLICATIONS NOTES: 1. MATERIALS: SPRINGS CONTACTS IC GUIDES PRESSURE PAD COVER BASE 30 SS Be Cu PES PES PPS or equiv. PES PLATING : Au COLOR : BLACK COLOR : BLACK COLOR : BLACK COLOR : BLACK 2. SEE THE REGULATORY INFORMATION APPENDIX RIA
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance
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AN1902
QFN 76 9x9 footprint
QFN 64 8x8 footprint
QFN PACKAGE thermal resistance
JEDEC JESD51-8 BGA
4914 smd
qfn 32 land pattern
QFN 64 9x9 footprint
QFN 9X9
AN1902
MO-220
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DUAL ROW QFN leadframe
Abstract: QFN tray qfn 4x4 JEDEC qfn tray tray qfn 8x8 tray qfn 6x6 QFN tray 8x8 tray qfn 9x9 QFN 64 8x8 PACKAGE TRAY AN 7823 JEDEC qfn tray 5x5
Text: QFN Quad Flat No-Lead Package • Punch or Saw singulated formats • Body sizes from 2 x 2mm to 12 x 12mm • Pin counts from 4L to 156L • Square or rectangular body sizes • Leads on four sides of the body QFN • Leads on two opposing sides of the
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CHiL Semiconductor
Abstract: No abstract text available
Text: CHL8326/8 DIGITAL MULTI-PHASE GPU BUCK CONTROLLER PRODUCT BRIEF PRELIMINARY 46 45 44 43 42 41 40 39 38 37 36 RCSP_L2 RCSM 2 35 RCSM_L2 VCC 3 34 VCC CFP1 / VFIXEN_PSI2 4 33 VSEN_L2 CHiL Adaptive Transient Algorithm ATA on both loops minimizes output bulk capacitors and system cost
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CHL8326/8
CHL832
CHL8326
CHL8328
CHL8326-00CRT
CHL8326-xxCRT
CHL8328-00CRT
CHL8328-xxCRT
PB0011
CHiL Semiconductor
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FOOTPRINT MO-229 2X3 SOLDERING
Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level
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AN1902
FOOTPRINT MO-229 2X3 SOLDERING
Theta-JC QFP die down
QFN 56 7x7 footprint
EIA-783
EIA and EIAJ standards 783
QFN 76 9x9 footprint
AN1902
QFN 56 7x7 0.5
JESD51-7
MO-220
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ir3567
Abstract: IR3567A IR3567AM IR3567AMTRPBF programmable digital pwm I2C multiphase AMD Voltage regulation design PWM 3V 5V NOTEBOOK smale
Text: IR3567A Dual Output Digital Multi-Phase Controller FEATURES DESCRIPTION • Dual output 6+2 phase PWM Controller Easiest layout and fewest pins in the industry Fully supports AMD SVI1 & SVI2 with dual OCP and Intel® VR12 & VR12.5 Overclocking & Gaming Mode
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IR3567A
200kHz
CHL8515
IR3567A
CHL8505
ir3567
IR3567AM
IR3567AMTRPBF
programmable digital pwm I2C multiphase
AMD Voltage regulation design
PWM 3V 5V NOTEBOOK
smale
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Untitled
Abstract: No abstract text available
Text: IR3567A Dual Output Digital Multi-Phase Controller FEATURES DESCRIPTION • Dual output 6+2 phase PWM Controller Easiest layout and fewest pins in the industry Fully supports AMD SVI1 & SVI2 with dual OCP and Intel® VR12 & VR12.5 Overclocking & Gaming Mode
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IR3567A
200kHz
CHL8515
IR3567A
CHL8505
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TQFN 48 7X7
Abstract: QFN 5X5 tqfp 7x7 40 TQFN 5x5 LGA 4x5 bga 10x10 35x35 bga qfn 68 10x10 TQFP 14X20 qfn 8x8 reel
Text: TAPE AND REEL PACKAGING DEVICE TYPE BODY SIZE PIN COUNT TAPE WIDTH TAPE PITCH REEL SIZE QUANTITY PER REEL ORIENTATION IN TAPE SOIC .150 8 12mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 14 16mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 16 16mm 8mm 13 inch 2500 FIGURE 2
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10x10
25x25
10K/Reel
TQFN 48 7X7
QFN 5X5
tqfp 7x7
40 TQFN 5x5
LGA 4x5
bga 10x10
35x35 bga
qfn 68 10x10
TQFP 14X20
qfn 8x8 reel
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IR3567B
Abstract: No abstract text available
Text: Dual Output Digital Multi-Phase Controller FEATURES IR3567B DESCRIPTION • Dual output 6+2 phase PWM Controller The IR3567B is a dual-loop digital multi-phase buck controller designed for CPU voltage regulation and is fully compliant with AMD SVI1 & SVI2 and Intel
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IR3567B
IR3567B
200kHz
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wl1273
Abstract: nl5500 GPS5300 WL1273 datasheet TWL4030 bl6450 TI bl6450 ti nl5500 AIC3106 BQ27540
Text: Analog products for handsets Audio power amps Class-D TPA2010D1 TPA2012D2 TPA2013D1 TPA2016D2 TPA2035D1 TPA2050D4 TPA2100P1 TPS61050 TPS61052 TPS61054 2.5W, mono, 9 WCSP 2.1W, stereo, 16 WCSP 2.7W, mono, boost converter,16 WCSP 1.7W, stereo, AGC, 16 WCSP
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TPA2010D1
TPA2012D2
TPA2013D1
TPA2016D2
TPA2035D1
TPA2050D4
TPA2100P1
TPS61050
TPS61052
TPS61054
wl1273
nl5500
GPS5300
WL1273 datasheet
TWL4030
bl6450
TI bl6450
ti nl5500
AIC3106
BQ27540
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses
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IR3567B
Abstract: IR3567 intel VR12 IR3567BM AMD Voltage regulation design CHL8515 AMD SVI2 qfn 3 x 3 TRAY intel VR12.5 VR12.5
Text: FINAL Dual Output Digital Multi-Phase Controller FEATURES IR3567B DESCRIPTION • Dual output 6+2 phase PWM Controller The IR3567B is a dual-loop digital multi-phase buck controller designed for CPU voltage regulation and is fully compliant with AMD SVI1 & SVI2 and Intel
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IR3567B
200kHz
CHL8515
IR3567B
IR3567
intel VR12
IR3567BM
AMD Voltage regulation design
AMD SVI2
qfn 3 x 3 TRAY
intel VR12.5
VR12.5
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FTDI Devices T&R Dimensions
Abstract: FT232R LQFP Package tray SSOP-28 FTDI FT232RL
Text: Future Technology Devices International Ltd. Application Note AN_116 FTDI Devices T&R Dimensions Document Reference No.: FT_000154 Version 1.5 Issue Date: 2012-12-10 This document provides information on the tape and reel dimensions for FT232BL, FT245BL, FT232BQ,
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FT232BL,
FT245BL,
FT232BQ,
FT245BQ,
FT232RL,
FT245RL,
FT232RQ,
FT245RQ,
FT2232D,
FT2232HL,
FTDI Devices T&R Dimensions
FT232R
LQFP Package tray
SSOP-28 FTDI FT232RL
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