PV1051F Search Results

PV1051F Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
pv101 Abstract: PV76 PV221-8I PV510-8I Contextual Info: PV SERIES Piconics PV series has gold plated contact areas for bonding interconnecting leads. The bottom of the ceramic chip has a heavy gold plating for bonding the coil to a substrate. Please note that the PV series can be made with special substrate geometries	Original	M83446 M83446/17. PV160-8I PV250-8I PV510-8I PV760-8I PV101-8I MIL-STD-202, pv101 PV76 PV221-8I	PDF
srf 1714 Abstract: PV22-3 Contextual Info: El PV SERIES Piconics PV series has gold plated contact areas for bonding interconnecting leads. The bottom of the ceramic chip has a heavy gold plating for bonding the coil to a substrate. Please note that the PV series can be made with special substrate geometries for flip chip bonding. The core is slide tuned and may be fixed	OCR Scan	M83446 M83446/17. MIL-STD-202, srf 1714 PV22-3	PDF
Contextual Info: PV SERIES Piconics PV series has gold plated contact areas for bonding interconnecting leads. The bottom of the ceramic chip has a heavy gold plating for bonding the coil to a substrate. Please note that the PV series can be made with special substrate geometries for flip chip bonding. The core is slide tuned and may be fixed	OCR Scan	M83446 M83446/17. PV16arometric MIL-STD-202,	PDF
PV221-8I Contextual Info: Untitled Document Page 1 of 3 Tunables and Transformers PV Series Data Sheet Piconics PV Series has gold plated contact areas for bonding interconnecting leads. The bottom of the ceramic chip has a heavy gold plating for bonding the coil to a substrate. Please note that the PV series can be made with special substrate	Original	M83446 M83446/17. 20Division/TT PV1051F PV221-8I	PDF