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    Untitled

    Abstract: No abstract text available
    Text: PSC Vishay Electro-Films RF Spiral Inductor for Wire Bonded Assemblies FEATURES • Wire bond assembly • Small size: 45 mils x 45 mils x 10 mils • Low DCR, high Q • Low parasitic capacitance, high SRF APPLICATIONS • RF choking for DC biasing • RF tuning circuits


    Original
    PDF 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12

    Untitled

    Abstract: No abstract text available
    Text: PSC Vishay Electro-Films RF Spiral Inductor for Wire Bonded Assemblies FEATURES • Wire bond assembly • Small size: 45 mils x 45 mils x 10 mils • Low DCR, high Q • Low parasitic capacitance, high SRF APPLICATIONS • RF choking for DC biasing • RF tuning circuits


    Original
    PDF 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12

    Untitled

    Abstract: No abstract text available
    Text: PSC Vishay Electro-Films RF Spiral Inductor for Wire Bonded Assemblies FEATURES • Wire bond assembly • Small size: 45 mils x 45 mils x 10 mils • Low DCR, high Q • Low parasitic capacitance, high SRF APPLICATIONS • RF choking for DC biasing • RF tuning circuits


    Original
    PDF 11-Mar-11

    power inductor markings

    Abstract: No abstract text available
    Text: PSC Vishay Electro-Films RF Spiral Inductor for Wire Bonded Assemblies FEATURES • Wire bond assembly • Small size: 45 mils x 45 mils x 10 mils • Low DCR, high Q • Low parasitic capacitance, high SRF APPLICATIONS • RF choking for DC biasing • RF tuning circuits


    Original
    PDF 18-Jul-08 power inductor markings

    Untitled

    Abstract: No abstract text available
    Text: PSC www.vishay.com Vishay Electro-Films High Frequency RF Spiral Inductor for Wire Bonded Assemblies FEATURES • Wire bond assembly • Small size: 45 mils x 45 mils x 10 mils • Low DCR, high Q • Low parasitic capacitance, high SRF APPLICATIONS • RF choking for DC biasing


    Original
    PDF 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12

    RT 2070 L

    Abstract: ansi y14.5m-1982 decimal 2097b MS-001 72741
    Text: PACKAGE DIAGRAM OUTLINES PLASTIC DIP R E V ISIO N S DCN REV DESCRIPTION DATE 27853 06 REDRAW TO JEDEC FORMAT 03/15/95 APPROVED A A A — I— - E - - .0S0/.070 A I * 1 .01 0 I H lAdXBSX 1 1 - j- GlAUL HLANL It bad l-A -l SEATING PIANE


    OCR Scan
    PDF 27B53 P16-1 MS-010, 9S054 PSC-4034 RT 2070 L ansi y14.5m-1982 decimal 2097b MS-001 72741