olin 7025
Abstract: Tamac4 TAMAC-4 7025 alloy lead frame CDA 194 sn 8400 eftec eftec-64t C10B4 tamac
Text: CHAPTER 5 SELECTED PROPERTIES OF IC PACKAGE MATERIALS The following tables list typical values for selected properties of materials used in IC packages Table 5-1 Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Units
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pure tin recommended reflow profile
Abstract: J-STD-020B JESD22-A113-D 82602
Text: VISHAY Vishay Semiconductors Properties of Encapsulant When assembling IrDC transceivers on a printed circuit board PCB , it is useful to have an understanding of the properties of the materials used during manufacturing. While IrDC transceivers use semiconductor dice and
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31-Oct-03
pure tin recommended reflow profile
J-STD-020B
JESD22-A113-D
82602
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Material density CDA 195
Abstract: eutectic 157 CDA 194 olin 7025 Eftec 64t X10-4 resistivity table sn 8400 MF202 silver
Text: Physical Constants of IC Package Materials 5 Table 5-1 through Table 5-9 list typical values for selected properties of materials used in IC packages. Table 5-1. Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Alumina
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olin 7025
Abstract: 7025 alloy lead frame CDA 194 X10-4 eftec-64t Eftec 64t resistivity table sn 8400 PHYSICAL CONSTANTS OF IC PACKAGE MATERIALS
Text: Physical Constants of IC Package Materials 5 Table 5-1 through Table 5-3 list typical values for selected properties of materials used in IC packages. Table 5-1. Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Units
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olin 7025
Abstract: eftec MPA 68 Eftec 64t sn 8400 7025 alloy lead frame resistivity table eftec-64t tamac X10-4
Text: Physical Constants of IC Package Materials 5 Table 5-1 through Table 5-3 list typical values for selected properties of materials used in IC packages. Table 5-1. Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Alumina
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Plastic Valox 420 SEO
Abstract: No abstract text available
Text: DETAILED PROPERTIES OF MILL-MAX RAW MATERIALS including RoHS 2002/95/EC requirements PROPERTIES OF METALS USED BY MILL-MAX Copper alloy rod and wire for precision-machined pins, receptacles & solder terminals (Alloys C36000 & C54400 contain 3 to 4% lead to
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2002/95/EC
C36000
C54400
C36000)
C54400)
C14500)
C17200)
N03360)
avail/100Î
m/200Î
Plastic Valox 420 SEO
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Untitled
Abstract: No abstract text available
Text: DETAILED PROPERTIES OF MILL-MAX RAW MATERIALS including RoHS 2002/95/EC requirements PROPERTIES OF METALS USED BY MILL-MAX Copper alloy rod and wire for precision-machined pins, receptacles & solder terminals (Alloys C36000 & C54400 contain 3 to 4% lead to
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2002/95/EC
C36000
C54400
C36000)
C54400)
C14500)
C17200)
N03360)
avail/100Î
m/200Î
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Surface Mount Assembly Instruction
Abstract: surface
Text: Surface Mount Assembly Instruction Vishay Semiconductors Soldering Process When assembling IrDC transceivers on a printed circuit board PCB , it is useful to have an understanding of the properties of the materials used during manufacturing. While IrDC transceivers use semiconductor dice
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20-Sep-06
Surface Mount Assembly Instruction
surface
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Properties of used Materials
Abstract: No abstract text available
Text: Technical Annex Properties of used Materials Material Product Temperature Resistance Short-Term Constant Min. Temp. Temperature Range to Maintain IP Rating Flammability Rating acc. to DIN EN 60695 UL 94 VDE 0471 Polystyrene, flame resistant, impact resistant
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trans115
Properties of used Materials
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OC-106 94V0 C
Abstract: olin 7025 CDA 194 Tamac4 eftec 7025 alloy lead frame sn 8400 Au Sn eutectic thermal conductivity Eftec 64t
Text: 2 5 Physical Constants of IC Package Materials 1/16/97 3:41 PM CH05WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 5 PHYSICAL CONSTANTS OF IC PACKAGE MATERIALS The Table 5-1 through Table 5-5 list typical values for selected properties of materials used in
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CH05WIP
300oC
OC-106 94V0 C
olin 7025
CDA 194
Tamac4
eftec
7025 alloy lead frame
sn 8400
Au Sn eutectic
thermal conductivity
Eftec 64t
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5978008001
Abstract: 5978015901 5978014001 5978017501
Text: 15th Edition 106 Toroids A ring configuration provides the ultimate utilization of the intrinsic ferrite material properties. Toroidal cores are used in a wide variety of applications such as power input filters, ground-fault interrupters, common-mode filters
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AE 920 B
Abstract: 5961000211
Text: A ring configuration provides the ultimate utilization of the intrinsic ferrite material properties. Toroidal cores are used in a wide variety of applications such as power input filters, ground-fault interrupters, common-mode filters and in pulse and broadband transformers.
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Untitled
Abstract: No abstract text available
Text: Commercial Chip - C0G 16Vdc to 10kVdc A range of commercial MLC chip capacitors in Ultra stable EIA Class I C0G, or NP0, dielectric. C0G chips are used in precision circuitry requiring Class I stability and exhibit linear temperature coefficient, low loss and stable electrical properties with time,
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16Vdc
10kVdc
Silver-palladium400
RF0505
RF1111
RF2525
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12100
Abstract: NA 36 foam STM11
Text: Description: Desco’s conductive foam is a non-abrasive, open-cell closed cell in cross linked polyurethane foam compounded for permanent ESD Control Properties. The black conductive foam’s Rtt range of 10E3 to 10E6 allows it to be used with ESD susceptible products. Desco’s conductive foam is available in 3 designs:
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Abstract: No abstract text available
Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal
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0-320P
73-7-320A
173-7-330P
173-7-340P
173-7-350P
173-7-410P
173-7-510P
173-7-520P
173-7-610P
173-7-710P
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deltabond
Abstract: Wakefield 120-320 152-1B thermal conductivity 175-6-220-P
Text: WTS001_p50-68 6/14/07 10:46 AM Page 64 Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of
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WTS001
p50-68
173-7-220P
173-7-230P
173-7-240P
173-7-1212P
73-7-240A
173-9-210P
173-9-230P
173-9-240P
deltabond
Wakefield 120-320
152-1B
thermal conductivity
175-6-220-P
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Untitled
Abstract: No abstract text available
Text: WTS001_p50-68 6/14/07 10:46 AM Page 64 Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of
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WTS001
p50-68
175-6-210P
173-9-210P
173-7-220P
175-6-220P
173-7-230P
173-9-230P
175-6-230P
173-7-240P
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Wakefield 120-320
Abstract: No abstract text available
Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of
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173-7-220P
173-7-230P
173-7-240P
173-7-1212P
73-7-240A
173-9-210P
173-9-230P
173-9-240P
173-9-1212P
174-9-310P
Wakefield 120-320
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HIOKI 3119
Abstract: CSL-Z7302 EIA-383 JESD625-a ESD test plan JESD625 so20w CZE1000R jedec JESD625-a K6911
Text: Application Report SZZA027A - April 2002 Electrostatic Discharge ESD Protective Semiconductor Packing Materials and Configurations Cles Troxtell and James Huckabee Standard Linear & Logic ABSTRACT The Texas Instruments Standard Linear & Logic (SLL) Business Group uses an
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SZZA027A
HIOKI 3119
CSL-Z7302
EIA-383
JESD625-a
ESD test plan
JESD625
so20w
CZE1000R
jedec JESD625-a
K6911
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fujitsu polymer
Abstract: gibbs phase rule applications 928523 compaq portable II benzene octane
Text: MOPA C 2000 Next generation quantum mechanics package • Macromolecules: very fast, patented, linear-scaling MOZYME optimizes proteins, DNA… · Materials: d-orbitals, crystals, geometry in electric fields, NLO, 2D/3D periodic boundaries… · Polymers: band structures, phonon spectra, Young’s modulus, tensile strength…
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MPCB-DG-6/99
fujitsu polymer
gibbs phase rule applications
928523
compaq portable II
benzene octane
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MIL-S-23586D
Abstract: polysulphides high volume potting and encapsulation tv flyback potting silicone
Text: Issued March 1997 232-4112 Data Pack K Data Sheet Silicone rubber compound A range of silicone materials designed for use in electronic applications. Silicone dielectric gel RS stock no. 494-950 Applications The adhesive quality of silicone dielectric gel together
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compo02
MIL-S-23586D
polysulphides
high volume potting and encapsulation
tv flyback
potting silicone
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Untitled
Abstract: No abstract text available
Text: Microwave Absorbing Materials SOLUTIONS www.lairdtech.com Innovative Technology for a Connected World ABOUT LAIRD TECHNOLOGIES Laird Technologies designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.
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x band radar transmitters
Abstract: 6007 Graphite film material rfss INSERTS FOR COMPOSITE OR HONEYCOMB RFML 5301
Text: We practice environmental protection. MICROWAVE ABSORBING MATERIALS CAPABILITIES Microwave absorbers are increasingly being used to enhance shielding performance at higher frequencies. R&F Products, a division of Laird Technologies , offers a wide product range for the EMC design engineer.
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218GHz
all36
x band radar transmitters
6007 Graphite film material
rfss
INSERTS FOR COMPOSITE OR HONEYCOMB
RFML 5301
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Untitled
Abstract: No abstract text available
Text: VISHAY ▼ Vishay Telefunken Properties of Encapsutant When assembling IrDC transceivers, it is useful to have an understanding of the properties of the materials used in their consruction. It is often not realised that although IrDC transceivers use semiconductor chips there
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