POSTED CAS Search Results

CONDUCTIVE INK

Abstract: C17200
Contextual Info: MATERIAL DECLARATION SHEET Model # 3900 Pot/Rotary Switch Product Line Single turn panel control with switch Posted Date Compliance Date Q1 / 2005 RoHS Compliant Yes No. Construction element Material group Material weight [g] 1 Body PPS 0.48 Materials CAS

ELPIDA DDR3

Abstract: "DDR3 SDRAM" Elpida EDJ1108BBSE DDR3 DIMM elpida ELPIDA ELPIDA mobile DDR DDR3 DDR3 pins ddr3 tsop ddr3 datasheet
Contextual Info: DDR3 SDRAM Feature Comparison of DDR3, DDR2, and DDR SDRAM Items Data rate/pin CLK Freq. Power supply VDD/VDDQ Interface # of Banks Pre-fetch Burst Length Posted CAS, Additive Latency RL,WL ZQ pin /Reset pin DQ Driver impedance (Ron) DQ Driver calibration

744051

Contextual Info: MATERIAL DECLARATION SHEET Material # 6637S Product Line Precisions Posted Date Compliance Date Since Inception RoHS Compliant Yes No. Construction element Material group Material weight [g] 1 Contact Spring Palmet Alloy 0.00095 2 C-Ring Stainless Steel Alloy

steel alloy

Abstract: formaldehyde carbon ink
Contextual Info: MATERIAL DECLARATION SHEET Material # 6638S Product Line Precisions Posted Date Compliance Date Since Inception RoHS Compliant Yes No. Construction element Material group Material weight [g] 1 Hex Nut Stainless Steel Alloy 2 Lock Washer Stainless Steel Alloy

NORTEL Magellan

Abstract: cisco ds3 SALI-25C lucent internet telephony server 1997 FETEX-150 "network interface cards"
Contextual Info: Silicon Solutions Integrating Communications Worldwide communicator From the President O n July 17, TranSwitch Corporation announced financial results for the second quarter ending June 30, 1996. The Company posted record revenues see page 4 and reported

3315Y

Abstract: nicon 3315Y-L
Contextual Info: MATERIAL DECLARATION SHEET Material # 3315Y-L Product Line Encoders Posted Date Compliance Date Q4 / 2004 RoHS Compliant Yes No. Construction element Material group Material weight [g] 1 Copper Wire Copper Alloy 0.439 Materials Copper Diethyl Glyocol Monbutyl Ether

3545H

Abstract: 3545-H metal oxide grease TUNGSTEN ALLOY SHEET 744051
Contextual Info: MATERIAL DECLARATION SHEET Material # 3545H Product Line Precisions Posted Date Compliance Date Ref. 3548 RoHS Compliant No No. Construction element Material group Material weight [g] 1 Shaft Brass Alloy 9.1625 2 C-Ring Stainless Steel Alloy 0.009 3 Bushing

diot bridge

Abstract: transistor quang MPC105 MPC106 FB2B
Contextual Info: Copyright c Institute of Electrical and Electronics Engineers. Reprinted Freescale Semiconductor, Inc. with permission. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Motorola's

conductive plastic pot

Contextual Info: MATERIAL DECLARATION SHEET Model # 3900 Pot/ Push momentary Product Line Single turn panel control with switch Posted Date Compliance Date Q1 / 2005 RoHS Compliant Yes No. Construction element Material group Material weight [g] 1 Body PPS 0.48 2 Bushing Zinc Alloy

W3H128M72ER-XSBX

Abstract: M2 8gb pinout
Contextual Info: White Electronic Designs W3H128M72ER-XSBX PRELIMINARY* 128M x 72 REGISTERED DDR2 SDRAM 255 PBGA FEATURES „ Data rate = 667, 533, 400 Mb/s „ Posted CAS additive latency: 0, 1, 2, 3 or 4 „ Package: „ Write latency = Read latency - 1* tCK „ Commercial, Industrial and Military Temperature

Contextual Info: White Electronic Designs W3H32M72E-XSBX ADVANCED* 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm

744051

Abstract: "MATERIAL DECLARATION SHEET"
Contextual Info: MATERIAL DECLARATION SHEET Material # 6657S Product Line Precisions Posted Date Compliance Date Since Inception RoHS Compliant Yes No. Construction element Material group Material weight [g] 1 Housing Molded PBT 6.8 2 Bushing Steel Alloy 1.35 3 Hex Nut Brass Alloy

Contextual Info: Copyright c Institute of Electrical and Electronics Engineers. Reprinted Freescale Semiconductor, Inc. with permission. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Motorola's

W3H128M72ER-XSBX

Abstract: LDM-1 W3H128M72
Contextual Info: White Electronic Designs W3H128M72ER-XNBX PRELIMINARY* 128M x 72 REGISTERED DDR2 SDRAM 255 PBGA FEATURES  Data rate = 667, 533, 400 Mb/s  Posted CAS additive latency: 0, 1, 2, 3 or 4  Package:  Write latency = Read latency - 1* tCK  Commercial, Industrial and Military Temperature

Contextual Info: White Electronic Designs W3H64M72E-XSBX ADVANCED* 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 17 x 23mm

W3H32M72E

Abstract: fbga90
Contextual Info: White Electronic Designs W3H32M72E-XSBX ADVANCED* 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm

W3H32M72E-XSBX

Abstract: calibration definition
Contextual Info: White Electronic Designs W3H32M72E-XSBX PRELIMINARY* 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4, 5, or 6 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm

Contextual Info: White Electronic Designs W3H32M64E-XSBX ADVANCED* 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 20mm

IGCT

Abstract: IGCT thyristor ABB snubber IGCT IGCT 4.5kv IGCT thyristor IGCT thyristor ABB new ABB IGBT inverter PCIM 96 ABB thyristor modules symmetric IGCT
Contextual Info: Application Specific IGCTs Eric Carroll, Bjoern Oedegard, Thomas Stiasny, Marco Rossinelli ICPE, October 2001, Seoul, Korea Copyright [2001] IEEE. Reprinted from the International Conference on Power Electronics. This material is posted here with permission of the IEEE. Such permission of the

IS43DR86400B

Abstract: IS43DR86400B-25DBI IS43DR16320B Theta-J
Contextual Info: IS43/46DR86400B, IS43/46DR16320B AUGUST 2012 512Mb x8, x16 DDR2 SDRAM FEATURES • • • • • • • • • • • • • • • Clock frequency up to 400MHz Posted CAS Programmable CAS Latency: 3, 4, 5 and 6 Programmable Additive Latency: 0, 1, 2, 3, 4 and 5

80385

Abstract: pipeline architecture for 80386 82C385 intel 80386 pin diagram intel 80386 block diagram MARKING T174 bus ARCHITECTURE OF 80386 data bus, control bus intel 80386 bus architecture MDS-C385I 82335 intel
Contextual Info: 82C385 32kB 32-BIT CACHE CONTROLLER MATRA W B JULY 1989 FEATURES o Compatible with Intel 82335 32-bit Wrtte»thru scheme for updating main cache controller memory, Including posted write Highly integrated and optimized for 386 Bus snooping for maintaining coher

W3H64M72E-XSBX

Contextual Info: White Electronic Designs W3H64M72E-XSBX ADVANCED* 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 17 x 23mm

Contextual Info: 82434LX PCI, CACHE, AND MEMORY CONTROLLER PCMC • Supports the Full 64-Bit PentiumTM Processor at 60 MHz and 66 MHz ■ Supports Pipelined Addressing Capability of the Pentium Processor ■ High Performance CPU/PCI/Memory Interfaces Via Posted-Write/ReadPrefetch Buffers

Contextual Info: Catalog 889409 PRODUCTS FOR DESKTOP PCs Revised 6-98 Input/Output I/O Connectors (Continued) Subminiature 0 Connectors Straight Posted (AMPLIMITE) HD-22 Front Metal-Shell (Continued) Material: Part Numbers Shell Size No. of Pos. PH. Cade Plug With 4-40 Thd.